KR101752018B1 - 무보이드 서브마이크론 피쳐 충전을 위한 억제제를 포함하는 도금용 조성물 - Google Patents

무보이드 서브마이크론 피쳐 충전을 위한 억제제를 포함하는 도금용 조성물 Download PDF

Info

Publication number
KR101752018B1
KR101752018B1 KR1020127004870A KR20127004870A KR101752018B1 KR 101752018 B1 KR101752018 B1 KR 101752018B1 KR 1020127004870 A KR1020127004870 A KR 1020127004870A KR 20127004870 A KR20127004870 A KR 20127004870A KR 101752018 B1 KR101752018 B1 KR 101752018B1
Authority
KR
South Korea
Prior art keywords
polyhydric alcohol
composition
copper
oxide
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020127004870A
Other languages
English (en)
Korean (ko)
Other versions
KR20120051721A (ko
Inventor
코넬리아 뢰거-괴퍼트
로만 베네딕트 라에터
알렉산드라 하그
디터 마이어
샤를롯 엠넷
Original Assignee
바스프 에스이
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 바스프 에스이 filed Critical 바스프 에스이
Publication of KR20120051721A publication Critical patent/KR20120051721A/ko
Application granted granted Critical
Publication of KR101752018B1 publication Critical patent/KR101752018B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
    • H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/01—Manufacture or treatment
    • H10W20/031—Manufacture or treatment of conductive parts of the interconnections
    • H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Paints Or Removers (AREA)
KR1020127004870A 2009-07-30 2010-07-16 무보이드 서브마이크론 피쳐 충전을 위한 억제제를 포함하는 도금용 조성물 Active KR101752018B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US22980309P 2009-07-30 2009-07-30
US61/229,803 2009-07-30
PCT/EP2010/060276 WO2011012462A2 (en) 2009-07-30 2010-07-16 Composition for metal plating comprising suppressing agent for void free submicron feature filling

Publications (2)

Publication Number Publication Date
KR20120051721A KR20120051721A (ko) 2012-05-22
KR101752018B1 true KR101752018B1 (ko) 2017-06-28

Family

ID=43425023

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020127004870A Active KR101752018B1 (ko) 2009-07-30 2010-07-16 무보이드 서브마이크론 피쳐 충전을 위한 억제제를 포함하는 도금용 조성물

Country Status (11)

Country Link
US (1) US9869029B2 (https=)
EP (1) EP2459778B1 (https=)
JP (1) JP5714581B2 (https=)
KR (1) KR101752018B1 (https=)
CN (1) CN102597329B (https=)
IL (1) IL217536A (https=)
MY (1) MY157126A (https=)
RU (1) RU2539897C2 (https=)
SG (2) SG10201404394QA (https=)
TW (1) TWI487813B (https=)
WO (1) WO2011012462A2 (https=)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2539895C2 (ru) * 2009-07-30 2015-01-27 Басф Се Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов поверхности
US8790426B2 (en) 2010-04-27 2014-07-29 Basf Se Quaternized terpolymer
EP2655457B1 (en) 2010-12-21 2019-04-10 Basf Se Composition for metal electroplating comprising leveling agent
MY161354A (en) * 2011-02-22 2017-04-14 Basf Se Polymers on the basis of glycerol carbonate and an alcohol
JP6245988B2 (ja) * 2011-02-22 2017-12-13 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ グリセリンカーボネートに基づく重合体
CN103547631B (zh) 2011-06-01 2016-07-06 巴斯夫欧洲公司 包含用于自下向上填充硅穿孔和互联件特征的添加剂的金属电镀用组合物
EP2530102A1 (en) 2011-06-01 2012-12-05 Basf Se Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias
US20130133243A1 (en) 2011-06-28 2013-05-30 Basf Se Quaternized nitrogen compounds and use thereof as additives in fuels and lubricants
RU2015121797A (ru) 2012-11-09 2017-01-10 Басф Се Композиция для электролитического осаждения металла, содержащая выравнивающий агент
CN105142386B (zh) * 2013-03-13 2020-06-23 巴斯夫欧洲公司 有效增加土壤中水分保留的保湿剂组合物和及其鉴定
PL406197A1 (pl) * 2013-11-22 2015-05-25 Inphotech Spółka Z Ograniczoną Odpowiedzialnością Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi
SG11201604646TA (en) * 2013-12-09 2016-07-28 Aveni Copper electrodeposition bath containing an electrochemically inert cation
US9617648B2 (en) * 2015-03-04 2017-04-11 Lam Research Corporation Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias
KR102566586B1 (ko) * 2016-07-18 2023-08-16 바스프 에스이 보이드 없는 서브미크론 피쳐 충전을 위한 첨가제를 포함하는 코발트 도금용 조성물
US11926918B2 (en) 2016-12-20 2024-03-12 Basf Se Composition for metal plating comprising suppressing agent for void free filing
US11387108B2 (en) 2017-09-04 2022-07-12 Basf Se Composition for metal electroplating comprising leveling agent
EP3714085B1 (en) * 2017-11-20 2023-08-09 Basf Se Composition for cobalt electroplating comprising leveling agent
EP3775325B1 (en) 2018-03-29 2024-08-28 Basf Se Composition for tin-silver alloy electroplating comprising a complexing agent
US10529622B1 (en) 2018-07-10 2020-01-07 International Business Machines Corporation Void-free metallic interconnect structures with self-formed diffusion barrier layers
EP4034696A1 (en) 2019-09-27 2022-08-03 Basf Se Composition for copper bump electrodeposition comprising a leveling agent
CN114450438A (zh) 2019-09-27 2022-05-06 巴斯夫欧洲公司 用于铜凸块电沉积的包含流平剂的组合物
JP2023520530A (ja) 2020-04-03 2023-05-17 ビーエーエスエフ ソシエタス・ヨーロピア ポリアミノアミド型レベリング剤を含む銅バンプ電着用組成物
EP3922662A1 (en) 2020-06-10 2021-12-15 Basf Se Polyalkanolamine
US11384446B2 (en) 2020-08-28 2022-07-12 Macdermid Enthone Inc. Compositions and methods for the electrodeposition of nanotwinned copper
KR20240070557A (ko) 2021-10-01 2024-05-21 바스프 에스이 폴리아미노아미드 타입 레벨링제를 포함하는 구리 전착용 조성물
US20250388725A1 (en) 2022-07-07 2025-12-25 Basf Se Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition
WO2024132828A1 (en) 2022-12-19 2024-06-27 Basf Se A composition for copper nanotwin electrodeposition
US20250149380A1 (en) * 2023-11-02 2025-05-08 Taiwan Semiconductor Manufacturing Co., Ltd. Interconnect structure and method of forming same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050133376A1 (en) * 2003-12-19 2005-06-23 Opaskar Vincent C. Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom
US20060213780A1 (en) 2005-03-24 2006-09-28 Taiwan Semiconductor Manufacturing Co., Ltd. Electroplating composition and method

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2441555A (en) 1943-10-12 1948-05-18 Heyden Chemical Corp Mixed esters of polyhydric alcohols
GB602591A (en) 1945-02-12 1948-05-31 Du Pont Improvements in or relating to the electro-deposition of metals
US3956079A (en) * 1972-12-14 1976-05-11 M & T Chemicals Inc. Electrodeposition of copper
US4505839A (en) 1981-05-18 1985-03-19 Petrolite Corporation Polyalkanolamines
US4376685A (en) * 1981-06-24 1983-03-15 M&T Chemicals Inc. Acid copper electroplating baths containing brightening and leveling additives
SU1055781A1 (ru) * 1982-03-22 1983-11-23 Ленинградский ордена Трудового Красного Знамени технологический институт целлюлозно-бумажной промышленности Водный электролит блест щего меднени
US4487853A (en) * 1983-12-27 1984-12-11 Basf Wyandotte Corporation Low ethylene oxide/high primary hydroxyl content polyether-ester polyols and polyurethane foams based thereon
JPS62182295A (ja) * 1985-08-07 1987-08-10 Daiwa Tokushu Kk 銅メツキ浴組成物
DE4003243A1 (de) 1990-02-03 1991-08-08 Basf Ag Verwendung von trialkanolaminpolyethern als demulgatoren von oel-in-wasser-emulsionen
US5888373A (en) * 1997-06-23 1999-03-30 Industrial Technology Research Institute Method for repairing nickel-zinc-copper or nickel-zinc alloy electroplating solutions from acidic waste solutions containing nickel and zinc ions and electroplating thereof
DE10033433A1 (de) * 2000-07-10 2002-01-24 Basf Ag Verfahren zur elektrolytischen Verzinkung aus alkansulfonsäurehaltigen Elektrolyten
US6682642B2 (en) 2000-10-13 2004-01-27 Shipley Company, L.L.C. Seed repair and electroplating bath
US20020074242A1 (en) * 2000-10-13 2002-06-20 Shipley Company, L.L.C. Seed layer recovery
BR0114600B1 (pt) * 2000-10-19 2011-04-05 banho de revestimento eletrolìtico de cobre e processo de eletroposição de uma camada fosca de cobre.
US6776893B1 (en) 2000-11-20 2004-08-17 Enthone Inc. Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect
DE10107880B4 (de) 2001-02-20 2007-12-06 Clariant Produkte (Deutschland) Gmbh Alkoxylierte Polyglycerine und ihre Verwendung als Emulsionsspalter
EP1422320A1 (en) 2002-11-21 2004-05-26 Shipley Company, L.L.C. Copper electroplating bath
DE10325198B4 (de) 2003-06-04 2007-10-25 Clariant Produkte (Deutschland) Gmbh Verwendung von alkoxylierten vernetzten Polyglycerinen als biologisch abbaubare Emulsionsspalter
EP1819848A1 (en) 2004-11-29 2007-08-22 Technic, Incorporated Near neutral ph tin electroplating solution
RU2282682C1 (ru) * 2005-04-28 2006-08-27 Российский химико-технологический университет им. Д.И. Менделеева Электролит и способ меднения
MY142392A (en) 2005-10-26 2010-11-30 Malaysian Palm Oil Board A process for preparing polymers of polyhydric alcohols
US20070178697A1 (en) * 2006-02-02 2007-08-02 Enthone Inc. Copper electrodeposition in microelectronics
RU2385366C1 (ru) * 2008-12-15 2010-03-27 Федеральное государственное образовательное учреждение высшего профессионального образования Российский государственный университет им. Иммануила Канта Электролит меднения стальных подложек
RU2529607C2 (ru) 2009-04-07 2014-09-27 Басф Се Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов
WO2010115796A1 (en) 2009-04-07 2010-10-14 Basf Se Composition for metal plating comprising suppressing agent for void free submicron feature filling
CN104195602B (zh) 2009-04-07 2017-05-31 巴斯夫欧洲公司 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050133376A1 (en) * 2003-12-19 2005-06-23 Opaskar Vincent C. Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom
US20060213780A1 (en) 2005-03-24 2006-09-28 Taiwan Semiconductor Manufacturing Co., Ltd. Electroplating composition and method

Also Published As

Publication number Publication date
WO2011012462A2 (en) 2011-02-03
SG177685A1 (en) 2012-02-28
US20120128888A1 (en) 2012-05-24
SG10201404394QA (en) 2014-10-30
KR20120051721A (ko) 2012-05-22
IL217536A0 (en) 2012-02-29
US9869029B2 (en) 2018-01-16
JP2013500394A (ja) 2013-01-07
TW201109477A (en) 2011-03-16
JP5714581B2 (ja) 2015-05-07
EP2459778B1 (en) 2015-01-14
EP2459778A2 (en) 2012-06-06
CN102597329A (zh) 2012-07-18
WO2011012462A3 (en) 2012-01-19
RU2012107133A (ru) 2013-09-10
MY157126A (en) 2016-05-13
CN102597329B (zh) 2015-12-16
IL217536A (en) 2016-05-31
RU2539897C2 (ru) 2015-01-27
TWI487813B (zh) 2015-06-11

Similar Documents

Publication Publication Date Title
KR101752018B1 (ko) 무보이드 서브마이크론 피쳐 충전을 위한 억제제를 포함하는 도금용 조성물
KR101738701B1 (ko) 평활제를 포함하는, 금속 전기 도금용 조성물
KR101759352B1 (ko) 무보이드 서브마이크론 피쳐 충전을 위한 억제제를 포함하는 도금용 조성물
TWI489012B (zh) 包含供無空隙次微米結構特徵填充之抑制劑的金屬電鍍用組合物
TWI515341B (zh) 包含供無空隙次微米結構特徵填充之抑制劑的金屬電鍍用組合物
TWI489011B (zh) 包含供無空隙次微米結構特徵填充之抑制劑的金屬電鍍用組合物
TWI513862B (zh) 包含整平劑之金屬電鍍用組合物
WO2010115757A1 (en) Composition for metal plating comprising suppressing agent for void free submicron feature filling

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000