MY157126A - Composition for metal plating comprising suppressing agent for void free submicron feature filling - Google Patents
Composition for metal plating comprising suppressing agent for void free submicron feature fillingInfo
- Publication number
- MY157126A MY157126A MYPI2012000302A MYPI2012000302A MY157126A MY 157126 A MY157126 A MY 157126A MY PI2012000302 A MYPI2012000302 A MY PI2012000302A MY PI2012000302 A MYPI2012000302 A MY PI2012000302A MY 157126 A MY157126 A MY 157126A
- Authority
- MY
- Malaysia
- Prior art keywords
- composition
- metal plating
- suppressing agent
- void free
- feature filling
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
- H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
- H10P14/46—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials using a liquid
- H10P14/47—Electrolytic deposition, i.e. electroplating; Electroless plating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating And Plating Baths Therefor (AREA)
- Paints Or Removers (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US22980309P | 2009-07-30 | 2009-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| MY157126A true MY157126A (en) | 2016-05-13 |
Family
ID=43425023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MYPI2012000302A MY157126A (en) | 2009-07-30 | 2010-07-16 | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
Country Status (11)
| Country | Link |
|---|---|
| US (1) | US9869029B2 (https=) |
| EP (1) | EP2459778B1 (https=) |
| JP (1) | JP5714581B2 (https=) |
| KR (1) | KR101752018B1 (https=) |
| CN (1) | CN102597329B (https=) |
| IL (1) | IL217536A (https=) |
| MY (1) | MY157126A (https=) |
| RU (1) | RU2539897C2 (https=) |
| SG (2) | SG10201404394QA (https=) |
| TW (1) | TWI487813B (https=) |
| WO (1) | WO2011012462A2 (https=) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2539895C2 (ru) * | 2009-07-30 | 2015-01-27 | Басф Се | Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов поверхности |
| US8790426B2 (en) | 2010-04-27 | 2014-07-29 | Basf Se | Quaternized terpolymer |
| EP2655457B1 (en) | 2010-12-21 | 2019-04-10 | Basf Se | Composition for metal electroplating comprising leveling agent |
| MY161354A (en) * | 2011-02-22 | 2017-04-14 | Basf Se | Polymers on the basis of glycerol carbonate and an alcohol |
| JP6245988B2 (ja) * | 2011-02-22 | 2017-12-13 | ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ | グリセリンカーボネートに基づく重合体 |
| CN103547631B (zh) | 2011-06-01 | 2016-07-06 | 巴斯夫欧洲公司 | 包含用于自下向上填充硅穿孔和互联件特征的添加剂的金属电镀用组合物 |
| EP2530102A1 (en) | 2011-06-01 | 2012-12-05 | Basf Se | Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias |
| US20130133243A1 (en) | 2011-06-28 | 2013-05-30 | Basf Se | Quaternized nitrogen compounds and use thereof as additives in fuels and lubricants |
| RU2015121797A (ru) | 2012-11-09 | 2017-01-10 | Басф Се | Композиция для электролитического осаждения металла, содержащая выравнивающий агент |
| CN105142386B (zh) * | 2013-03-13 | 2020-06-23 | 巴斯夫欧洲公司 | 有效增加土壤中水分保留的保湿剂组合物和及其鉴定 |
| PL406197A1 (pl) * | 2013-11-22 | 2015-05-25 | Inphotech Spółka Z Ograniczoną Odpowiedzialnością | Sposób łączenia włókien światłowodowych pokrytych warstwą przewodzącą z elementami metalowymi |
| SG11201604646TA (en) * | 2013-12-09 | 2016-07-28 | Aveni | Copper electrodeposition bath containing an electrochemically inert cation |
| US9617648B2 (en) * | 2015-03-04 | 2017-04-11 | Lam Research Corporation | Pretreatment of nickel and cobalt liners for electrodeposition of copper into through silicon vias |
| KR102566586B1 (ko) * | 2016-07-18 | 2023-08-16 | 바스프 에스이 | 보이드 없는 서브미크론 피쳐 충전을 위한 첨가제를 포함하는 코발트 도금용 조성물 |
| US11926918B2 (en) | 2016-12-20 | 2024-03-12 | Basf Se | Composition for metal plating comprising suppressing agent for void free filing |
| US11387108B2 (en) | 2017-09-04 | 2022-07-12 | Basf Se | Composition for metal electroplating comprising leveling agent |
| EP3714085B1 (en) * | 2017-11-20 | 2023-08-09 | Basf Se | Composition for cobalt electroplating comprising leveling agent |
| EP3775325B1 (en) | 2018-03-29 | 2024-08-28 | Basf Se | Composition for tin-silver alloy electroplating comprising a complexing agent |
| US10529622B1 (en) | 2018-07-10 | 2020-01-07 | International Business Machines Corporation | Void-free metallic interconnect structures with self-formed diffusion barrier layers |
| EP4034696A1 (en) | 2019-09-27 | 2022-08-03 | Basf Se | Composition for copper bump electrodeposition comprising a leveling agent |
| CN114450438A (zh) | 2019-09-27 | 2022-05-06 | 巴斯夫欧洲公司 | 用于铜凸块电沉积的包含流平剂的组合物 |
| JP2023520530A (ja) | 2020-04-03 | 2023-05-17 | ビーエーエスエフ ソシエタス・ヨーロピア | ポリアミノアミド型レベリング剤を含む銅バンプ電着用組成物 |
| EP3922662A1 (en) | 2020-06-10 | 2021-12-15 | Basf Se | Polyalkanolamine |
| US11384446B2 (en) | 2020-08-28 | 2022-07-12 | Macdermid Enthone Inc. | Compositions and methods for the electrodeposition of nanotwinned copper |
| KR20240070557A (ko) | 2021-10-01 | 2024-05-21 | 바스프 에스이 | 폴리아미노아미드 타입 레벨링제를 포함하는 구리 전착용 조성물 |
| US20250388725A1 (en) | 2022-07-07 | 2025-12-25 | Basf Se | Use of a composition comprising a polyaminoamide type compound for copper nanotwin electrodeposition |
| WO2024132828A1 (en) | 2022-12-19 | 2024-06-27 | Basf Se | A composition for copper nanotwin electrodeposition |
| US20250149380A1 (en) * | 2023-11-02 | 2025-05-08 | Taiwan Semiconductor Manufacturing Co., Ltd. | Interconnect structure and method of forming same |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2441555A (en) | 1943-10-12 | 1948-05-18 | Heyden Chemical Corp | Mixed esters of polyhydric alcohols |
| GB602591A (en) | 1945-02-12 | 1948-05-31 | Du Pont | Improvements in or relating to the electro-deposition of metals |
| US3956079A (en) * | 1972-12-14 | 1976-05-11 | M & T Chemicals Inc. | Electrodeposition of copper |
| US4505839A (en) | 1981-05-18 | 1985-03-19 | Petrolite Corporation | Polyalkanolamines |
| US4376685A (en) * | 1981-06-24 | 1983-03-15 | M&T Chemicals Inc. | Acid copper electroplating baths containing brightening and leveling additives |
| SU1055781A1 (ru) * | 1982-03-22 | 1983-11-23 | Ленинградский ордена Трудового Красного Знамени технологический институт целлюлозно-бумажной промышленности | Водный электролит блест щего меднени |
| US4487853A (en) * | 1983-12-27 | 1984-12-11 | Basf Wyandotte Corporation | Low ethylene oxide/high primary hydroxyl content polyether-ester polyols and polyurethane foams based thereon |
| JPS62182295A (ja) * | 1985-08-07 | 1987-08-10 | Daiwa Tokushu Kk | 銅メツキ浴組成物 |
| DE4003243A1 (de) | 1990-02-03 | 1991-08-08 | Basf Ag | Verwendung von trialkanolaminpolyethern als demulgatoren von oel-in-wasser-emulsionen |
| US5888373A (en) * | 1997-06-23 | 1999-03-30 | Industrial Technology Research Institute | Method for repairing nickel-zinc-copper or nickel-zinc alloy electroplating solutions from acidic waste solutions containing nickel and zinc ions and electroplating thereof |
| DE10033433A1 (de) * | 2000-07-10 | 2002-01-24 | Basf Ag | Verfahren zur elektrolytischen Verzinkung aus alkansulfonsäurehaltigen Elektrolyten |
| US6682642B2 (en) | 2000-10-13 | 2004-01-27 | Shipley Company, L.L.C. | Seed repair and electroplating bath |
| US20020074242A1 (en) * | 2000-10-13 | 2002-06-20 | Shipley Company, L.L.C. | Seed layer recovery |
| BR0114600B1 (pt) * | 2000-10-19 | 2011-04-05 | banho de revestimento eletrolìtico de cobre e processo de eletroposição de uma camada fosca de cobre. | |
| US6776893B1 (en) | 2000-11-20 | 2004-08-17 | Enthone Inc. | Electroplating chemistry for the CU filling of submicron features of VLSI/ULSI interconnect |
| DE10107880B4 (de) | 2001-02-20 | 2007-12-06 | Clariant Produkte (Deutschland) Gmbh | Alkoxylierte Polyglycerine und ihre Verwendung als Emulsionsspalter |
| EP1422320A1 (en) | 2002-11-21 | 2004-05-26 | Shipley Company, L.L.C. | Copper electroplating bath |
| DE10325198B4 (de) | 2003-06-04 | 2007-10-25 | Clariant Produkte (Deutschland) Gmbh | Verwendung von alkoxylierten vernetzten Polyglycerinen als biologisch abbaubare Emulsionsspalter |
| US20050133376A1 (en) * | 2003-12-19 | 2005-06-23 | Opaskar Vincent C. | Alkaline zinc-nickel alloy plating compositions, processes and articles therefrom |
| EP1819848A1 (en) | 2004-11-29 | 2007-08-22 | Technic, Incorporated | Near neutral ph tin electroplating solution |
| US20060213780A1 (en) | 2005-03-24 | 2006-09-28 | Taiwan Semiconductor Manufacturing Co., Ltd. | Electroplating composition and method |
| RU2282682C1 (ru) * | 2005-04-28 | 2006-08-27 | Российский химико-технологический университет им. Д.И. Менделеева | Электролит и способ меднения |
| MY142392A (en) | 2005-10-26 | 2010-11-30 | Malaysian Palm Oil Board | A process for preparing polymers of polyhydric alcohols |
| US20070178697A1 (en) * | 2006-02-02 | 2007-08-02 | Enthone Inc. | Copper electrodeposition in microelectronics |
| RU2385366C1 (ru) * | 2008-12-15 | 2010-03-27 | Федеральное государственное образовательное учреждение высшего профессионального образования Российский государственный университет им. Иммануила Канта | Электролит меднения стальных подложек |
| RU2529607C2 (ru) | 2009-04-07 | 2014-09-27 | Басф Се | Композиция для нанесения металлического покрытия, содержащая подавляющий агент, для беспустотного заполнения субмикронных элементов |
| WO2010115796A1 (en) | 2009-04-07 | 2010-10-14 | Basf Se | Composition for metal plating comprising suppressing agent for void free submicron feature filling |
| CN104195602B (zh) | 2009-04-07 | 2017-05-31 | 巴斯夫欧洲公司 | 包含抑制剂的无空隙亚微米结构填充用金属电镀组合物 |
-
2010
- 2010-07-16 SG SG10201404394QA patent/SG10201404394QA/en unknown
- 2010-07-16 US US13/387,776 patent/US9869029B2/en active Active
- 2010-07-16 SG SG2012003315A patent/SG177685A1/en unknown
- 2010-07-16 RU RU2012107133/02A patent/RU2539897C2/ru not_active IP Right Cessation
- 2010-07-16 MY MYPI2012000302A patent/MY157126A/en unknown
- 2010-07-16 CN CN201080033647.4A patent/CN102597329B/zh active Active
- 2010-07-16 JP JP2012522093A patent/JP5714581B2/ja active Active
- 2010-07-16 WO PCT/EP2010/060276 patent/WO2011012462A2/en not_active Ceased
- 2010-07-16 KR KR1020127004870A patent/KR101752018B1/ko active Active
- 2010-07-16 EP EP10731757.0A patent/EP2459778B1/en active Active
- 2010-07-30 TW TW099125535A patent/TWI487813B/zh active
-
2012
- 2012-01-15 IL IL217536A patent/IL217536A/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| WO2011012462A2 (en) | 2011-02-03 |
| SG177685A1 (en) | 2012-02-28 |
| US20120128888A1 (en) | 2012-05-24 |
| KR101752018B1 (ko) | 2017-06-28 |
| SG10201404394QA (en) | 2014-10-30 |
| KR20120051721A (ko) | 2012-05-22 |
| IL217536A0 (en) | 2012-02-29 |
| US9869029B2 (en) | 2018-01-16 |
| JP2013500394A (ja) | 2013-01-07 |
| TW201109477A (en) | 2011-03-16 |
| JP5714581B2 (ja) | 2015-05-07 |
| EP2459778B1 (en) | 2015-01-14 |
| EP2459778A2 (en) | 2012-06-06 |
| CN102597329A (zh) | 2012-07-18 |
| WO2011012462A3 (en) | 2012-01-19 |
| RU2012107133A (ru) | 2013-09-10 |
| CN102597329B (zh) | 2015-12-16 |
| IL217536A (en) | 2016-05-31 |
| RU2539897C2 (ru) | 2015-01-27 |
| TWI487813B (zh) | 2015-06-11 |
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