KR101722089B1 - 경화성 오가노폴리실록산 조성물 및 광반도체 장치 - Google Patents

경화성 오가노폴리실록산 조성물 및 광반도체 장치 Download PDF

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KR101722089B1
KR101722089B1 KR1020127032664A KR20127032664A KR101722089B1 KR 101722089 B1 KR101722089 B1 KR 101722089B1 KR 1020127032664 A KR1020127032664 A KR 1020127032664A KR 20127032664 A KR20127032664 A KR 20127032664A KR 101722089 B1 KR101722089 B1 KR 101722089B1
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KR20130112712A (ko
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마코토 요시타케
미에코 야마카와
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다우 코닝 도레이 캄파니 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxy groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
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KR1020127032664A 2010-06-29 2011-06-28 경화성 오가노폴리실록산 조성물 및 광반도체 장치 Active KR101722089B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010147690A JP5534977B2 (ja) 2010-06-29 2010-06-29 硬化性オルガノポリシロキサン組成物および光半導体装置
JPJP-P-2010-147690 2010-06-29
PCT/JP2011/065247 WO2012002560A1 (en) 2010-06-29 2011-06-28 Curable organopolysiloxane composition and optical semiconductor device

Publications (2)

Publication Number Publication Date
KR20130112712A KR20130112712A (ko) 2013-10-14
KR101722089B1 true KR101722089B1 (ko) 2017-03-31

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US (1) US8772812B2 (cg-RX-API-DMAC10.html)
EP (1) EP2588538B1 (cg-RX-API-DMAC10.html)
JP (1) JP5534977B2 (cg-RX-API-DMAC10.html)
KR (1) KR101722089B1 (cg-RX-API-DMAC10.html)
CN (1) CN103003364B (cg-RX-API-DMAC10.html)
TW (1) TWI512044B (cg-RX-API-DMAC10.html)
WO (1) WO2012002560A1 (cg-RX-API-DMAC10.html)

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JP5680889B2 (ja) 2010-06-29 2015-03-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および光半導体装置
JP5693063B2 (ja) * 2010-07-01 2015-04-01 積水化学工業株式会社 光半導体装置用封止剤及びそれを用いた光半導体装置
JP5817377B2 (ja) * 2011-09-20 2015-11-18 住友ベークライト株式会社 シリコーンゴム系硬化性組成物、シリコーンゴムの製造方法、シリコーンゴム、成形体および医療用チューブ
JP6057503B2 (ja) * 2011-09-21 2017-01-11 東レ・ダウコーニング株式会社 光半導体素子封止用硬化性シリコーン組成物、樹脂封止光半導体素子の製造方法、および樹脂封止光半導体素子
JP5706357B2 (ja) * 2012-02-24 2015-04-22 富士フイルム株式会社 基板モジュールおよびその製造方法
JP6047769B2 (ja) * 2012-06-01 2016-12-21 シチズン時計株式会社 照明装置
WO2014050318A1 (ja) * 2012-09-27 2014-04-03 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 光半導体素子封止用シリコーン組成物および光半導体装置
JP6081774B2 (ja) * 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
EP2918638B1 (en) * 2012-11-09 2017-09-06 Sumitomo Seika Chemicals Co. Ltd. Silicone resin composition, cured silicone resin, and sealed optical semiconductor element
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
CA2911523C (en) 2013-05-10 2018-10-02 Abl Ip Holding Llc Silicone optics
JP6467125B2 (ja) * 2013-06-27 2019-02-06 株式会社カネカ 硬化性樹脂組成物、該組成物を硬化させてなる硬化物
JP5716139B1 (ja) * 2013-08-19 2015-05-13 住友精化株式会社 付加硬化型シリコーン樹脂組成物、付加硬化型シリコーン樹脂硬化物、及び、光半導体素子封止体
CN105555873B (zh) * 2013-08-20 2018-09-14 住友精化株式会社 缩合固化型有机硅树脂组合物、缩合固化型有机硅树脂固化物和光半导体元件密封体
WO2015083446A1 (ja) * 2013-12-06 2015-06-11 住友精化株式会社 付加硬化型シリコーン樹脂組成物、付加硬化型シリコーン樹脂硬化物、及び、光半導体素子封止体
JP6258048B2 (ja) * 2014-01-28 2018-01-10 信越化学工業株式会社 有機変性シリコーン樹脂組成物
WO2015129140A1 (ja) * 2014-02-28 2015-09-03 住友精化株式会社 付加硬化型シリコーン樹脂組成物、付加硬化型シリコーン樹脂硬化物、及び、光半導体素子封止体
TWI506058B (zh) * 2014-03-18 2015-11-01 Benq Materials Corp 可固化矽樹脂組成物
CN106715591A (zh) * 2014-06-03 2017-05-24 道康宁东丽株式会社 可固化有机硅组合物及光半导体装置
JP6592438B2 (ja) * 2014-07-30 2019-10-16 住友精化株式会社 シリコーン樹脂組成物、シリコーン樹脂硬化物、及び、光半導体素子封止体
EP3133105B1 (en) 2015-07-31 2020-12-09 Shin-Etsu Chemical Co., Ltd. Hydrosilyl-containing organopolysiloxane, making method, addition curable silicone composition, and semiconductor package
US10461232B2 (en) 2016-01-15 2019-10-29 Citizen Watch Co., Ltd. Condensation reaction-type die bonding agent, LED light emitting device and method for manufacturing same
JP6776954B2 (ja) * 2016-04-15 2020-10-28 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物
JP6702224B2 (ja) 2017-02-17 2020-05-27 信越化学工業株式会社 付加硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材
CN110382625B (zh) 2017-02-27 2022-02-18 杜邦东丽特殊材料株式会社 可固化的有机聚硅氧烷组合物和半导体器件
TWI762649B (zh) 2017-06-26 2022-05-01 日商杜邦東麗特殊材料股份有限公司 黏晶用固化性矽組合物
TWI791554B (zh) * 2017-07-31 2023-02-11 美商陶氏有機矽公司 可固化有機聚矽氧烷組成物及光學半導體裝置
CN109749461A (zh) * 2018-12-30 2019-05-14 苏州桐力光电股份有限公司 一种光学透明硅树脂
JP7562201B2 (ja) * 2019-07-30 2024-10-07 デュポン・東レ・スペシャルティ・マテリアル株式会社 ホットメルト性硬化性シリコーン組成物、封止剤、フィルム、光半導体素子
JP7094926B2 (ja) 2019-09-02 2022-07-04 信越化学工業株式会社 熱硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材
CA3160506A1 (en) 2019-11-11 2021-05-20 Ibi-Ag Innovative Bio Insecticides Ltd. Insect control nanobodies and uses thereof
CN116134093B (zh) 2020-06-30 2024-12-27 陶氏东丽株式会社 固化性有机硅组合物及其固化物
TWI898121B (zh) * 2021-03-23 2025-09-21 日商陶氏東麗股份有限公司 有機聚矽氧烷組成物

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US6124407A (en) 1998-10-28 2000-09-26 Dow Corning Corporation Silicone composition, method for the preparation thereof, and silicone elastomer
WO2009017251A1 (en) 2007-07-31 2009-02-05 Dow Corning Toray Co., Ltd. Curable silicone composition
US20090118441A1 (en) 2005-11-09 2009-05-07 Shinichi Yamamoto Curable Silicone Composition

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JP5680889B2 (ja) 2010-06-29 2015-03-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および光半導体装置

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Publication number Priority date Publication date Assignee Title
US6124407A (en) 1998-10-28 2000-09-26 Dow Corning Corporation Silicone composition, method for the preparation thereof, and silicone elastomer
US20090118441A1 (en) 2005-11-09 2009-05-07 Shinichi Yamamoto Curable Silicone Composition
WO2009017251A1 (en) 2007-07-31 2009-02-05 Dow Corning Toray Co., Ltd. Curable silicone composition

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US20130134609A1 (en) 2013-05-30
KR20130112712A (ko) 2013-10-14
WO2012002560A1 (en) 2012-01-05
US8772812B2 (en) 2014-07-08
CN103003364B (zh) 2014-10-08
TW201213443A (en) 2012-04-01
JP2012012434A (ja) 2012-01-19
EP2588538B1 (en) 2014-04-30
TWI512044B (zh) 2015-12-11
JP5534977B2 (ja) 2014-07-02
CN103003364A (zh) 2013-03-27
EP2588538A1 (en) 2013-05-08

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