KR101717782B1 - 프라이머 조성물 및 그것을 이용한 광 반도체 장치 - Google Patents

프라이머 조성물 및 그것을 이용한 광 반도체 장치 Download PDF

Info

Publication number
KR101717782B1
KR101717782B1 KR1020100005881A KR20100005881A KR101717782B1 KR 101717782 B1 KR101717782 B1 KR 101717782B1 KR 1020100005881 A KR1020100005881 A KR 1020100005881A KR 20100005881 A KR20100005881 A KR 20100005881A KR 101717782 B1 KR101717782 B1 KR 101717782B1
Authority
KR
South Korea
Prior art keywords
optical semiconductor
composition
primer composition
substrate
semiconductor element
Prior art date
Application number
KR1020100005881A
Other languages
English (en)
Korean (ko)
Other versions
KR20100086955A (ko
Inventor
도시유끼 오자이
Original Assignee
신에쓰 가가꾸 고교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신에쓰 가가꾸 고교 가부시끼가이샤 filed Critical 신에쓰 가가꾸 고교 가부시끼가이샤
Publication of KR20100086955A publication Critical patent/KR20100086955A/ko
Application granted granted Critical
Publication of KR101717782B1 publication Critical patent/KR101717782B1/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Led Device Packages (AREA)
  • Paints Or Removers (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020100005881A 2009-01-23 2010-01-22 프라이머 조성물 및 그것을 이용한 광 반도체 장치 KR101717782B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2009-013616 2009-01-23
JP2009013616A JP4870176B2 (ja) 2009-01-23 2009-01-23 プライマー組成物およびそれを用いた光半導体装置

Publications (2)

Publication Number Publication Date
KR20100086955A KR20100086955A (ko) 2010-08-02
KR101717782B1 true KR101717782B1 (ko) 2017-03-17

Family

ID=42585557

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020100005881A KR101717782B1 (ko) 2009-01-23 2010-01-22 프라이머 조성물 및 그것을 이용한 광 반도체 장치

Country Status (4)

Country Link
JP (1) JP4870176B2 (ja)
KR (1) KR101717782B1 (ja)
CN (1) CN101792632B (ja)
TW (1) TWI454540B (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170016433A (ko) * 2014-06-06 2017-02-13 신에쓰 가가꾸 고교 가부시끼가이샤 프라이머 조성물
KR20190129001A (ko) * 2018-05-09 2019-11-19 신에쓰 가가꾸 고교 가부시끼가이샤 프라이머 조성물 및 이것을 사용한 광반도체 장치
KR20210060505A (ko) * 2018-09-11 2021-05-26 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 수지와 폴리올레핀계 수지의 접착용 프라이머 조성물, 및 실리콘 수지와 폴리올레핀계 수지의 접착 방법

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10008637B2 (en) 2011-12-06 2018-06-26 Cree, Inc. Light emitter devices and methods with reduced dimensions and improved light output
JP5541171B2 (ja) * 2011-01-13 2014-07-09 信越化学工業株式会社 プライマー組成物及び該組成物を用いた光半導体装置
JP5719613B2 (ja) * 2011-01-27 2015-05-20 セイコーインスツル株式会社 光デバイス、発光デバイス、及び傾斜機能材の製造方法
CN103782402B (zh) 2011-07-21 2017-12-01 克利公司 用于改进的化学抗性的发光体器件封装、部件和方法、以及相关方法
US10211380B2 (en) 2011-07-21 2019-02-19 Cree, Inc. Light emitting devices and components having improved chemical resistance and related methods
US10686107B2 (en) 2011-07-21 2020-06-16 Cree, Inc. Light emitter devices and components with improved chemical resistance and related methods
KR101905543B1 (ko) 2011-11-17 2018-10-10 엘지이노텍 주식회사 발광소자 패키지
EP2786429A4 (en) * 2011-12-01 2015-07-29 Cree Inc LIGHT EMITTING DEVICES AND COMPONENTS HAVING ENHANCED CHEMICAL RESISTANCE AND RELATED METHODS
US9496466B2 (en) 2011-12-06 2016-11-15 Cree, Inc. Light emitter devices and methods, utilizing light emitting diodes (LEDs), for improved light extraction
US9240530B2 (en) 2012-02-13 2016-01-19 Cree, Inc. Light emitter devices having improved chemical and physical resistance and related methods
US9343441B2 (en) 2012-02-13 2016-05-17 Cree, Inc. Light emitter devices having improved light output and related methods
JP2014022669A (ja) * 2012-07-20 2014-02-03 Shin Etsu Chem Co Ltd プライマー組成物及びそれを用いた光半導体装置
JP5863684B2 (ja) * 2013-01-18 2016-02-17 信越化学工業株式会社 プライマー組成物及びそれを用いた光半導体装置
JP5869501B2 (ja) 2013-01-25 2016-02-24 信越化学工業株式会社 プライマー組成物及びそれを用いた光半導体装置
JP2018060856A (ja) * 2016-10-03 2018-04-12 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 コーティング組成物および光半導体装置
CN112011243B (zh) * 2019-05-31 2022-11-11 信越化学工业株式会社 底涂剂组合物及使用了该底涂剂组合物的光学半导体装置
JP7111660B2 (ja) 2019-05-31 2022-08-02 信越化学工業株式会社 プライマー組成物及びこれを用いた光半導体装置
CN112759997A (zh) * 2021-02-05 2021-05-07 东莞市贝特利新材料有限公司 一种有机硅底层涂料组合物及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006241407A (ja) * 2005-03-07 2006-09-14 Shin Etsu Chem Co Ltd プライマー組成物及びそれを用いた電気電子部品
JP2006253398A (ja) 2005-03-10 2006-09-21 Shin Etsu Chem Co Ltd 半導体装置の製造方法
JP2007246803A (ja) 2006-03-17 2007-09-27 Shin Etsu Chem Co Ltd 耐光性プライマー組成物、該プライマー組成物を用いる発光半導体装置の製造方法、及び該方法により得られる発光半導体装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07292320A (ja) * 1994-04-22 1995-11-07 Shin Etsu Chem Co Ltd プライマー組成物及びシリコーン積層体
JP3523098B2 (ja) 1998-12-28 2004-04-26 信越化学工業株式会社 付加硬化型シリコーン組成物
JP2004292714A (ja) 2003-03-28 2004-10-21 Kanegafuchi Chem Ind Co Ltd 硬化性組成物、硬化物、その製造方法およびその硬化物により封止された発光ダイオード
KR101468885B1 (ko) * 2006-08-28 2014-12-04 올넥스 벨지움 에스.에이. 중합체 조성물
JP5090000B2 (ja) 2007-01-24 2012-12-05 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 プライマー組成物及びそれを用いた光半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006241407A (ja) * 2005-03-07 2006-09-14 Shin Etsu Chem Co Ltd プライマー組成物及びそれを用いた電気電子部品
JP2006253398A (ja) 2005-03-10 2006-09-21 Shin Etsu Chem Co Ltd 半導体装置の製造方法
JP2007246803A (ja) 2006-03-17 2007-09-27 Shin Etsu Chem Co Ltd 耐光性プライマー組成物、該プライマー組成物を用いる発光半導体装置の製造方法、及び該方法により得られる発光半導体装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170016433A (ko) * 2014-06-06 2017-02-13 신에쓰 가가꾸 고교 가부시끼가이샤 프라이머 조성물
KR102387721B1 (ko) 2014-06-06 2022-04-19 신에쓰 가가꾸 고교 가부시끼가이샤 프라이머 조성물
KR20190129001A (ko) * 2018-05-09 2019-11-19 신에쓰 가가꾸 고교 가부시끼가이샤 프라이머 조성물 및 이것을 사용한 광반도체 장치
KR102655991B1 (ko) 2018-05-09 2024-04-11 신에쓰 가가꾸 고교 가부시끼가이샤 프라이머 조성물 및 이것을 사용한 광반도체 장치
KR20210060505A (ko) * 2018-09-11 2021-05-26 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 수지와 폴리올레핀계 수지의 접착용 프라이머 조성물, 및 실리콘 수지와 폴리올레핀계 수지의 접착 방법
EP3851502A4 (en) * 2018-09-11 2022-06-08 Shin-Etsu Chemical Co., Ltd. PRIMER COMPOSITION FOR BONDING SILICONE RESIN AND POLYOLEFIN RESIN, AND METHOD FOR BONDING SILICONE RESIN AND POLYOLEFIN RESIN
US12037509B2 (en) 2018-09-11 2024-07-16 Shin-Etsu Chemical Co., Ltd. Primer composition for bonding silicone resin and polyolefin resin, and method for bonding silicone resin and polyolefin resin
KR102692406B1 (ko) 2018-09-11 2024-08-07 신에쓰 가가꾸 고교 가부시끼가이샤 실리콘 수지와 폴리올레핀계 수지의 접착용 프라이머 조성물, 및 실리콘 수지와 폴리올레핀계 수지의 접착 방법

Also Published As

Publication number Publication date
KR20100086955A (ko) 2010-08-02
CN101792632A (zh) 2010-08-04
TW201043670A (en) 2010-12-16
TWI454540B (zh) 2014-10-01
CN101792632B (zh) 2014-10-15
JP4870176B2 (ja) 2012-02-08
JP2010168496A (ja) 2010-08-05

Similar Documents

Publication Publication Date Title
KR101717782B1 (ko) 프라이머 조성물 및 그것을 이용한 광 반도체 장치
KR101599866B1 (ko) 프라이머 조성물 및 이것을 이용한 광반도체 장치
KR102149219B1 (ko) 프라이머 조성물 및 그것을 이용한 광반도체 장치
JP5541171B2 (ja) プライマー組成物及び該組成物を用いた光半導体装置
WO2004076585A1 (ja) 硬化性組成物とその調製方法、遮光ペースト、遮光用樹脂とその形成方法、発光ダイオード用パッケージ及び半導体装置
JP5090000B2 (ja) プライマー組成物及びそれを用いた光半導体装置
KR102655991B1 (ko) 프라이머 조성물 및 이것을 사용한 광반도체 장치
KR101947621B1 (ko) 가열경화형 실리콘 조성물, 이 조성물로 이루어진 다이본드재 및 이 다이본드재의 경화물을 이용한 광반도체 장치
KR102257952B1 (ko) 경화성 폴리오가노실록산 조성물 및 그 사용
JP2014022669A (ja) プライマー組成物及びそれを用いた光半導体装置
CN112011243B (zh) 底涂剂组合物及使用了该底涂剂组合物的光学半导体装置
JP7111660B2 (ja) プライマー組成物及びこれを用いた光半導体装置

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20200302

Year of fee payment: 4