KR101700255B1 - 액체 재료의 도포 방법, 도포 장치 및 프로그램을 기억한 기억 매체 - Google Patents

액체 재료의 도포 방법, 도포 장치 및 프로그램을 기억한 기억 매체 Download PDF

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KR101700255B1
KR101700255B1 KR1020127006243A KR20127006243A KR101700255B1 KR 101700255 B1 KR101700255 B1 KR 101700255B1 KR 1020127006243 A KR1020127006243 A KR 1020127006243A KR 20127006243 A KR20127006243 A KR 20127006243A KR 101700255 B1 KR101700255 B1 KR 101700255B1
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South Korea
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coating
discharge
nozzle
liquid material
amount
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Korean (ko)
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KR20120054629A (ko
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가즈마사 이쿠시마
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무사시 엔지니어링 가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/856—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL

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  • Coating Apparatus (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Spray Control Apparatus (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020127006243A 2009-08-11 2010-08-06 액체 재료의 도포 방법, 도포 장치 및 프로그램을 기억한 기억 매체 Active KR101700255B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009186349A JP5783670B2 (ja) 2009-08-11 2009-08-11 液体材料の塗布方法、塗布装置およびプログラム
JPJP-P-2009-186349 2009-08-11
PCT/JP2010/063346 WO2011018988A1 (ja) 2009-08-11 2010-08-06 液体材料の塗布方法、塗布装置およびプログラム

Publications (2)

Publication Number Publication Date
KR20120054629A KR20120054629A (ko) 2012-05-30
KR101700255B1 true KR101700255B1 (ko) 2017-02-13

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Application Number Title Priority Date Filing Date
KR1020127006243A Active KR101700255B1 (ko) 2009-08-11 2010-08-06 액체 재료의 도포 방법, 도포 장치 및 프로그램을 기억한 기억 매체

Country Status (7)

Country Link
US (1) US8703601B2 (https=)
EP (1) EP2466630B1 (https=)
JP (1) JP5783670B2 (https=)
KR (1) KR101700255B1 (https=)
CN (1) CN102714165B (https=)
TW (1) TWI497613B (https=)
WO (1) WO2011018988A1 (https=)

Cited By (1)

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KR20200001594A (ko) * 2017-05-25 2020-01-06 무사시 엔지니어링 가부시키가이샤 액체 재료 도포 장치 및 액체 재료 도포 방법

Families Citing this family (13)

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JP5280702B2 (ja) * 2008-02-18 2013-09-04 武蔵エンジニアリング株式会社 液体材料の塗布方法、その装置およびそのプログラム
KR101677487B1 (ko) * 2009-06-15 2016-11-18 무사시 엔지니어링 가부시키가이샤 액체 재료의 도포 방법, 그 장치 및 그 프로그램이 기억된 기억 매체
JP6452147B2 (ja) * 2015-01-19 2019-01-16 武蔵エンジニアリング株式会社 液体材料吐出装置
JP2016131947A (ja) * 2015-01-21 2016-07-25 三菱電機株式会社 液剤塗布方法および電子装置の製造方法ならびに液剤塗布装置
US9653325B2 (en) * 2015-02-17 2017-05-16 Powertech Technology Inc. Underfill process and processing machine thereof
JP6684397B2 (ja) * 2015-04-02 2020-04-22 エムテックスマート株式会社 流体の噴出方法および流体の成膜方法
CN106094271A (zh) * 2016-06-22 2016-11-09 深圳市华星光电技术有限公司 一种显示面板切割方法
JP6778426B2 (ja) * 2016-09-20 2020-11-04 武蔵エンジニアリング株式会社 液体材料吐出装置
JP6991475B2 (ja) 2017-05-24 2022-01-12 協立化学産業株式会社 加工対象物切断方法
JP6471258B2 (ja) * 2018-06-04 2019-02-13 武蔵エンジニアリング株式会社 液体材料塗布装置および液体材料塗布方法
CN108906508B (zh) * 2018-08-06 2020-11-27 Oppo（重庆）智能科技有限公司 胶量控制方法及胶量控制装置
JP7426198B2 (ja) * 2019-04-17 2024-02-01 株式会社ジャノメ 塗布装置
TW202430278A (zh) * 2023-01-18 2024-08-01 萬潤科技股份有限公司 液材施作方法及液材施作設備

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JP2008071883A (ja) 2006-09-13 2008-03-27 Seiko Epson Corp 半導体装置の製造方法

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JP2571024B2 (ja) * 1994-09-28 1997-01-16 日本電気株式会社 マルチチップモジュール
US6066509A (en) * 1998-03-12 2000-05-23 Micron Technology, Inc. Method and apparatus for underfill of bumped or raised die
JPH1050769A (ja) * 1996-07-30 1998-02-20 Toshiba Corp 半導体パッケージの製造装置および製造方法
JP3431406B2 (ja) * 1996-07-30 2003-07-28 株式会社東芝 半導体パッケージ装置
US7015592B2 (en) * 2004-03-19 2006-03-21 Intel Corporation Marking on underfill
JP4538002B2 (ja) * 2005-04-28 2010-09-08 芝浦メカトロニクス株式会社 溶液の塗布装置及び塗布方法
JP2007173621A (ja) * 2005-12-22 2007-07-05 Sharp Corp 基板に対する液膜材料の塗布方法
JP2007194403A (ja) 2006-01-19 2007-08-02 Sony Corp 電子デバイスの製造装置及び電子デバイスの製造方法、並びに、アンダーフィル材充填状態の検査装置及びアンダーフィル材充填状態の検査方法
JP4868515B2 (ja) * 2006-11-01 2012-02-01 武蔵エンジニアリング株式会社 液体材料の充填方法、装置およびプログラム
JP4871093B2 (ja) * 2006-11-01 2012-02-08 武蔵エンジニアリング株式会社 液体材料の充填方法、装置およびプログラム
JP5019900B2 (ja) * 2007-02-08 2012-09-05 武蔵エンジニアリング株式会社 液体材料の充填方法、装置およびプログラム
JP4962413B2 (ja) * 2008-05-28 2012-06-27 セイコーエプソン株式会社 液状体吐出装置、及び液状体吐出方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008071883A (ja) 2006-09-13 2008-03-27 Seiko Epson Corp 半導体装置の製造方法

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200001594A (ko) * 2017-05-25 2020-01-06 무사시 엔지니어링 가부시키가이샤 액체 재료 도포 장치 및 액체 재료 도포 방법
KR102213687B1 (ko) * 2017-05-25 2021-02-05 무사시 엔지니어링 가부시키가이샤 액체 재료 도포 장치 및 액체 재료 도포 방법
KR20210016081A (ko) * 2017-05-25 2021-02-10 무사시 엔지니어링 가부시키가이샤 액체 재료 도포 장치 및 액체 재료 도포 방법
KR102323933B1 (ko) * 2017-05-25 2021-11-08 무사시 엔지니어링 가부시키가이샤 액체 재료 도포 장치 및 액체 재료 도포 방법

Also Published As

Publication number Publication date
JP2011036800A (ja) 2011-02-24
KR20120054629A (ko) 2012-05-30
JP5783670B2 (ja) 2015-09-24
EP2466630A4 (en) 2014-02-26
CN102714165A (zh) 2012-10-03
TW201119752A (en) 2011-06-16
WO2011018988A1 (ja) 2011-02-17
EP2466630A1 (en) 2012-06-20
US20120313276A1 (en) 2012-12-13
TWI497613B (zh) 2015-08-21
HK1171573A1 (en) 2013-03-28
EP2466630B1 (en) 2019-10-02
US8703601B2 (en) 2014-04-22
CN102714165B (zh) 2015-04-15

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