KR101634970B1 - 반도체 장치 및 반도체 장치 제조 방법 - Google Patents

반도체 장치 및 반도체 장치 제조 방법 Download PDF

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KR101634970B1
KR101634970B1 KR1020097026340A KR20097026340A KR101634970B1 KR 101634970 B1 KR101634970 B1 KR 101634970B1 KR 1020097026340 A KR1020097026340 A KR 1020097026340A KR 20097026340 A KR20097026340 A KR 20097026340A KR 101634970 B1 KR101634970 B1 KR 101634970B1
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layer
unit cell
light emitting
electrode
semiconductor
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Korean (ko)
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KR20100022051A (ko
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슌페이 야마자키
？페이 야마자키
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H10D86/0214—Manufacture or treatment of multiple TFTs using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P90/00—Preparation of wafers not covered by a single main group of this subclass, e.g. wafer reinforcement
    • H10P90/19—Preparing inhomogeneous wafers
    • H10P90/1904—Preparing vertically inhomogeneous wafers
    • H10P90/1906—Preparing SOI wafers
    • H10P90/1914—Preparing SOI wafers using bonding
    • H10P90/1916—Preparing SOI wafers using bonding with separation or delamination along an ion implanted layer, e.g. Smart-cut
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thin Film Transistor (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020097026340A 2007-05-18 2008-03-21 반도체 장치 및 반도체 장치 제조 방법 Expired - Fee Related KR101634970B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2007-133500 2007-05-18
JP2007133500 2007-05-18

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KR20100022051A KR20100022051A (ko) 2010-02-26
KR101634970B1 true KR101634970B1 (ko) 2016-06-30

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KR1020097026340A Expired - Fee Related KR101634970B1 (ko) 2007-05-18 2008-03-21 반도체 장치 및 반도체 장치 제조 방법

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US (2) US7795627B2 (https=)
JP (1) JP5552216B2 (https=)
KR (1) KR101634970B1 (https=)
WO (1) WO2008142911A1 (https=)

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CN101681807B (zh) * 2007-06-01 2012-03-14 株式会社半导体能源研究所 半导体器件的制造方法
EP2174343A1 (en) * 2007-06-28 2010-04-14 Semiconductor Energy Laboratory Co, Ltd. Manufacturing method of semiconductor device
US8431451B2 (en) 2007-06-29 2013-04-30 Semicondutor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
JP5498670B2 (ja) 2007-07-13 2014-05-21 株式会社半導体エネルギー研究所 半導体基板の作製方法
TWI493609B (zh) * 2007-10-23 2015-07-21 半導體能源研究所股份有限公司 半導體基板、顯示面板及顯示裝置的製造方法
US8278713B2 (en) 2008-03-28 2012-10-02 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method thereof
JP5700617B2 (ja) 2008-07-08 2015-04-15 株式会社半導体エネルギー研究所 Ｓｏｉ基板の作製方法
JP2010161671A (ja) * 2009-01-09 2010-07-22 Murata Mfg Co Ltd 圧電デバイスの製造方法
JP4871378B2 (ja) * 2009-08-24 2012-02-08 株式会社沖データ 半導体発光素子アレイ装置、画像露光装置、画像形成装置、及び画像表示装置
KR101758297B1 (ko) * 2010-06-04 2017-07-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 장치 및 전자 기기
KR101833498B1 (ko) 2010-10-29 2018-03-02 삼성디스플레이 주식회사 액정 표시 장치
US9443984B2 (en) 2010-12-28 2016-09-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof
US8557683B2 (en) 2011-06-15 2013-10-15 Applied Materials, Inc. Multi-step and asymmetrically shaped laser beam scribing
US8703581B2 (en) 2011-06-15 2014-04-22 Applied Materials, Inc. Water soluble mask for substrate dicing by laser and plasma etch
US9129904B2 (en) 2011-06-15 2015-09-08 Applied Materials, Inc. Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch
US8598016B2 (en) 2011-06-15 2013-12-03 Applied Materials, Inc. In-situ deposited mask layer for device singulation by laser scribing and plasma etch
US8557682B2 (en) 2011-06-15 2013-10-15 Applied Materials, Inc. Multi-layer mask for substrate dicing by laser and plasma etch
US9029242B2 (en) 2011-06-15 2015-05-12 Applied Materials, Inc. Damage isolation by shaped beam delivery in laser scribing process
US8759197B2 (en) 2011-06-15 2014-06-24 Applied Materials, Inc. Multi-step and asymmetrically shaped laser beam scribing
KR20140023142A (ko) * 2012-08-17 2014-02-26 삼성디스플레이 주식회사 표시 장치의 제조 방법 및 표시 장치를 제조하기 위한 캐리어 기판
JP2014120731A (ja) * 2012-12-19 2014-06-30 Mitsubishi Electric Corp 半導体装置
US9224650B2 (en) * 2013-09-19 2015-12-29 Applied Materials, Inc. Wafer dicing from wafer backside and front side
EP3289614B1 (en) * 2015-05-01 2021-06-23 Emagin Corporation Large area oled microdisplay and method of manufacturing same
JP6341345B1 (ja) * 2017-03-07 2018-06-13 富士ゼロックス株式会社 発光装置、画像形成装置及び光照射装置
US10516075B2 (en) * 2017-09-11 2019-12-24 Nichia Corporation Method of manufacturing a light emitting element
JP7199174B2 (ja) * 2018-07-26 2023-01-05 東京エレクトロン株式会社 エッチング方法
CN113921639A (zh) * 2020-10-12 2022-01-11 上海晶澳太阳能科技有限公司 硅片及制备方法、电池片、电池切片、电池串及光伏组件

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JP2003029667A (ja) 2001-07-19 2003-01-31 Sharp Corp 表示装置およびその製造方法

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JPH10135479A (ja) * 1996-09-03 1998-05-22 Toshiba Corp 薄膜トランジスタアレイ、およびこれを用いた画像表示装置
JPH11163363A (ja) * 1997-11-22 1999-06-18 Semiconductor Energy Lab Co Ltd 半導体装置およびその作製方法
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Publication number Publication date
JP5552216B2 (ja) 2014-07-16
WO2008142911A1 (en) 2008-11-27
US7795627B2 (en) 2010-09-14
US20080283848A1 (en) 2008-11-20
KR20100022051A (ko) 2010-02-26
US8471272B2 (en) 2013-06-25
JP2009003434A (ja) 2009-01-08
US20110006314A1 (en) 2011-01-13

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