KR101617231B1 - 전류 흐름에 대한 가요성 접속부의 불연속성을 검출하는 장치 및 그 방법 - Google Patents
전류 흐름에 대한 가요성 접속부의 불연속성을 검출하는 장치 및 그 방법 Download PDFInfo
- Publication number
- KR101617231B1 KR101617231B1 KR1020117025584A KR20117025584A KR101617231B1 KR 101617231 B1 KR101617231 B1 KR 101617231B1 KR 1020117025584 A KR1020117025584 A KR 1020117025584A KR 20117025584 A KR20117025584 A KR 20117025584A KR 101617231 B1 KR101617231 B1 KR 101617231B1
- Authority
- KR
- South Korea
- Prior art keywords
- flexible connector
- current flow
- coil
- current
- connector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000000034 method Methods 0.000 title claims description 40
- 238000001514 detection method Methods 0.000 claims abstract description 75
- 238000012545 processing Methods 0.000 claims abstract description 49
- 239000000463 material Substances 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims description 16
- 230000008859 change Effects 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 abstract description 20
- 239000000758 substrate Substances 0.000 description 17
- 238000012806 monitoring device Methods 0.000 description 10
- 238000013461 design Methods 0.000 description 9
- 238000005299 abrasion Methods 0.000 description 6
- 238000012544 monitoring process Methods 0.000 description 6
- 230000002950 deficient Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32577—Electrical connecting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Drying Of Semiconductors (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/431,593 US8466697B2 (en) | 2009-04-28 | 2009-04-28 | Arrangements for detecting discontinuity of flexible connections for current flow and methods thereof |
| US12/431,593 | 2009-04-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120020104A KR20120020104A (ko) | 2012-03-07 |
| KR101617231B1 true KR101617231B1 (ko) | 2016-05-02 |
Family
ID=42991565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020117025584A Active KR101617231B1 (ko) | 2009-04-28 | 2010-04-26 | 전류 흐름에 대한 가요성 접속부의 불연속성을 검출하는 장치 및 그 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8466697B2 (enExample) |
| JP (1) | JP5781064B2 (enExample) |
| KR (1) | KR101617231B1 (enExample) |
| CN (2) | CN102415221B (enExample) |
| SG (1) | SG175164A1 (enExample) |
| TW (1) | TWI489117B (enExample) |
| WO (1) | WO2010129229A2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102018733B1 (ko) | 2013-06-13 | 2019-09-06 | 삼성디스플레이 주식회사 | 플렉서블 표시장치 |
| CN105116271B (zh) * | 2015-08-07 | 2019-04-26 | 深圳一电航空技术有限公司 | 桨叶检测装置及方法、桨叶组件、飞行器及其控制方法 |
| KR102417178B1 (ko) * | 2015-09-03 | 2022-07-05 | 삼성전자주식회사 | 마이크로파 탐침, 그 탐침을 구비한 플라즈마 모니터링 시스템, 및 그 시스템을 이용한 반도체 소자 제조방법 |
| US20210073610A1 (en) * | 2017-12-27 | 2021-03-11 | Semiconductor Energy Laboratory Co., Ltd. | Thin film manufacturing apparatus and thin film manufacturing apparatus using neural network |
| CN115825529B (zh) * | 2022-12-25 | 2023-11-17 | 北京屹唐半导体科技股份有限公司 | 射频探头、射频匹配器、射频电源及射频测量仪 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002202328A (ja) * | 2000-12-28 | 2002-07-19 | Japan System Engineering Kk | 磁界型電流センサ |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2100135C (en) * | 1992-07-10 | 1997-11-04 | Makoto Kawakami | Dc current sensor |
| JPH09257861A (ja) * | 1996-03-21 | 1997-10-03 | Toshiba Corp | 心線損傷検出装置 |
| JPH1079350A (ja) | 1996-09-04 | 1998-03-24 | Kokusai Electric Co Ltd | プラズマ処理装置 |
| US6221221B1 (en) * | 1998-11-16 | 2001-04-24 | Applied Materials, Inc. | Apparatus for providing RF return current path control in a semiconductor wafer processing system |
| US7271580B1 (en) * | 2001-10-26 | 2007-09-18 | Schweitzer Engineering Laboratories, Inc. | Apparatus and method for programmable trip settings in a faulted circuit indicator |
| JP3773189B2 (ja) | 2002-04-24 | 2006-05-10 | 独立行政法人科学技術振興機構 | 窓型プローブ、プラズマ監視装置、及び、プラズマ処理装置 |
| KR100483355B1 (ko) | 2002-11-14 | 2005-04-15 | 학교법인 성균관대학 | 자장강화된 외장형 선형 안테나를 구비하는 대면적 처리용유도 결합 플라즈마 소오스 |
| US6876205B2 (en) * | 2003-06-06 | 2005-04-05 | Advanced Energy Industries, Inc. | Stored energy arc detection and arc reduction circuit |
| US7145345B2 (en) * | 2003-12-23 | 2006-12-05 | General Electric Company | Current transformers for partial discharge detection on aircraft cables and wires |
| JP4359521B2 (ja) * | 2004-02-20 | 2009-11-04 | 東京エレクトロン株式会社 | プラズマ処理装置及びその制御方法 |
| US8004293B2 (en) * | 2006-11-20 | 2011-08-23 | Applied Materials, Inc. | Plasma processing chamber with ground member integrity indicator and method for using the same |
| US7972470B2 (en) * | 2007-05-03 | 2011-07-05 | Applied Materials, Inc. | Asymmetric grounding of rectangular susceptor |
| US8343305B2 (en) | 2007-09-04 | 2013-01-01 | Lam Research Corporation | Method and apparatus for diagnosing status of parts in real time in plasma processing equipment |
-
2009
- 2009-04-28 US US12/431,593 patent/US8466697B2/en not_active Expired - Fee Related
-
2010
- 2010-04-26 SG SG2011073970A patent/SG175164A1/en unknown
- 2010-04-26 WO PCT/US2010/032413 patent/WO2010129229A2/en not_active Ceased
- 2010-04-26 CN CN201080017788.7A patent/CN102415221B/zh active Active
- 2010-04-26 JP JP2012508566A patent/JP5781064B2/ja active Active
- 2010-04-26 KR KR1020117025584A patent/KR101617231B1/ko active Active
- 2010-04-26 CN CN201410485836.5A patent/CN104360211B/zh active Active
- 2010-04-28 TW TW099113521A patent/TWI489117B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002202328A (ja) * | 2000-12-28 | 2002-07-19 | Japan System Engineering Kk | 磁界型電流センサ |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010129229A2 (en) | 2010-11-11 |
| CN102415221B (zh) | 2014-11-19 |
| US8466697B2 (en) | 2013-06-18 |
| CN102415221A (zh) | 2012-04-11 |
| WO2010129229A3 (en) | 2011-02-03 |
| KR20120020104A (ko) | 2012-03-07 |
| CN104360211A (zh) | 2015-02-18 |
| US20100271040A1 (en) | 2010-10-28 |
| TW201126179A (en) | 2011-08-01 |
| JP2012525683A (ja) | 2012-10-22 |
| SG175164A1 (en) | 2011-11-28 |
| TWI489117B (zh) | 2015-06-21 |
| JP5781064B2 (ja) | 2015-09-16 |
| CN104360211B (zh) | 2017-11-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101617231B1 (ko) | 전류 흐름에 대한 가요성 접속부의 불연속성을 검출하는 장치 및 그 방법 | |
| JP5296676B2 (ja) | プラズマ非拘束状態の検出方法および前記方法を用いるプラズマ処理システム | |
| TWI512864B (zh) | 在電漿處理設備中即時診斷部件狀態之方法及裝置 | |
| JP5215942B2 (ja) | 電子装置、および、雑音電流測定方法 | |
| US20140091785A1 (en) | Target clearance measurement device | |
| US7649200B1 (en) | System and method of detecting IC die cracks | |
| JP2010133961A (ja) | 巻線診断システム及び方法 | |
| US10281520B2 (en) | Diagnosing an abnormal state of a substrate-processing apparatus | |
| KR20000071866A (ko) | 시트저항 측정기 | |
| KR100897982B1 (ko) | 프로브카드 니들과 패드간의 미스 얼라인 방지 패턴 및 그방법 | |
| US10712234B2 (en) | Belt and pulley systems and methods of detecting belt damage | |
| JP2003045846A (ja) | 半導体製造装置の監視方法及びその制御方法 | |
| JP2016122003A (ja) | 欠陥検出回路及びフレキシブル・プローブ・チップ中の潜在的な欠陥検出方法 | |
| JP2007007848A (ja) | ワイヤソーにおける機能障害の検出方法、およびこの方法を実施するための装置 | |
| JP2007248107A (ja) | 電源ノイズ検出装置 | |
| JP2009115719A (ja) | 基板検査装置及び基板検査方法 | |
| IT202300008100A1 (it) | Testa di misura con sonde di contatto aventi una configurazione perfezionata | |
| JP2000139059A (ja) | 交流電動機の絶縁破壊検出装置 | |
| JP2004286664A (ja) | 故障診断用コイルの設計方法、プリント基板、故障診断システム | |
| JP2005014750A (ja) | トロリーの絶縁状況監視方法 | |
| JPH04217117A (ja) | 近接スイッチの劣化診断方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20111027 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20151030 Patent event code: PE09021S01D |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20160129 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20160426 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20160426 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration | ||
| FPAY | Annual fee payment |
Payment date: 20190411 Year of fee payment: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20190411 Start annual number: 4 End annual number: 4 |
|
| PR1001 | Payment of annual fee |
Payment date: 20200417 Start annual number: 5 End annual number: 5 |
|
| PR1001 | Payment of annual fee |
Payment date: 20210409 Start annual number: 6 End annual number: 6 |
|
| PR1001 | Payment of annual fee |
Payment date: 20230412 Start annual number: 8 End annual number: 8 |