TWI489117B - 供電流流動用之撓性連接的不連續之偵測裝置與方法 - Google Patents
供電流流動用之撓性連接的不連續之偵測裝置與方法 Download PDFInfo
- Publication number
- TWI489117B TWI489117B TW099113521A TW99113521A TWI489117B TW I489117 B TWI489117 B TW I489117B TW 099113521 A TW099113521 A TW 099113521A TW 99113521 A TW99113521 A TW 99113521A TW I489117 B TWI489117 B TW I489117B
- Authority
- TW
- Taiwan
- Prior art keywords
- flexible connector
- detection circuit
- current
- current flow
- coil
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 18
- 238000001514 detection method Methods 0.000 claims description 97
- 238000012545 processing Methods 0.000 claims description 72
- 239000004020 conductor Substances 0.000 claims description 24
- 239000000463 material Substances 0.000 claims description 7
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 238000004804 winding Methods 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 claims 1
- 230000006698 induction Effects 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 22
- 238000013461 design Methods 0.000 description 14
- 238000012806 monitoring device Methods 0.000 description 14
- 238000012544 monitoring process Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000013480 data collection Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 210000003041 ligament Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32568—Relative arrangement or disposition of electrodes; moving means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/52—Testing for short-circuits, leakage current or ground faults
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
- G01R31/54—Testing for continuity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32532—Electrodes
- H01J37/32577—Electrical connecting means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32917—Plasma diagnostics
- H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Drying Of Semiconductors (AREA)
- Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/431,593 US8466697B2 (en) | 2009-04-28 | 2009-04-28 | Arrangements for detecting discontinuity of flexible connections for current flow and methods thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201126179A TW201126179A (en) | 2011-08-01 |
| TWI489117B true TWI489117B (zh) | 2015-06-21 |
Family
ID=42991565
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW099113521A TWI489117B (zh) | 2009-04-28 | 2010-04-28 | 供電流流動用之撓性連接的不連續之偵測裝置與方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8466697B2 (enExample) |
| JP (1) | JP5781064B2 (enExample) |
| KR (1) | KR101617231B1 (enExample) |
| CN (2) | CN102415221B (enExample) |
| SG (1) | SG175164A1 (enExample) |
| TW (1) | TWI489117B (enExample) |
| WO (1) | WO2010129229A2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102018733B1 (ko) | 2013-06-13 | 2019-09-06 | 삼성디스플레이 주식회사 | 플렉서블 표시장치 |
| CN105116271B (zh) * | 2015-08-07 | 2019-04-26 | 深圳一电航空技术有限公司 | 桨叶检测装置及方法、桨叶组件、飞行器及其控制方法 |
| KR102417178B1 (ko) * | 2015-09-03 | 2022-07-05 | 삼성전자주식회사 | 마이크로파 탐침, 그 탐침을 구비한 플라즈마 모니터링 시스템, 및 그 시스템을 이용한 반도체 소자 제조방법 |
| US20210073610A1 (en) * | 2017-12-27 | 2021-03-11 | Semiconductor Energy Laboratory Co., Ltd. | Thin film manufacturing apparatus and thin film manufacturing apparatus using neural network |
| CN115825529B (zh) * | 2022-12-25 | 2023-11-17 | 北京屹唐半导体科技股份有限公司 | 射频探头、射频匹配器、射频电源及射频测量仪 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6221221B1 (en) * | 1998-11-16 | 2001-04-24 | Applied Materials, Inc. | Apparatus for providing RF return current path control in a semiconductor wafer processing system |
| US20080116876A1 (en) * | 2006-11-20 | 2008-05-22 | Applied Materials, Inc. | Plasma processing chamber with ground member integrity indicator and method for using the same |
| US20080179005A1 (en) * | 2004-02-20 | 2008-07-31 | Tokyo Electron Limited | Plasma processing apparatus and control method thereof |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2100135C (en) * | 1992-07-10 | 1997-11-04 | Makoto Kawakami | Dc current sensor |
| JPH09257861A (ja) * | 1996-03-21 | 1997-10-03 | Toshiba Corp | 心線損傷検出装置 |
| JPH1079350A (ja) | 1996-09-04 | 1998-03-24 | Kokusai Electric Co Ltd | プラズマ処理装置 |
| JP2002202328A (ja) * | 2000-12-28 | 2002-07-19 | Japan System Engineering Kk | 磁界型電流センサ |
| US7271580B1 (en) * | 2001-10-26 | 2007-09-18 | Schweitzer Engineering Laboratories, Inc. | Apparatus and method for programmable trip settings in a faulted circuit indicator |
| JP3773189B2 (ja) | 2002-04-24 | 2006-05-10 | 独立行政法人科学技術振興機構 | 窓型プローブ、プラズマ監視装置、及び、プラズマ処理装置 |
| KR100483355B1 (ko) | 2002-11-14 | 2005-04-15 | 학교법인 성균관대학 | 자장강화된 외장형 선형 안테나를 구비하는 대면적 처리용유도 결합 플라즈마 소오스 |
| US6876205B2 (en) * | 2003-06-06 | 2005-04-05 | Advanced Energy Industries, Inc. | Stored energy arc detection and arc reduction circuit |
| US7145345B2 (en) * | 2003-12-23 | 2006-12-05 | General Electric Company | Current transformers for partial discharge detection on aircraft cables and wires |
| US7972470B2 (en) * | 2007-05-03 | 2011-07-05 | Applied Materials, Inc. | Asymmetric grounding of rectangular susceptor |
| US8343305B2 (en) | 2007-09-04 | 2013-01-01 | Lam Research Corporation | Method and apparatus for diagnosing status of parts in real time in plasma processing equipment |
-
2009
- 2009-04-28 US US12/431,593 patent/US8466697B2/en not_active Expired - Fee Related
-
2010
- 2010-04-26 SG SG2011073970A patent/SG175164A1/en unknown
- 2010-04-26 WO PCT/US2010/032413 patent/WO2010129229A2/en not_active Ceased
- 2010-04-26 CN CN201080017788.7A patent/CN102415221B/zh active Active
- 2010-04-26 JP JP2012508566A patent/JP5781064B2/ja active Active
- 2010-04-26 KR KR1020117025584A patent/KR101617231B1/ko active Active
- 2010-04-26 CN CN201410485836.5A patent/CN104360211B/zh active Active
- 2010-04-28 TW TW099113521A patent/TWI489117B/zh active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6221221B1 (en) * | 1998-11-16 | 2001-04-24 | Applied Materials, Inc. | Apparatus for providing RF return current path control in a semiconductor wafer processing system |
| US20080179005A1 (en) * | 2004-02-20 | 2008-07-31 | Tokyo Electron Limited | Plasma processing apparatus and control method thereof |
| US20080116876A1 (en) * | 2006-11-20 | 2008-05-22 | Applied Materials, Inc. | Plasma processing chamber with ground member integrity indicator and method for using the same |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2010129229A2 (en) | 2010-11-11 |
| CN102415221B (zh) | 2014-11-19 |
| US8466697B2 (en) | 2013-06-18 |
| CN102415221A (zh) | 2012-04-11 |
| WO2010129229A3 (en) | 2011-02-03 |
| KR20120020104A (ko) | 2012-03-07 |
| CN104360211A (zh) | 2015-02-18 |
| US20100271040A1 (en) | 2010-10-28 |
| TW201126179A (en) | 2011-08-01 |
| JP2012525683A (ja) | 2012-10-22 |
| SG175164A1 (en) | 2011-11-28 |
| JP5781064B2 (ja) | 2015-09-16 |
| CN104360211B (zh) | 2017-11-24 |
| KR101617231B1 (ko) | 2016-05-02 |
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