KR101600938B1 - 기판 처리 방법, 기판 처리 시스템 및 기판 처리 프로그램을 기억한 컴퓨터 판독 가능한 기억 매체 - Google Patents

기판 처리 방법, 기판 처리 시스템 및 기판 처리 프로그램을 기억한 컴퓨터 판독 가능한 기억 매체 Download PDF

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KR101600938B1
KR101600938B1 KR1020120070058A KR20120070058A KR101600938B1 KR 101600938 B1 KR101600938 B1 KR 101600938B1 KR 1020120070058 A KR1020120070058 A KR 1020120070058A KR 20120070058 A KR20120070058 A KR 20120070058A KR 101600938 B1 KR101600938 B1 KR 101600938B1
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substrate
processing
back surface
range
back side
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Korean (ko)
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KR20130006309A (ko
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노리타카 우치다
미츠노리 나카모리
쇼이치로 히다카
노부히코 모리
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/50—Cleaning of wafers, substrates or parts of devices characterised by the part to be cleaned
    • H10P70/56—Cleaning of wafer backside
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes

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  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
KR1020120070058A 2011-07-07 2012-06-28 기판 처리 방법, 기판 처리 시스템 및 기판 처리 프로그램을 기억한 컴퓨터 판독 가능한 기억 매체 Active KR101600938B1 (ko)

Applications Claiming Priority (2)

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JP2011151123A JP5705666B2 (ja) 2011-07-07 2011-07-07 基板処理方法、基板処理システム及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JPJP-P-2011-151123 2011-07-07

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KR1020160021071A Division KR101688492B1 (ko) 2011-07-07 2016-02-23 기판 처리 방법, 기판 처리 시스템 및 기판 처리 프로그램을 기억한 컴퓨터 판독 가능한 기억 매체

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KR20130006309A KR20130006309A (ko) 2013-01-16
KR101600938B1 true KR101600938B1 (ko) 2016-03-08

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KR1020120070058A Active KR101600938B1 (ko) 2011-07-07 2012-06-28 기판 처리 방법, 기판 처리 시스템 및 기판 처리 프로그램을 기억한 컴퓨터 판독 가능한 기억 매체
KR1020160021071A Active KR101688492B1 (ko) 2011-07-07 2016-02-23 기판 처리 방법, 기판 처리 시스템 및 기판 처리 프로그램을 기억한 컴퓨터 판독 가능한 기억 매체

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KR1020160021071A Active KR101688492B1 (ko) 2011-07-07 2016-02-23 기판 처리 방법, 기판 처리 시스템 및 기판 처리 프로그램을 기억한 컴퓨터 판독 가능한 기억 매체

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JP (1) JP5705666B2 (https=)
KR (2) KR101600938B1 (https=)
TW (2) TWI593040B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5904169B2 (ja) 2013-07-23 2016-04-13 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
KR102478317B1 (ko) 2015-04-08 2022-12-16 도쿄엘렉트론가부시키가이샤 기판 처리 시스템
US10155252B2 (en) * 2015-04-30 2018-12-18 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor apparatus and washing method
JP6552404B2 (ja) * 2015-12-17 2019-07-31 東京エレクトロン株式会社 基板処理方法、基板処理システム、基板処理装置、及び基板処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
JP7175119B2 (ja) * 2018-07-25 2022-11-18 東京エレクトロン株式会社 基板処理装置、および基板処理方法
KR102877342B1 (ko) 2021-01-11 2025-10-30 삼성디스플레이 주식회사 식각 장치 및 이를 이용한 식각 방법
CN116888713A (zh) 2021-03-03 2023-10-13 东京毅力科创株式会社 基板处理方法和基板处理系统
JP2022152751A (ja) 2021-03-29 2022-10-12 東京エレクトロン株式会社 液滴吐出装置および液滴吐出方法
JP7677834B2 (ja) 2021-06-10 2025-05-15 東京エレクトロン株式会社 基板処理装置及び基板処理装置の制御方法
TW202410144A (zh) 2022-05-18 2024-03-01 日商東京威力科創股份有限公司 基板處理裝置、基板處理方法及記錄媒體
JP2024168280A (ja) 2023-05-23 2024-12-05 東京エレクトロン株式会社 基板処理装置および基板処理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001212531A (ja) 2000-02-04 2001-08-07 Dainippon Screen Mfg Co Ltd 洗浄装置
JP2004247582A (ja) 2003-02-14 2004-09-02 Tokyo Electron Ltd 洗浄ブラシ及び基板洗浄装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8356376B2 (en) * 2008-06-18 2013-01-22 Tokyo Electron Limited Substrate cleaning apparatus, substrate cleaning method, and storage medium

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001212531A (ja) 2000-02-04 2001-08-07 Dainippon Screen Mfg Co Ltd 洗浄装置
JP2004247582A (ja) 2003-02-14 2004-09-02 Tokyo Electron Ltd 洗浄ブラシ及び基板洗浄装置

Also Published As

Publication number Publication date
JP2013021026A (ja) 2013-01-31
TWI593040B (zh) 2017-07-21
KR101688492B1 (ko) 2016-12-21
KR20160026959A (ko) 2016-03-09
TW201308492A (zh) 2013-02-16
KR20130006309A (ko) 2013-01-16
TW201624595A (zh) 2016-07-01
TWI529836B (zh) 2016-04-11
JP5705666B2 (ja) 2015-04-22

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