KR101568004B1 - 입자 빔 검출 장치, 이를 포함하는 기판 처리 시스템 및 입자 처리 시스템, 및 입자 빔의 특성들을 측정하기 위한 방법 - Google Patents
입자 빔 검출 장치, 이를 포함하는 기판 처리 시스템 및 입자 처리 시스템, 및 입자 빔의 특성들을 측정하기 위한 방법 Download PDFInfo
- Publication number
- KR101568004B1 KR101568004B1 KR1020107020169A KR20107020169A KR101568004B1 KR 101568004 B1 KR101568004 B1 KR 101568004B1 KR 1020107020169 A KR1020107020169 A KR 1020107020169A KR 20107020169 A KR20107020169 A KR 20107020169A KR 101568004 B1 KR101568004 B1 KR 101568004B1
- Authority
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- South Korea
- Prior art keywords
- particle
- particles
- particle beam
- detector
- inlet opening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000002245 particle Substances 0.000 title claims abstract description 184
- 238000000034 method Methods 0.000 title claims abstract description 48
- 239000000758 substrate Substances 0.000 title description 23
- 238000012545 processing Methods 0.000 title description 8
- 238000009826 distribution Methods 0.000 claims abstract description 22
- 238000001514 detection method Methods 0.000 claims description 112
- 230000001629 suppression Effects 0.000 claims description 33
- 230000000712 assembly Effects 0.000 claims description 14
- 238000000429 assembly Methods 0.000 claims description 14
- 238000006073 displacement reaction Methods 0.000 claims description 6
- 230000000694 effects Effects 0.000 claims description 5
- 150000002500 ions Chemical class 0.000 description 39
- 238000005468 ion implantation Methods 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 238000000605 extraction Methods 0.000 description 4
- 238000002513 implantation Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- RKTYLMNFRDHKIL-UHFFFAOYSA-N copper;5,10,15,20-tetraphenylporphyrin-22,24-diide Chemical compound [Cu+2].C1=CC(C(=C2C=CC([N-]2)=C(C=2C=CC=CC=2)C=2C=CC(N=2)=C(C=2C=CC=CC=2)C2=CC=C3[N-]2)C=2C=CC=CC=2)=NC1=C3C1=CC=CC=C1 RKTYLMNFRDHKIL-UHFFFAOYSA-N 0.000 description 3
- 238000010884 ion-beam technique Methods 0.000 description 3
- 238000004886 process control Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
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- 239000002184 metal Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
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- 241000931526 Acer campestre Species 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
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- 230000005669 field effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
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- -1 phosphorous ions Chemical class 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/2446—Position sensitive detectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
- H01J2237/24514—Beam diagnostics including control of the parameter or property diagnosed
- H01J2237/24528—Direction of beam or parts thereof in view of the optical axis, e.g. beam angle, angular distribution, beam divergence, beam convergence or beam landing angle on sample or workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/245—Detection characterised by the variable being measured
- H01J2237/24507—Intensity, dose or other characteristics of particle beams or electromagnetic radiation
- H01J2237/24514—Beam diagnostics including control of the parameter or property diagnosed
- H01J2237/24542—Beam profile
Landscapes
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Measurement Of Radiation (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/031,643 | 2008-02-14 | ||
| US12/031,643 US8097866B2 (en) | 2008-02-14 | 2008-02-14 | Apparatus for measuring beam characteristics and a method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20100138916A KR20100138916A (ko) | 2010-12-31 |
| KR101568004B1 true KR101568004B1 (ko) | 2015-11-10 |
Family
ID=40954239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020107020169A Active KR101568004B1 (ko) | 2008-02-14 | 2009-02-12 | 입자 빔 검출 장치, 이를 포함하는 기판 처리 시스템 및 입자 처리 시스템, 및 입자 빔의 특성들을 측정하기 위한 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8097866B2 (enExample) |
| JP (1) | JP5547658B2 (enExample) |
| KR (1) | KR101568004B1 (enExample) |
| CN (1) | CN101952942B (enExample) |
| TW (1) | TWI443706B (enExample) |
| WO (1) | WO2009102875A2 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2915577B2 (ja) | 1993-03-16 | 1999-07-05 | 三菱重工業株式会社 | ヘリコプタ |
| US8698107B2 (en) * | 2011-01-10 | 2014-04-15 | Varian Semiconductor Equipment Associates, Inc. | Technique and apparatus for monitoring ion mass, energy, and angle in processing systems |
| DE102011018613B4 (de) * | 2011-04-21 | 2016-05-12 | Gsi Helmholtzzentrum Für Schwerionenforschung Gmbh | Bestrahlungsanlage mit mehreren einstellbaren Messbereichen einer Strahlmonitoreinrichtung und Steuerverfahren für diese Bestrahlungsanlage |
| US9269536B2 (en) * | 2012-04-17 | 2016-02-23 | Varian Semiconductor Equipment Associates, Inc. | Double ended electrode manipulator |
| JP7132847B2 (ja) * | 2018-12-28 | 2022-09-07 | 住友重機械イオンテクノロジー株式会社 | イオン注入装置および測定装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070210248A1 (en) | 2006-03-10 | 2007-09-13 | Bon-Woong Koo | Technique for monitoring and controlling a plasma process |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4234797A (en) * | 1979-05-23 | 1980-11-18 | Nova Associates, Inc. | Treating workpieces with beams |
| US4786814A (en) * | 1983-09-16 | 1988-11-22 | General Electric Company | Method of reducing electrostatic charge on ion-implanted devices |
| US4751393A (en) * | 1986-05-16 | 1988-06-14 | Varian Associates, Inc. | Dose measurement and uniformity monitoring system for ion implantation |
| JPS63216254A (ja) * | 1987-03-04 | 1988-09-08 | Seiko Instr & Electronics Ltd | イオンビ−ムモニタ−用フアラデ−カツプ |
| US4943728A (en) * | 1989-02-28 | 1990-07-24 | Eaton Corporation | Beam pattern control system for an ion implanter |
| JPH04112441A (ja) * | 1990-08-31 | 1992-04-14 | Toshiba Corp | イオン注入装置及びそのクリーニング方法 |
| US5583427A (en) * | 1992-12-28 | 1996-12-10 | Regents Of The University Of California | Tomographic determination of the power distribution in electron beams |
| US5554926A (en) * | 1994-08-01 | 1996-09-10 | Regents Of The University Of California | Modified Faraday cup |
| KR100219411B1 (ko) * | 1995-11-24 | 1999-09-01 | 윤종용 | 반도체 이온주입설비의 패러데이컵 어셈블리 |
| US5757018A (en) * | 1995-12-11 | 1998-05-26 | Varian Associates, Inc. | Zero deflection magnetically-suppressed Faraday for ion implanters |
| FR2749402B1 (fr) * | 1996-05-29 | 1998-08-07 | Charpak Georges | Dispositif d'imagerie radiographique a haute resolution |
| JP2000294180A (ja) | 1999-04-06 | 2000-10-20 | Nissin High Voltage Co Ltd | ビーム電流検出機能付きビームプロファイルモニタ |
| US6300755B1 (en) * | 1999-05-26 | 2001-10-09 | Regents Of The University Of California | Enhanced modified faraday cup for determination of power density distribution of electron beams |
| US6723998B2 (en) * | 2000-09-15 | 2004-04-20 | Varian Semiconductor Equipment Associates, Inc. | Faraday system for ion implanters |
| US6690022B2 (en) * | 2001-01-17 | 2004-02-10 | Varian Semiconductor Equipment Associates, Inc. | Ion beam incidence angle and beam divergence monitor |
| GB0107551D0 (en) * | 2001-03-27 | 2001-05-16 | Matra Bae Dynamics Uk Ltd | Radiation monitor |
| KR100407579B1 (ko) * | 2001-11-22 | 2003-11-28 | 삼성전자주식회사 | 이온 주입 시스템의 웨이퍼 홀딩 장치 |
| US6956223B2 (en) * | 2002-04-10 | 2005-10-18 | Applied Materials, Inc. | Multi-directional scanning of movable member and ion beam monitoring arrangement therefor |
| KR100444201B1 (ko) * | 2002-04-18 | 2004-08-16 | 삼성전자주식회사 | 이온빔 경사각 측정방법 및 장치 |
| US6828572B2 (en) * | 2003-04-01 | 2004-12-07 | Axcelis Technologies, Inc. | Ion beam incident angle detector for ion implant systems |
| DE10329383B4 (de) * | 2003-06-30 | 2006-07-27 | Advanced Micro Devices, Inc., Sunnyvale | Ionenstrahldetektor für Ionenimplantationsanlagen, Faraday-Behälter dafür und Verfahren zur Steuerung der Eigenschaften eines Ionenstrahls mittels des Ionenstrahldetektors |
| DE10329388B4 (de) * | 2003-06-30 | 2006-12-28 | Advanced Micro Devices, Inc., Sunnyvale | Faraday-Anordnung als Ionenstrahlmessvorrichtung für eine Ionenimplantationsanlage und Verfahren zu deren Betrieb |
| GB2427508B (en) * | 2004-01-06 | 2008-06-25 | Applied Materials Inc | Ion beam monitoring arrangement |
| JP2005317412A (ja) * | 2004-04-30 | 2005-11-10 | Riipuru:Kk | 電子ビームの強度分布測定方法及び強度分布測定装置 |
| KR100594272B1 (ko) * | 2004-05-07 | 2006-06-30 | 삼성전자주식회사 | 이동형 이온 빔 경사각 측정장치 및 그 장치를 이용한이온 빔 경사각 측정방법 |
| US7338683B2 (en) * | 2004-05-10 | 2008-03-04 | Superpower, Inc. | Superconductor fabrication processes |
| US6992310B1 (en) * | 2004-08-13 | 2006-01-31 | Axcelis Technologies, Inc. | Scanning systems and methods for providing ions from an ion beam to a workpiece |
| KR100642641B1 (ko) * | 2005-03-11 | 2006-11-10 | 삼성전자주식회사 | 중성빔 각도분포 측정 장치 |
| US7394073B2 (en) * | 2005-04-05 | 2008-07-01 | Varian Semiconductor Equipment Associates, Inc. | Methods and apparatus for ion beam angle measurement in two dimensions |
| US7459703B2 (en) * | 2005-08-31 | 2008-12-02 | Varian Semiconductor Equipment Associates, Inc. | Ion implant beam angle integrity monitoring and adjusting |
| KR100679263B1 (ko) * | 2005-09-22 | 2007-02-05 | 삼성전자주식회사 | 페러데이 시스템 및 그를 이용한 이온주입설비 |
| US7342239B2 (en) * | 2005-11-29 | 2008-03-11 | United Microelectronics Corp. | Ion implanation method and device using thereof |
| US7435977B2 (en) * | 2005-12-12 | 2008-10-14 | Axcelis Technologies, Inc. | Ion beam angle measurement systems and methods for ion implantation systems |
| US7476876B2 (en) * | 2005-12-21 | 2009-01-13 | Axcelis Technologies, Inc. | Ion beam angle measurement systems and methods employing varied angle slot arrays for ion implantation systems |
| US20080169435A1 (en) * | 2007-01-12 | 2008-07-17 | Applied Materials, Inc. | Ion beam monitoring arrangement |
-
2008
- 2008-02-14 US US12/031,643 patent/US8097866B2/en active Active
-
2009
- 2009-02-12 CN CN200980105055.6A patent/CN101952942B/zh active Active
- 2009-02-12 WO PCT/US2009/033933 patent/WO2009102875A2/en not_active Ceased
- 2009-02-12 JP JP2010546894A patent/JP5547658B2/ja active Active
- 2009-02-12 TW TW098104476A patent/TWI443706B/zh active
- 2009-02-12 KR KR1020107020169A patent/KR101568004B1/ko active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070210248A1 (en) | 2006-03-10 | 2007-09-13 | Bon-Woong Koo | Technique for monitoring and controlling a plasma process |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090206273A1 (en) | 2009-08-20 |
| KR20100138916A (ko) | 2010-12-31 |
| CN101952942B (zh) | 2013-10-23 |
| WO2009102875A3 (en) | 2009-11-05 |
| CN101952942A (zh) | 2011-01-19 |
| US8097866B2 (en) | 2012-01-17 |
| JP5547658B2 (ja) | 2014-07-16 |
| TWI443706B (zh) | 2014-07-01 |
| WO2009102875A2 (en) | 2009-08-20 |
| JP2011512627A (ja) | 2011-04-21 |
| TW200952024A (en) | 2009-12-16 |
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Legal Events
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| PA0105 | International application |
Patent event date: 20100909 Patent event code: PA01051R01D Comment text: International Patent Application |
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