KR101568004B1 - 입자 빔 검출 장치, 이를 포함하는 기판 처리 시스템 및 입자 처리 시스템, 및 입자 빔의 특성들을 측정하기 위한 방법 - Google Patents

입자 빔 검출 장치, 이를 포함하는 기판 처리 시스템 및 입자 처리 시스템, 및 입자 빔의 특성들을 측정하기 위한 방법 Download PDF

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KR101568004B1
KR101568004B1 KR1020107020169A KR20107020169A KR101568004B1 KR 101568004 B1 KR101568004 B1 KR 101568004B1 KR 1020107020169 A KR1020107020169 A KR 1020107020169A KR 20107020169 A KR20107020169 A KR 20107020169A KR 101568004 B1 KR101568004 B1 KR 101568004B1
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particle
particles
particle beam
detector
inlet opening
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KR20100138916A (ko
Inventor
죠셉 씨. 올슨
아툴 굽타
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베리안 세미콘덕터 이큅먼트 어소시에이츠, 인크.
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/317Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
    • H01J37/3171Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/30Electron-beam or ion-beam tubes for localised treatment of objects
    • H01J37/304Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/244Detection characterized by the detecting means
    • H01J2237/2446Position sensitive detectors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245Detection characterised by the variable being measured
    • H01J2237/24507Intensity, dose or other characteristics of particle beams or electromagnetic radiation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245Detection characterised by the variable being measured
    • H01J2237/24507Intensity, dose or other characteristics of particle beams or electromagnetic radiation
    • H01J2237/24514Beam diagnostics including control of the parameter or property diagnosed
    • H01J2237/24528Direction of beam or parts thereof in view of the optical axis, e.g. beam angle, angular distribution, beam divergence, beam convergence or beam landing angle on sample or workpiece
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245Detection characterised by the variable being measured
    • H01J2237/24507Intensity, dose or other characteristics of particle beams or electromagnetic radiation
    • H01J2237/24514Beam diagnostics including control of the parameter or property diagnosed
    • H01J2237/24542Beam profile

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measurement Of Radiation (AREA)
KR1020107020169A 2008-02-14 2009-02-12 입자 빔 검출 장치, 이를 포함하는 기판 처리 시스템 및 입자 처리 시스템, 및 입자 빔의 특성들을 측정하기 위한 방법 Active KR101568004B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/031,643 2008-02-14
US12/031,643 US8097866B2 (en) 2008-02-14 2008-02-14 Apparatus for measuring beam characteristics and a method thereof

Publications (2)

Publication Number Publication Date
KR20100138916A KR20100138916A (ko) 2010-12-31
KR101568004B1 true KR101568004B1 (ko) 2015-11-10

Family

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Family Applications (1)

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KR1020107020169A Active KR101568004B1 (ko) 2008-02-14 2009-02-12 입자 빔 검출 장치, 이를 포함하는 기판 처리 시스템 및 입자 처리 시스템, 및 입자 빔의 특성들을 측정하기 위한 방법

Country Status (6)

Country Link
US (1) US8097866B2 (enExample)
JP (1) JP5547658B2 (enExample)
KR (1) KR101568004B1 (enExample)
CN (1) CN101952942B (enExample)
TW (1) TWI443706B (enExample)
WO (1) WO2009102875A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2915577B2 (ja) 1993-03-16 1999-07-05 三菱重工業株式会社 ヘリコプタ
US8698107B2 (en) * 2011-01-10 2014-04-15 Varian Semiconductor Equipment Associates, Inc. Technique and apparatus for monitoring ion mass, energy, and angle in processing systems
DE102011018613B4 (de) * 2011-04-21 2016-05-12 Gsi Helmholtzzentrum Für Schwerionenforschung Gmbh Bestrahlungsanlage mit mehreren einstellbaren Messbereichen einer Strahlmonitoreinrichtung und Steuerverfahren für diese Bestrahlungsanlage
US9269536B2 (en) * 2012-04-17 2016-02-23 Varian Semiconductor Equipment Associates, Inc. Double ended electrode manipulator
JP7132847B2 (ja) * 2018-12-28 2022-09-07 住友重機械イオンテクノロジー株式会社 イオン注入装置および測定装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070210248A1 (en) 2006-03-10 2007-09-13 Bon-Woong Koo Technique for monitoring and controlling a plasma process

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4234797A (en) * 1979-05-23 1980-11-18 Nova Associates, Inc. Treating workpieces with beams
US4786814A (en) * 1983-09-16 1988-11-22 General Electric Company Method of reducing electrostatic charge on ion-implanted devices
US4751393A (en) * 1986-05-16 1988-06-14 Varian Associates, Inc. Dose measurement and uniformity monitoring system for ion implantation
JPS63216254A (ja) * 1987-03-04 1988-09-08 Seiko Instr & Electronics Ltd イオンビ−ムモニタ−用フアラデ−カツプ
US4943728A (en) * 1989-02-28 1990-07-24 Eaton Corporation Beam pattern control system for an ion implanter
JPH04112441A (ja) * 1990-08-31 1992-04-14 Toshiba Corp イオン注入装置及びそのクリーニング方法
US5583427A (en) * 1992-12-28 1996-12-10 Regents Of The University Of California Tomographic determination of the power distribution in electron beams
US5554926A (en) * 1994-08-01 1996-09-10 Regents Of The University Of California Modified Faraday cup
KR100219411B1 (ko) * 1995-11-24 1999-09-01 윤종용 반도체 이온주입설비의 패러데이컵 어셈블리
US5757018A (en) * 1995-12-11 1998-05-26 Varian Associates, Inc. Zero deflection magnetically-suppressed Faraday for ion implanters
FR2749402B1 (fr) * 1996-05-29 1998-08-07 Charpak Georges Dispositif d'imagerie radiographique a haute resolution
JP2000294180A (ja) 1999-04-06 2000-10-20 Nissin High Voltage Co Ltd ビーム電流検出機能付きビームプロファイルモニタ
US6300755B1 (en) * 1999-05-26 2001-10-09 Regents Of The University Of California Enhanced modified faraday cup for determination of power density distribution of electron beams
US6723998B2 (en) * 2000-09-15 2004-04-20 Varian Semiconductor Equipment Associates, Inc. Faraday system for ion implanters
US6690022B2 (en) * 2001-01-17 2004-02-10 Varian Semiconductor Equipment Associates, Inc. Ion beam incidence angle and beam divergence monitor
GB0107551D0 (en) * 2001-03-27 2001-05-16 Matra Bae Dynamics Uk Ltd Radiation monitor
KR100407579B1 (ko) * 2001-11-22 2003-11-28 삼성전자주식회사 이온 주입 시스템의 웨이퍼 홀딩 장치
US6956223B2 (en) * 2002-04-10 2005-10-18 Applied Materials, Inc. Multi-directional scanning of movable member and ion beam monitoring arrangement therefor
KR100444201B1 (ko) * 2002-04-18 2004-08-16 삼성전자주식회사 이온빔 경사각 측정방법 및 장치
US6828572B2 (en) * 2003-04-01 2004-12-07 Axcelis Technologies, Inc. Ion beam incident angle detector for ion implant systems
DE10329383B4 (de) * 2003-06-30 2006-07-27 Advanced Micro Devices, Inc., Sunnyvale Ionenstrahldetektor für Ionenimplantationsanlagen, Faraday-Behälter dafür und Verfahren zur Steuerung der Eigenschaften eines Ionenstrahls mittels des Ionenstrahldetektors
DE10329388B4 (de) * 2003-06-30 2006-12-28 Advanced Micro Devices, Inc., Sunnyvale Faraday-Anordnung als Ionenstrahlmessvorrichtung für eine Ionenimplantationsanlage und Verfahren zu deren Betrieb
GB2427508B (en) * 2004-01-06 2008-06-25 Applied Materials Inc Ion beam monitoring arrangement
JP2005317412A (ja) * 2004-04-30 2005-11-10 Riipuru:Kk 電子ビームの強度分布測定方法及び強度分布測定装置
KR100594272B1 (ko) * 2004-05-07 2006-06-30 삼성전자주식회사 이동형 이온 빔 경사각 측정장치 및 그 장치를 이용한이온 빔 경사각 측정방법
US7338683B2 (en) * 2004-05-10 2008-03-04 Superpower, Inc. Superconductor fabrication processes
US6992310B1 (en) * 2004-08-13 2006-01-31 Axcelis Technologies, Inc. Scanning systems and methods for providing ions from an ion beam to a workpiece
KR100642641B1 (ko) * 2005-03-11 2006-11-10 삼성전자주식회사 중성빔 각도분포 측정 장치
US7394073B2 (en) * 2005-04-05 2008-07-01 Varian Semiconductor Equipment Associates, Inc. Methods and apparatus for ion beam angle measurement in two dimensions
US7459703B2 (en) * 2005-08-31 2008-12-02 Varian Semiconductor Equipment Associates, Inc. Ion implant beam angle integrity monitoring and adjusting
KR100679263B1 (ko) * 2005-09-22 2007-02-05 삼성전자주식회사 페러데이 시스템 및 그를 이용한 이온주입설비
US7342239B2 (en) * 2005-11-29 2008-03-11 United Microelectronics Corp. Ion implanation method and device using thereof
US7435977B2 (en) * 2005-12-12 2008-10-14 Axcelis Technologies, Inc. Ion beam angle measurement systems and methods for ion implantation systems
US7476876B2 (en) * 2005-12-21 2009-01-13 Axcelis Technologies, Inc. Ion beam angle measurement systems and methods employing varied angle slot arrays for ion implantation systems
US20080169435A1 (en) * 2007-01-12 2008-07-17 Applied Materials, Inc. Ion beam monitoring arrangement

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070210248A1 (en) 2006-03-10 2007-09-13 Bon-Woong Koo Technique for monitoring and controlling a plasma process

Also Published As

Publication number Publication date
US20090206273A1 (en) 2009-08-20
KR20100138916A (ko) 2010-12-31
CN101952942B (zh) 2013-10-23
WO2009102875A3 (en) 2009-11-05
CN101952942A (zh) 2011-01-19
US8097866B2 (en) 2012-01-17
JP5547658B2 (ja) 2014-07-16
TWI443706B (zh) 2014-07-01
WO2009102875A2 (en) 2009-08-20
JP2011512627A (ja) 2011-04-21
TW200952024A (en) 2009-12-16

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