KR101565537B1 - 진공처리장치 및 그에 사용되는 커버부재 - Google Patents

진공처리장치 및 그에 사용되는 커버부재 Download PDF

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Publication number
KR101565537B1
KR101565537B1 KR1020090087379A KR20090087379A KR101565537B1 KR 101565537 B1 KR101565537 B1 KR 101565537B1 KR 1020090087379 A KR1020090087379 A KR 1020090087379A KR 20090087379 A KR20090087379 A KR 20090087379A KR 101565537 B1 KR101565537 B1 KR 101565537B1
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KR
South Korea
Prior art keywords
substrate
cover
tray
cover member
substrate support
Prior art date
Application number
KR1020090087379A
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English (en)
Korean (ko)
Other versions
KR20110029621A (ko
Inventor
김병준
Original Assignee
주식회사 원익아이피에스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 원익아이피에스 filed Critical 주식회사 원익아이피에스
Priority to KR1020090087379A priority Critical patent/KR101565537B1/ko
Priority to CN2009102074634A priority patent/CN102024674B/zh
Publication of KR20110029621A publication Critical patent/KR20110029621A/ko
Application granted granted Critical
Publication of KR101565537B1 publication Critical patent/KR101565537B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020090087379A 2009-09-16 2009-09-16 진공처리장치 및 그에 사용되는 커버부재 KR101565537B1 (ko)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020090087379A KR101565537B1 (ko) 2009-09-16 2009-09-16 진공처리장치 및 그에 사용되는 커버부재
CN2009102074634A CN102024674B (zh) 2009-09-16 2009-11-05 基片处理装置及为此使用的覆盖构件

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090087379A KR101565537B1 (ko) 2009-09-16 2009-09-16 진공처리장치 및 그에 사용되는 커버부재

Publications (2)

Publication Number Publication Date
KR20110029621A KR20110029621A (ko) 2011-03-23
KR101565537B1 true KR101565537B1 (ko) 2015-11-03

Family

ID=43865835

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090087379A KR101565537B1 (ko) 2009-09-16 2009-09-16 진공처리장치 및 그에 사용되는 커버부재

Country Status (2)

Country Link
KR (1) KR101565537B1 (zh)
CN (1) CN102024674B (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102479877A (zh) * 2010-11-19 2012-05-30 金元求 太阳能电池制造装置及其系统及太阳能电池
CN102479878A (zh) * 2010-11-19 2012-05-30 金元求 太阳能电池制造方法及根据该制造方法制造的太阳能电池
KR102095991B1 (ko) * 2016-10-06 2020-04-23 주식회사 원익아이피에스 기판처리장치
CN108054245A (zh) * 2018-01-11 2018-05-18 常州比太黑硅科技有限公司 一种干法制绒设备工艺反应腔
WO2023132549A1 (ko) * 2022-01-07 2023-07-13 주성엔지니어링(주) 기판처리장치

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031723A (ja) 2002-06-27 2004-01-29 Matsushita Electric Ind Co Ltd プラズマ処理装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0236276Y2 (zh) * 1985-01-10 1990-10-03
US6415736B1 (en) * 1999-06-30 2002-07-09 Lam Research Corporation Gas distribution apparatus for semiconductor processing
KR101444873B1 (ko) * 2007-12-26 2014-09-26 주성엔지니어링(주) 기판처리장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004031723A (ja) 2002-06-27 2004-01-29 Matsushita Electric Ind Co Ltd プラズマ処理装置

Also Published As

Publication number Publication date
CN102024674B (zh) 2013-04-10
KR20110029621A (ko) 2011-03-23
CN102024674A (zh) 2011-04-20

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