KR101561733B1 - 생성 방법, 저장 매체 및 정보 처리 장치 - Google Patents
생성 방법, 저장 매체 및 정보 처리 장치 Download PDFInfo
- Publication number
- KR101561733B1 KR101561733B1 KR1020130024305A KR20130024305A KR101561733B1 KR 101561733 B1 KR101561733 B1 KR 101561733B1 KR 1020130024305 A KR1020130024305 A KR 1020130024305A KR 20130024305 A KR20130024305 A KR 20130024305A KR 101561733 B1 KR101561733 B1 KR 101561733B1
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- South Korea
- Prior art keywords
- pattern
- mask pattern
- value
- generation condition
- mask
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F18/00—Pattern recognition
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
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- G—PHYSICS
- G16—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS
- G16Z—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR SPECIFIC APPLICATION FIELDS, NOT OTHERWISE PROVIDED FOR
- G16Z99/00—Subject matter not provided for in other main groups of this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
- H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
- H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/26—Phase shift masks [PSM]; PSM blanks; Preparation thereof
- G03F1/30—Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/32—Circuit design at the digital level
- G06F30/333—Design for testability [DFT], e.g. scan chain or built-in self-test [BIST]
-
- G—PHYSICS
- G21—NUCLEAR PHYSICS; NUCLEAR ENGINEERING
- G21K—HANDLING OF PARTICLES OR IONISING RADIATION NOT OTHERWISE PROVIDED FOR; IRRADIATION DEVICES; GAMMA RAY OR X-RAY MICROSCOPES
- G21K5/00—Irradiation devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Evolutionary Computation (AREA)
- General Engineering & Computer Science (AREA)
- Geometry (AREA)
- Bioinformatics & Cheminformatics (AREA)
- Artificial Intelligence (AREA)
- Life Sciences & Earth Sciences (AREA)
- Bioinformatics & Computational Biology (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Data Mining & Analysis (AREA)
- Evolutionary Biology (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Processing Or Creating Images (AREA)
- Architecture (AREA)
- Software Systems (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012059103A JP6039910B2 (ja) | 2012-03-15 | 2012-03-15 | 生成方法、プログラム及び情報処理装置 |
| JPJP-P-2012-059103 | 2012-03-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20130105388A KR20130105388A (ko) | 2013-09-25 |
| KR101561733B1 true KR101561733B1 (ko) | 2015-10-19 |
Family
ID=49134537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020130024305A Active KR101561733B1 (ko) | 2012-03-15 | 2013-03-07 | 생성 방법, 저장 매체 및 정보 처리 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8756536B2 (https=) |
| JP (1) | JP6039910B2 (https=) |
| KR (1) | KR101561733B1 (https=) |
| CN (1) | CN103309171B (https=) |
| TW (1) | TWI502287B (https=) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5627394B2 (ja) * | 2010-10-29 | 2014-11-19 | キヤノン株式会社 | マスクのデータ及び露光条件を決定するためのプログラム、決定方法、マスク製造方法、露光方法及びデバイス製造方法 |
| JP6192372B2 (ja) * | 2013-06-11 | 2017-09-06 | キヤノン株式会社 | マスクパターンの作成方法、プログラムおよび情報処理装置 |
| TWI620005B (zh) * | 2014-08-18 | 2018-04-01 | 聯華電子股份有限公司 | 佈局圖案分割方法 |
| JP2022523747A (ja) * | 2019-01-30 | 2022-04-26 | 深▲せん▼晶源信息技術有限公司 | 図形画像結合最適化のフォトエッチングマスクの最適化方法、装置および電子装置 |
| CN113703290B (zh) * | 2021-09-06 | 2024-05-28 | 深圳市先地图像科技有限公司 | 一种激光成像设备以及激光成像控制方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4394143B2 (ja) | 2005-07-22 | 2010-01-06 | 富士通マイクロエレクトロニクス株式会社 | フォトマスクパターンデータの作成方法、及び、そのフォトマスクを用いた半導体装置の製造方法 |
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| JPH08202020A (ja) * | 1995-01-31 | 1996-08-09 | Sony Corp | フォトマスクにおけるパターン形状評価方法、フォトマスク、フォトマスクの作製方法、フォトマスクのパターン形成方法、並びに露光方法 |
| JP3406506B2 (ja) * | 1997-03-24 | 2003-05-12 | シャープ株式会社 | フォトマスクのパターン補正方法およびフォトマスクのパターン補正装置 |
| US6127071A (en) * | 1999-06-22 | 2000-10-03 | International Business Machines Corporation | Serif mask design for correcting severe corner rounding and line end shortening in lithography |
| US6562638B1 (en) * | 1999-12-30 | 2003-05-13 | Cypress Semiconductor Corp. | Integrated scheme for predicting yield of semiconductor (MOS) devices from designed layout |
| US6563566B2 (en) | 2001-01-29 | 2003-05-13 | International Business Machines Corporation | System and method for printing semiconductor patterns using an optimized illumination and reticle |
| US7107573B2 (en) * | 2002-04-23 | 2006-09-12 | Canon Kabushiki Kaisha | Method for setting mask pattern and illumination condition |
| US7001693B2 (en) * | 2003-02-28 | 2006-02-21 | International Business Machines Corporation | Binary OPC for assist feature layout optimization |
| WO2004104699A1 (ja) * | 2003-05-26 | 2004-12-02 | Fujitsu Limited | パターン寸法補正 |
| JP4357287B2 (ja) * | 2003-12-18 | 2009-11-04 | 株式会社東芝 | 修正指針の発生方法、パターン作成方法、マスクの製造方法、半導体装置の製造方法及びプログラム |
| JP4247104B2 (ja) * | 2003-12-18 | 2009-04-02 | 株式会社東芝 | パターン検証方法、パターン検証システム |
| JP4593236B2 (ja) * | 2004-10-29 | 2010-12-08 | 株式会社日立ハイテクノロジーズ | 寸法計測走査型電子顕微鏡システム並びに回路パターン形状の評価システム及びその方法 |
| JP4592438B2 (ja) * | 2005-02-08 | 2010-12-01 | 株式会社東芝 | 半導体集積回路のレイアウト方法、製造方法及びレイアウトプログラム |
| JP2007140485A (ja) * | 2005-10-18 | 2007-06-07 | Sharp Corp | シミュレーションにおけるパラメータ抽出装置及びパラメータ抽出方法と、この方法により作成したマスクパターンデータ及びこのマスクパターンデータにより作成したフォトマスクと半導体装置 |
| US7921383B1 (en) * | 2006-01-11 | 2011-04-05 | Olambda, Inc | Photolithographic process simulation including efficient result computation for multiple process variation values |
| JP4791198B2 (ja) * | 2006-02-03 | 2011-10-12 | パナソニック株式会社 | フォトマスク、そのフォトマスクを用いたパターン形成方法及びマスクデータ作成方法 |
| JP2008033277A (ja) * | 2006-06-29 | 2008-02-14 | Sharp Corp | 設計データ又はマスクデータの補正方法および補正システム、設計データ又はマスクデータの検証方法および検証システム、半導体集積回路の歩留まり予測方法、デザインルールの改善方法、マスクの製造方法、並びに、半導体集積回路の製造方法 |
| US7886262B2 (en) * | 2006-08-15 | 2011-02-08 | Chew Marko P | System and method of maximizing integrated circuit manufacturing yield with fabrication process simulation driven layout optimization |
| US7995832B2 (en) * | 2007-01-11 | 2011-08-09 | Kla-Tencor Corporation | Photomask inspection and verification by lithography image reconstruction using imaging pupil filters |
| US8732625B2 (en) * | 2007-06-04 | 2014-05-20 | Asml Netherlands B.V. | Methods for performing model-based lithography guided layout design |
| JP2009093138A (ja) | 2007-09-19 | 2009-04-30 | Canon Inc | 原版データの生成方法、原版作成方法、露光方法、デバイス製造方法及び原版データを作成するためのプログラム |
| EP2040120B1 (en) * | 2007-09-19 | 2011-03-02 | Canon Kabushiki Kaisha | Mask data generation method, mask fabrication method, exposure method, device fabrication method, and program |
| JP4402145B2 (ja) * | 2007-10-03 | 2010-01-20 | キヤノン株式会社 | 算出方法、生成方法、プログラム、露光方法及び原版作成方法 |
| JP5106220B2 (ja) * | 2008-04-10 | 2012-12-26 | キヤノン株式会社 | 原版データ生成プログラム、原版データ生成方法、照明条件決定プログラム、照明条件決定方法およびデバイス製造方法 |
| JP5300354B2 (ja) * | 2008-07-11 | 2013-09-25 | キヤノン株式会社 | 生成方法、原版作成方法、露光方法、デバイス製造方法及びプログラム |
| US7901850B2 (en) * | 2008-09-01 | 2011-03-08 | D2S, Inc. | Method and system for design of a reticle to be manufactured using variable shaped beam lithography |
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| US8099684B2 (en) * | 2009-01-08 | 2012-01-17 | International Business Machines Corporation | Methodology of placing printing assist feature for random mask layout |
| JP5607308B2 (ja) * | 2009-01-09 | 2014-10-15 | キヤノン株式会社 | 原版データ生成プログラムおよび方法 |
| NL2005523A (en) * | 2009-10-28 | 2011-05-02 | Asml Netherlands Bv | Selection of optimum patterns in a design layout based on diffraction signature analysis. |
| US8739079B2 (en) | 2009-10-30 | 2014-05-27 | Canon Kabushiki Kaisha | Recording medium and determination method |
| DE102010030758B4 (de) * | 2010-06-30 | 2018-07-19 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Steuerung kritischer Abmessungen in optischen Abbildungsprozessen für die Halbleiterherstellung durch Extraktion von Abbildungsfehlern auf der Grundlage abbildungsanlagenspezifischer Intensitätsmessungen und Simulationen |
| WO2012013638A1 (en) * | 2010-07-26 | 2012-02-02 | Carl Zeiss Sms Ltd. | Lithographic targets for uniformity control |
| JP5686567B2 (ja) * | 2010-10-19 | 2015-03-18 | キヤノン株式会社 | 露光条件及びマスクパターンを決定するプログラム及び方法 |
| JP5627394B2 (ja) | 2010-10-29 | 2014-11-19 | キヤノン株式会社 | マスクのデータ及び露光条件を決定するためのプログラム、決定方法、マスク製造方法、露光方法及びデバイス製造方法 |
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2012
- 2012-03-15 JP JP2012059103A patent/JP6039910B2/ja active Active
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2013
- 2013-03-01 TW TW102107258A patent/TWI502287B/zh active
- 2013-03-01 US US13/781,873 patent/US8756536B2/en active Active
- 2013-03-07 KR KR1020130024305A patent/KR101561733B1/ko active Active
- 2013-03-12 CN CN201310076853.9A patent/CN103309171B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4394143B2 (ja) | 2005-07-22 | 2010-01-06 | 富士通マイクロエレクトロニクス株式会社 | フォトマスクパターンデータの作成方法、及び、そのフォトマスクを用いた半導体装置の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20130105388A (ko) | 2013-09-25 |
| CN103309171B (zh) | 2016-01-20 |
| US20130246982A1 (en) | 2013-09-19 |
| US8756536B2 (en) | 2014-06-17 |
| TW201341972A (zh) | 2013-10-16 |
| TWI502287B (zh) | 2015-10-01 |
| JP6039910B2 (ja) | 2016-12-07 |
| CN103309171A (zh) | 2013-09-18 |
| JP2013195440A (ja) | 2013-09-30 |
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