KR101555405B1 - 세라믹 기판 및 그 제조방법 - Google Patents

세라믹 기판 및 그 제조방법 Download PDF

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Publication number
KR101555405B1
KR101555405B1 KR1020120033148A KR20120033148A KR101555405B1 KR 101555405 B1 KR101555405 B1 KR 101555405B1 KR 1020120033148 A KR1020120033148 A KR 1020120033148A KR 20120033148 A KR20120033148 A KR 20120033148A KR 101555405 B1 KR101555405 B1 KR 101555405B1
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KR
South Korea
Prior art keywords
ceramic substrate
substrate
green sheet
vias
ceramic
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KR1020120033148A
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English (en)
Korean (ko)
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KR20120112222A (ko
Inventor
도시히사 노무라
겐지 스즈키
가즈시게 아키타
Original Assignee
니혼도꾸슈도교 가부시키가이샤
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Publication of KR20120112222A publication Critical patent/KR20120112222A/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0287—Programmable, customizable or modifiable circuits having an universal lay-out, e.g. pad or land grid patterns or mesh patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/0949—Pad close to a hole, not surrounding the hole
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09609—Via grid, i.e. two-dimensional array of vias or holes in a single plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/005—Punching of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020120033148A 2011-04-01 2012-03-30 세라믹 기판 및 그 제조방법 Active KR101555405B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2011-082161 2011-04-01
JP2011082161A JP5670806B2 (ja) 2011-04-01 2011-04-01 セラミック基板及びその製造方法

Publications (2)

Publication Number Publication Date
KR20120112222A KR20120112222A (ko) 2012-10-11
KR101555405B1 true KR101555405B1 (ko) 2015-09-23

Family

ID=46925759

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120033148A Active KR101555405B1 (ko) 2011-04-01 2012-03-30 세라믹 기판 및 그 제조방법

Country Status (4)

Country Link
US (1) US9049786B2 (enExample)
JP (1) JP5670806B2 (enExample)
KR (1) KR101555405B1 (enExample)
CN (1) CN102740590B (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5798435B2 (ja) 2011-03-07 2015-10-21 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
JP5777997B2 (ja) * 2011-03-07 2015-09-16 日本特殊陶業株式会社 電子部品検査装置用配線基板およびその製造方法
CN115626828A (zh) * 2017-10-20 2023-01-20 飞罗得材料技术股份有限公司 陶瓷、探针引导构件、探针卡及封装检查用插座
KR101961101B1 (ko) * 2017-12-07 2019-03-22 (주)티에스이 무프레임 구조를 갖는 테스트용 러버 소켓 및 그의 제작 방법
JP2020030127A (ja) * 2018-08-23 2020-02-27 日本特殊陶業株式会社 電気検査用基板およびその製造方法
JP7102525B2 (ja) * 2018-11-29 2022-07-19 コステックシス カンパニー リミテッド 入出力回路が内蔵された電力増幅器用パッケージの製造方法
CN115307617A (zh) * 2022-07-13 2022-11-08 广州奥鑫通讯设备有限公司 一种用于光纤陀螺仪的光器件及其制备方法
CN115291340A (zh) * 2022-07-13 2022-11-04 广州奥鑫通讯设备有限公司 一种用于光纤陀螺仪的光器件及其制备方法
CN116278242A (zh) * 2023-03-20 2023-06-23 瓷金科技(深圳)有限公司 多层陶瓷管壳及其生坯以及两者的制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002257858A (ja) 2001-02-28 2002-09-11 Ibiden Co Ltd プローブカード
US20060086703A1 (en) 2004-08-18 2006-04-27 Ling Liu System and method for singulating a substrate

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1065345A (ja) * 1996-08-20 1998-03-06 Hitachi Ltd 多層セラミック基板とその製造方法及びパターン検査装置
JP2003060358A (ja) * 2001-08-10 2003-02-28 Ngk Spark Plug Co Ltd セラミック配線基板の製造方法
JP2009074823A (ja) 2007-09-19 2009-04-09 Ngk Spark Plug Co Ltd 電子部品検査装置用配線基板およびその製造方法
JP4542587B2 (ja) 2008-02-04 2010-09-15 日本特殊陶業株式会社 電子部品検査装置用配線基板
JP5449719B2 (ja) * 2008-08-11 2014-03-19 日本特殊陶業株式会社 配線基板、ｉｃ電気特性検査用配線基板、及び配線基板の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002257858A (ja) 2001-02-28 2002-09-11 Ibiden Co Ltd プローブカード
US20060086703A1 (en) 2004-08-18 2006-04-27 Ling Liu System and method for singulating a substrate

Also Published As

Publication number Publication date
US9049786B2 (en) 2015-06-02
KR20120112222A (ko) 2012-10-11
US20120247821A1 (en) 2012-10-04
JP5670806B2 (ja) 2015-02-18
CN102740590B (zh) 2015-10-21
CN102740590A (zh) 2012-10-17
JP2012215527A (ja) 2012-11-08

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