KR101545430B1 - 다층 성형체 및 그 제조 방법, 및 전자파 실드 부재 및 방열성 부재 - Google Patents

다층 성형체 및 그 제조 방법, 및 전자파 실드 부재 및 방열성 부재 Download PDF

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KR101545430B1
KR101545430B1 KR1020137032169A KR20137032169A KR101545430B1 KR 101545430 B1 KR101545430 B1 KR 101545430B1 KR 1020137032169 A KR1020137032169 A KR 1020137032169A KR 20137032169 A KR20137032169 A KR 20137032169A KR 101545430 B1 KR101545430 B1 KR 101545430B1
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diamine
polyimide
resin
dianhydride
formula
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KR20140014270A (ko
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겐지 이이다
유스케 도미타
기요미 이마가와
시게오 기바
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미쯔이가가꾸가부시끼가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/025—Particulate layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212—Electromagnetic interference shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/302—Conductive

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Laminated Bodies (AREA)
KR1020137032169A 2011-12-26 2012-12-20 다층 성형체 및 그 제조 방법, 및 전자파 실드 부재 및 방열성 부재 Active KR101545430B1 (ko)

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JPJP-P-2011-283611 2011-12-26
JP2011283611 2011-12-26
PCT/JP2012/008167 WO2013099173A1 (ja) 2011-12-26 2012-12-20 多層成形体およびその製造方法、並びに、電磁波シールド部材および放熱性部材

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KR20140014270A KR20140014270A (ko) 2014-02-05
KR101545430B1 true KR101545430B1 (ko) 2015-08-18

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JP (2) JP5330626B1 (enrdf_load_stackoverflow)
KR (1) KR101545430B1 (enrdf_load_stackoverflow)
CN (1) CN103732403B (enrdf_load_stackoverflow)
TW (1) TWI546196B (enrdf_load_stackoverflow)
WO (1) WO2013099173A1 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019098701A1 (ko) * 2017-11-15 2019-05-23 주식회사 아모그린텍 그라파이트-고분자 복합재 제조용 조성물 및 이를 통해 구현된 그라파이트-고분자 복합재
US11839855B2 (en) 2017-06-09 2023-12-12 Amogreentech Co., Ltd. Filter medium, manufacturing method therefor, and filter unit including same

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160242321A1 (en) * 2015-02-13 2016-08-18 Laird Technologies, Inc. Mid-plates and electromagnetic interference (emi) board level shields with embedded and/or internal heat spreaders
JP2018010888A (ja) * 2016-07-11 2018-01-18 藤森工業株式会社 電磁波シールド材
JP2018010889A (ja) * 2016-07-11 2018-01-18 藤森工業株式会社 電磁波シールド材
JP6963602B2 (ja) * 2017-04-21 2021-11-10 三井化学株式会社 半導体基板の製造方法
JP7048277B2 (ja) * 2017-11-28 2022-04-05 藤森工業株式会社 カバーレイフィルムおよびそれを用いた電子機器
JP7045173B2 (ja) * 2017-11-28 2022-03-31 藤森工業株式会社 カバーレイフィルムおよびそれを用いた電子機器
KR102068315B1 (ko) * 2018-07-27 2020-01-20 주식회사 이엠따블유 열 확산 모듈 및 이의 제조 방법
KR102119752B1 (ko) * 2018-10-02 2020-06-05 주식회사 이엠따블유 연성회로기판 모듈 및 이의 제조방법

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JP2010084072A (ja) 2008-10-01 2010-04-15 Mitsui Chemicals Inc 接着樹脂組成物、およびそれを含む積層体
WO2011089922A1 (ja) 2010-01-25 2011-07-28 三井化学株式会社 ポリイミド樹脂組成物、それを含む接着剤、積層体およびデバイス

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JP2010202729A (ja) * 2009-03-02 2010-09-16 Hitachi Chemical Dupont Microsystems Ltd フレキシブルデバイス基板用ポリイミド前駆体樹脂組成物及びそれを用いたフレキシブルデバイスの製造方法、フレキシブルデバイス
JP5417144B2 (ja) * 2009-12-10 2014-02-12 旭化成イーマテリアルズ株式会社 ポリイミド
JP5442491B2 (ja) * 2010-02-26 2014-03-12 新日鉄住金化学株式会社 熱伝導性金属−絶縁樹脂基板及びその製造方法
JP5643536B2 (ja) * 2010-04-16 2014-12-17 三井化学株式会社 熱伝導性接着樹脂組成物、それを含む積層体および半導体装置

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WO2009110387A1 (ja) 2008-03-06 2009-09-11 新日鐵化学株式会社 フレキシブル基板用積層体及び熱伝導性ポリイミドフィルム
JP2010084072A (ja) 2008-10-01 2010-04-15 Mitsui Chemicals Inc 接着樹脂組成物、およびそれを含む積層体
WO2011089922A1 (ja) 2010-01-25 2011-07-28 三井化学株式会社 ポリイミド樹脂組成物、それを含む接着剤、積層体およびデバイス

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11839855B2 (en) 2017-06-09 2023-12-12 Amogreentech Co., Ltd. Filter medium, manufacturing method therefor, and filter unit including same
WO2019098701A1 (ko) * 2017-11-15 2019-05-23 주식회사 아모그린텍 그라파이트-고분자 복합재 제조용 조성물 및 이를 통해 구현된 그라파이트-고분자 복합재
KR20190055772A (ko) * 2017-11-15 2019-05-23 주식회사 아모그린텍 그라파이트-고분자 복합재 제조용 조성물 및 이를 통해 구현된 그라파이트-고분자 복합재
US11359064B2 (en) 2017-11-15 2022-06-14 Amogreentech Co., Ltd. Composition for producing graphite-polymer composite and graphite-polymer composite produced therethrough
KR102673198B1 (ko) 2017-11-15 2024-06-07 주식회사 아모그린텍 그라파이트-고분자 복합재 제조용 조성물 및 이를 통해 구현된 그라파이트-고분자 복합재

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TWI546196B (zh) 2016-08-21
JP5996491B2 (ja) 2016-09-21
CN103732403A (zh) 2014-04-16
CN103732403B (zh) 2015-12-02
KR20140014270A (ko) 2014-02-05
JP2013256125A (ja) 2013-12-26
JPWO2013099173A1 (ja) 2015-04-30
TW201325911A (zh) 2013-07-01
WO2013099173A1 (ja) 2013-07-04
JP5330626B1 (ja) 2013-10-30

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