JP5330626B1 - 電磁波シールド部材 - Google Patents
電磁波シールド部材 Download PDFInfo
- Publication number
- JP5330626B1 JP5330626B1 JP2013519900A JP2013519900A JP5330626B1 JP 5330626 B1 JP5330626 B1 JP 5330626B1 JP 2013519900 A JP2013519900 A JP 2013519900A JP 2013519900 A JP2013519900 A JP 2013519900A JP 5330626 B1 JP5330626 B1 JP 5330626B1
- Authority
- JP
- Japan
- Prior art keywords
- polyimide
- diamine
- general formula
- tetracarboxylic dianhydride
- shielding member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920005989 resin Polymers 0.000 claims abstract description 168
- 239000011347 resin Substances 0.000 claims abstract description 168
- 229920001721 polyimide Polymers 0.000 claims abstract description 155
- 239000000945 filler Substances 0.000 claims abstract description 80
- 239000011230 binding agent Substances 0.000 claims abstract description 76
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 70
- 239000002131 composite material Substances 0.000 claims abstract description 63
- 239000009719 polyimide resin Substances 0.000 claims abstract description 61
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 55
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 48
- 239000011256 inorganic filler Substances 0.000 claims abstract description 28
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 28
- 230000009477 glass transition Effects 0.000 claims abstract description 18
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 101
- 239000010410 layer Substances 0.000 claims description 95
- 239000004642 Polyimide Substances 0.000 claims description 89
- 150000004985 diamines Chemical class 0.000 claims description 54
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 54
- 230000001070 adhesive effect Effects 0.000 claims description 44
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical group C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 44
- 239000000853 adhesive Substances 0.000 claims description 43
- -1 aliphatic diamine Chemical class 0.000 claims description 33
- 125000003118 aryl group Chemical group 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 25
- 125000004429 atom Chemical group 0.000 claims description 24
- 125000003277 amino group Chemical group 0.000 claims description 22
- 125000005529 alkyleneoxy group Chemical group 0.000 claims description 17
- 150000001875 compounds Chemical class 0.000 claims description 16
- 150000004984 aromatic diamines Chemical class 0.000 claims description 15
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 125000002947 alkylene group Chemical group 0.000 claims description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 11
- 238000006068 polycondensation reaction Methods 0.000 claims description 11
- 150000001412 amines Chemical class 0.000 claims description 8
- 125000004433 nitrogen atom Chemical group N* 0.000 claims description 7
- 125000004430 oxygen atom Chemical group O* 0.000 claims description 7
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 229910052757 nitrogen Inorganic materials 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 claims description 5
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 3
- TUQQUUXMCKXGDI-UHFFFAOYSA-N bis(3-aminophenyl)methanone Chemical compound NC1=CC=CC(C(=O)C=2C=C(N)C=CC=2)=C1 TUQQUUXMCKXGDI-UHFFFAOYSA-N 0.000 claims description 3
- ZLSMCQSGRWNEGX-UHFFFAOYSA-N bis(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=C(N)C=C1 ZLSMCQSGRWNEGX-UHFFFAOYSA-N 0.000 claims description 3
- 125000004427 diamine group Chemical group 0.000 claims description 3
- 239000010408 film Substances 0.000 description 29
- 239000002966 varnish Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 23
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 18
- 230000017525 heat dissipation Effects 0.000 description 17
- 239000000463 material Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 12
- 238000002156 mixing Methods 0.000 description 12
- 239000011248 coating agent Substances 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 11
- 239000000758 substrate Substances 0.000 description 11
- 238000001035 drying Methods 0.000 description 10
- 229920005575 poly(amic acid) Polymers 0.000 description 10
- 230000002787 reinforcement Effects 0.000 description 9
- 239000002253 acid Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 8
- 239000000956 alloy Substances 0.000 description 8
- 229910000859 α-Fe Inorganic materials 0.000 description 8
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 7
- 229910052582 BN Inorganic materials 0.000 description 6
- 229920002799 BoPET Polymers 0.000 description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 6
- 238000001723 curing Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000004593 Epoxy Substances 0.000 description 5
- 239000003431 cross linking reagent Substances 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 125000000962 organic group Chemical group 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 229920000049 Carbon (fiber) Polymers 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000004962 Polyamide-imide Substances 0.000 description 4
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 4
- 239000004917 carbon fiber Substances 0.000 description 4
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 238000006358 imidation reaction Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 229920002312 polyamide-imide Polymers 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000002243 precursor Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 3
- AUHZEENZYGFFBQ-UHFFFAOYSA-N 1,3,5-trimethylbenzene Chemical compound CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 description 3
- LJGHYPLBDBRCRZ-UHFFFAOYSA-N 3-(3-aminophenyl)sulfonylaniline Chemical compound NC1=CC=CC(S(=O)(=O)C=2C=C(N)C=CC=2)=C1 LJGHYPLBDBRCRZ-UHFFFAOYSA-N 0.000 description 3
- DKKYOQYISDAQER-UHFFFAOYSA-N 3-[3-(3-aminophenoxy)phenoxy]aniline Chemical compound NC1=CC=CC(OC=2C=C(OC=3C=C(N)C=CC=3)C=CC=2)=C1 DKKYOQYISDAQER-UHFFFAOYSA-N 0.000 description 3
- KMKWGXGSGPYISJ-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]propan-2-yl]phenoxy]aniline Chemical compound C=1C=C(OC=2C=CC(N)=CC=2)C=CC=1C(C)(C)C(C=C1)=CC=C1OC1=CC=C(N)C=C1 KMKWGXGSGPYISJ-UHFFFAOYSA-N 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- JFDZBHWFFUWGJE-UHFFFAOYSA-N benzonitrile Chemical compound N#CC1=CC=CC=C1 JFDZBHWFFUWGJE-UHFFFAOYSA-N 0.000 description 3
- XMSVKICKONKVNM-UHFFFAOYSA-N bicyclo[2.2.1]heptane-3,4-diamine Chemical class C1CC2(N)C(N)CC1C2 XMSVKICKONKVNM-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 125000006159 dianhydride group Chemical group 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- 239000012046 mixed solvent Substances 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 3
- YKNMIGJJXKBHJE-UHFFFAOYSA-N (3-aminophenyl)-(4-aminophenyl)methanone Chemical compound C1=CC(N)=CC=C1C(=O)C1=CC=CC(N)=C1 YKNMIGJJXKBHJE-UHFFFAOYSA-N 0.000 description 2
- FYGHSUNMUKGBRK-UHFFFAOYSA-N 1,2,3-trimethylbenzene Chemical compound CC1=CC=CC(C)=C1C FYGHSUNMUKGBRK-UHFFFAOYSA-N 0.000 description 2
- NBAUUNCGSMAPFM-UHFFFAOYSA-N 3-(3,4-dicarboxyphenyl)phthalic acid Chemical compound C1=C(C(O)=O)C(C(=O)O)=CC=C1C1=CC=CC(C(O)=O)=C1C(O)=O NBAUUNCGSMAPFM-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- WUPRYUDHUFLKFL-UHFFFAOYSA-N 4-[3-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=CC(OC=2C=CC(N)=CC=2)=C1 WUPRYUDHUFLKFL-UHFFFAOYSA-N 0.000 description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 2
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- 239000004902 Softening Agent Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 238000002835 absorbance Methods 0.000 description 2
- 229920000800 acrylic rubber Polymers 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- 125000003236 benzoyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C(*)=O 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- SSJXIUAHEKJCMH-UHFFFAOYSA-N cyclohexane-1,2-diamine Chemical compound NC1CCCCC1N SSJXIUAHEKJCMH-UHFFFAOYSA-N 0.000 description 2
- GEQHKFFSPGPGLN-UHFFFAOYSA-N cyclohexane-1,3-diamine Chemical compound NC1CCCC(N)C1 GEQHKFFSPGPGLN-UHFFFAOYSA-N 0.000 description 2
- VKIRRGRTJUUZHS-UHFFFAOYSA-N cyclohexane-1,4-diamine Chemical compound NC1CCC(N)CC1 VKIRRGRTJUUZHS-UHFFFAOYSA-N 0.000 description 2
- 238000006297 dehydration reaction Methods 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- SDIXRDNYIMOKSG-UHFFFAOYSA-L disodium methyl arsenate Chemical compound [Na+].[Na+].C[As]([O-])([O-])=O SDIXRDNYIMOKSG-UHFFFAOYSA-L 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 125000000816 ethylene group Chemical group [H]C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 229910001416 lithium ion Inorganic materials 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- 239000012762 magnetic filler Substances 0.000 description 2
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001281 polyalkylene Polymers 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920006122 polyamide resin Polymers 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- HHVIBTZHLRERCL-UHFFFAOYSA-N sulfonyldimethane Chemical compound CS(C)(=O)=O HHVIBTZHLRERCL-UHFFFAOYSA-N 0.000 description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- UGCMFUQMPWJOON-UHFFFAOYSA-N (1-cycloheptylcycloheptyl)methanediamine Chemical compound C1CCCCCC1C1(C(N)N)CCCCCC1 UGCMFUQMPWJOON-UHFFFAOYSA-N 0.000 description 1
- GWNMOARSGRXJMV-UHFFFAOYSA-N (1-cycloheptylcycloheptyl)oxymethanediamine Chemical compound C1CCCCCC1C1(OC(N)N)CCCCCC1 GWNMOARSGRXJMV-UHFFFAOYSA-N 0.000 description 1
- RXCOGDYOZQGGMK-UHFFFAOYSA-N (3,4-diaminophenyl)-phenylmethanone Chemical compound C1=C(N)C(N)=CC=C1C(=O)C1=CC=CC=C1 RXCOGDYOZQGGMK-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- BCMCBBGGLRIHSE-UHFFFAOYSA-N 1,3-benzoxazole Chemical compound C1=CC=C2OC=NC2=C1 BCMCBBGGLRIHSE-UHFFFAOYSA-N 0.000 description 1
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- MNKDMOZTFOSBSA-UHFFFAOYSA-N 1-(1-aminocycloheptyl)cycloheptan-1-amine Chemical compound C1CCCCCC1(N)C1(N)CCCCCC1 MNKDMOZTFOSBSA-UHFFFAOYSA-N 0.000 description 1
- SPJXZYLLLWOSLQ-UHFFFAOYSA-N 1-[(1-aminocyclohexyl)methyl]cyclohexan-1-amine Chemical compound C1CCCCC1(N)CC1(N)CCCCC1 SPJXZYLLLWOSLQ-UHFFFAOYSA-N 0.000 description 1
- IPJGAEWUPXWFPL-UHFFFAOYSA-N 1-[3-(2,5-dioxopyrrol-1-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC(N2C(C=CC2=O)=O)=C1 IPJGAEWUPXWFPL-UHFFFAOYSA-N 0.000 description 1
- YNSSPVZNXLACMW-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)-3-ethyl-5-methylphenyl]methyl]-2-ethyl-6-methylphenyl]pyrrole-2,5-dione Chemical compound C=1C(C)=C(N2C(C=CC2=O)=O)C(CC)=CC=1CC(C=C1CC)=CC(C)=C1N1C(=O)C=CC1=O YNSSPVZNXLACMW-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- CYRDONYNCYQNAL-UHFFFAOYSA-N 1-methylheptane-1,2,4,5-tetracarboxylic acid Chemical compound CCC(C(O)=O)C(C(O)=O)CC(C(O)=O)C(C)C(O)=O CYRDONYNCYQNAL-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
前記一般式(1)で表されるベンゾフェノン骨格を有する芳香族テトラカルボン酸二無水物と前記一般式(2)で表されるベンゾフェノン骨格を有する芳香族ジアミンの合計含有量が、前記ポリイミド樹脂を構成するテトラカルボン酸二無水物とジアミンの合計に対して5モル%以上、49モル%以下であり、かつアミン当量が4,000以上、20,000以下であるポリイミド樹脂を含むものがある。
図1に、第1実施形態に係る多層成形体の一例の模式的断面図を示す。図1の多層成形体1は、密着性補強樹脂層11とバインダー樹脂/フィラー複合体21の積層体からなる。密着性補強樹脂層11の一主面上にバインダー樹脂/フィラー複合体21が積層されている。密着性補強樹脂層11は、バインダー樹脂/フィラー複合体21の支持体としての役割を担う。バインダー樹脂/フィラー複合体21は、放熱性機能を有する。
次に、上記実施形態とは異なる多層成形体の一例について説明する。第2実施形態に係る多層成形体は、以下の点を除く基本的な構成は、上記第1実施形態と同様である。すなわち、第1実施形態に係る多層成形体は、密着性補強樹脂層が1層のみであったが、第2実施形態に係る多層成形体は、密着性補強樹脂層が2層ある点において相違する。
第3実施形態に係る多層成形体は、以下の点を除く基本的な構成は、上記第1実施形態と同様である。すなわち、第1実施形態に係る多層成形体は、放熱性部材に適用するものであったが、第3実施形態に係る多層成形体は、電磁波シールド部材に用いるものである点において相違する。
第4実施形態に係る多層成形体は、以下の点を除く基本的な構成は、上記第1実施形態と同様である。すなわち、第1実施形態に係る多層成形体は、放熱性部材に適用するものであったが、第4実施形態に係る多層成形体は、電磁波シールド機能と放熱性機能を兼ね備える放熱性電磁波シールド部材に好適なものである点において相違する。
以下、本発明を実施例によってより詳細に説明するが、本発明は以下の実施例によって何ら限定されるものではない。
(ポリイミドワニスの調製)
N−メチルピロリドン(以下「NMP」)とメシチレンを7:3の比率で調製した溶媒中に、3種類のジアミン(APB,14EL,XTJ−542)と、2種類の酸二無水物(s−BPDA、BTDA)とを、APB:14EL:XTJ−542:s−BPDA:BTDA=0.8:0.1:0.1:0.79:0.2のモル比で配合した。
APB;1,3−ビス(3−アミノフェノキシ)ベンゼン(三井化学社製)
14EL;ポリテトラメチレンオキシド ジ−p−アミノベンゾエート(エラスマー1000)(伊原ケミカル社製)
XTJ−542;下記式(11)で表されるポリエーテルアミン(製品名:ジェファーミン、HUNTSMAN社製)
s−BPDA; 3,3',4,4'−ビフェニルテトラカルボン酸二無水物(JFEケミカル社製)
BTDA; 3,3',4,4'−ベンゾフェノンテトラカルボン酸二無水物
バインダー樹脂として、主剤にエピフォーム(登録商標)R−2100(ソマール社製)を、硬化剤にエピフォーム(登録商標)H30(ソマール社製)を用いた。主剤、硬化剤それぞれにフィラーとしてアルミナフィラーDAW07(デンカ社製)を樹脂に対して48体積%相当配合し、自転公転式攪拌機「泡取り錬太郎AR−250」(シンキー社製)を用いて20分程度攪拌した。冷却後、主剤とフィラーのコンパウンドと硬化剤とフィラーのコンパウンドを、R2100:H−30=5:1の比率となるように配合し、泡取り錬太郎を用いて1分程度攪拌することで、バインダー樹脂/フィラー複合体の硬化前液状コンパウンドを作製した。
上記ポリイミドワニスを、離型処理が施されたPETフィルム上に10mm/secの速度で塗工した。塗工方法は特に限定されないが、例えば、ロールコーター、ダイコーター、バーコーター、リップコーター、コンマコーターなどを使用することが可能である。得られた塗膜を180℃で10分間乾燥させて溶媒を除去し、ポリイミド層(膜厚=約5μm)を得た。次に、前記手法で得られたバインダー樹脂/フィラー複合体の硬化前液状コンパウンドをポリイミド膜表面に塗布・乾燥した。得られた塗膜を80℃×1時間で加熱硬化し、約50μm厚みのバインダー樹脂/フィラー複合体を形成した。その後、前記ポリイミド層からPETフィルムを剥離し、シート状の多層成形体を得た。
得られたポリイミドワニスを、離型処理されたPETフィルム上に10mm/秒の速度で塗工した後、200℃で10分間乾燥させて溶媒を除去した。乾燥後に得られたフィルムを、ピンセットでPETフィルムから剥離して、膜厚50μmのポリイミドフィルムを得た。作製したポリイミドフィルムの貯蔵弾性率E'と損失弾性率E''を、TA instruments社製のRSA−IIを用いて、固体粘弾性の温度分散測定を引張モード、測定周波数1Hzで測定した。そして、損失正接tanδ=E''/E'のピーク値からガラス転移温度を導出した。
作製したシート状多層成形体(サンプル)の耐熱性を評価した。対象サンプルを幅10mm×長さ100mmの短冊状に切り出し、サンプルフィルムとした。このサンプルフィルムを所定の温度に加熱した半田浴槽上に浮かべサンプルフィルムの耐熱性を評価した。その結果を表1Aに示す。
◎: 280℃、30秒後においても溶融せずに形状を維持し、さらにサンプルフィルムを引き上げられるもの
○: 260℃、60秒後においても溶融せずに形状を維持するもの
×: 260℃、60秒以内で溶融するもの
サンプルの柔軟性(可撓性)を評価する指標として耐折性評価を行った。対象サンプルを幅10mm×長さ50mmの短冊状に切り出しサンプルフィルムとした。サンプルフィルムの片側を折り曲げ試験機の治具に固定し、R=3mmの折り曲げ部を介したサンプルの反対側に100gの錘をぶらさげて、サンプルの耐折性を評価した。得られた結果を表1A、表1Bに示す。
○:100回以上の耐折性を有するサンプル
×:100回未満で破断するサンプル
作製したサンプルの熱伝導率を評価した。具体的には、サンプルの「熱拡散率α」、「比熱Cp」および「密度ρ」を測定し、それらの測定値を以下の数式1にあてはめて算出した。
(数式1) 熱伝導率λ=熱拡散率α×比熱Cp×密度ρ
○:1.0W/m・K以上の熱伝導率
×:1.0W/m・K未満の熱伝導率
IR法によりイミド化率を求めた。具体的には、1480〜1500cm−1近傍のベンゼン環に基づくピークを基準とし、その吸光度をA、1720cm−1近傍のイミド環に基づくピークの吸光度をBとする。対象サンプルを250℃×1時間で焼成して作製したフィルムのB/Aを基準値C(イミド化率100%)とする。一方で、対象サンプルを150℃×30分で焼成して作製したフィルムのB/Aを基準値Cで割り、100をかけた値をイミド化率(%)とした。
バインダー樹脂/フィラー複合体のフィラーDAW07の配合量を65体積%とした以外は、実施例1と同様の方法により多層成形体を作製し、評価した。
密着性補強樹脂層であるポリイミド層の乾燥後厚みを3μmとした以外は、実施例1と同様に多層成形体を作製し、評価した。
密着性補強樹脂層であるポリイミド層の乾燥後厚みを7μmとしたこと以外は、実施例1と同様に多層成形体を作製し、評価した。
バインダー樹脂/フィラー複合体のフィラーとして窒化ホウ素フィラーUHP−1(昭和電工社製)を用い、且つ配合量を31体積%としたこと以外は、実施例1と同様に多層成形体を作製し、評価した。
バインダー樹脂/フィラー複合体のフィラーとして窒化ホウ素フィラーUHP−1(昭和電工社製)を用い、且つ配合量を40体積%としたこと以外は、実施例1と同様に多層成形体を作製し、評価した。
以下の点以外は、実施例1と同様に多層成形体を作製し、評価した。即ち、ポリイミドワニスを作製するのに、ジアミンとしてpBAPP、14ELの2種類、酸二無水物としてs−BPDA、BTDAの2種類を用い、pBAPP:14EL:s−BPDA:BTDA=0.8:0.2:0.79:0.2のモル比で配合することでポリイミドワニスBを得た以外は実施例1と同様にポリイミドワニスを調製した。また、バインダー樹脂/フィラー複合体のフィラーとして、窒化ホウ素フィラーUHP−1(昭和電工社製)を用い、且つ配合量を31体積%としたこと以外は、実施例1と同様にバインダー樹脂/フィラー複合体を作製した。
pBAPP:2,2−ビス(4−(4−アミノフェノキシ)フェニル)プロパン(和歌山セイカ社製)
ポリイミドワニスを作製するのに、ジアミンとしてAPB、14EL、XTJ−542の3種類、酸二無水物としてs−BPDAを用い、APB:14EL:XTJ−542:s−BPDA=0.8:0.1:0.1:0.99のモル比で配合することでポリイミドワニスCを得たこと以外は実施例1と同様にポリイミドワニスを調製し、評価した。
ポリイミドワニスを作製するのに、ジアミンとしてAPB、14ELの2種類、酸二無水物としてs−BPDAとBTDAの2種類を用い、APB:14EL:s−BPDA:BTDA=0.7:0.3:0.79:0.2のモル比で配合することでポリイミドワニスFを得たこと以外は実施例1と同様にポリイミドワニスを調製し、評価した。
ポリイミドワニスを作製するのに、ジアミンとしてpBAPP、14ELの2種類、酸二無水物としてs−BPDAとBTDAの2種類を用い、pBAPP:14EL:s−BPDA:BTDA=0.9:0.1:0.69:0.3のモル比で配合することでポリイミドワニスGを得たこと以外は実施例1と同様にポリイミドワニスを調製し、評価した。
密着性補強樹脂層であるポリイミド層を形成せずに、直接バインダー樹脂/フィラー複合体を離型処理がされたPETフィルム上に形成した以外は、実施例1と同様の方法でサンプルを作製し、評価した。即ち、密着性補強樹脂層を形成しないバインダー樹脂/フィラー複合体単独のサンプルを作製し、評価した。
バインダー樹脂/フィラー複合体のフィラーとして、フィラーDAW07の配合量を10体積%とした以外は、比較例1と同様の方法でサンプルを作製し、評価した。
バインダー樹脂/フィラー複合体のフィラーとして、フィラーDAW07の配合量を65体積%とし、且つ多層成形体を作製するのに、密着性補強樹脂層であるポリイミド層の乾燥後厚みを15μmとした以外は、実施例1と同様に多層成形体を作製し、評価した。
バインダー樹脂/フィラー複合体を作製するのに、フィラーとして窒化ホウ素フィラーUHP−1(昭和電工社製)を用い且つ配合量を40体積%とし、密着性補強樹脂層であるポリイミド層の乾燥後厚みを15μmとしたこと以外は、実施例1と同様に多層成形体を作製し、評価した。
バインダー樹脂/フィラー複合体を作製するのに、ジアミンとして14EL、酸二無水物としてs−BPDAを用い、14EL:s−BPDA=1.0:0.99のモル比で配合することで得たポリイミドワニスDをバインダー樹脂として用いたコンパウンドを作製し、且つ密着性補強樹脂層であるポリイミド層を形成せずに、直接前記コンパウンドを離型処理がされたPETフィルム上に塗布し130℃で乾燥して得たこと以外は、実施例1と同様に多層成形体を作製し、評価した。
ポリイミドワニスを作製するのに、ジアミンとしてAPB、pBAPPの2種類、酸二無水物としてs−BPDAを用い、APB:pBAPP:s−BPDA=0.5:0.5:0.98のモル比で配合することでポリイミドワニスEを得たこと以外は実施例1と同様にポリイミドワニスを調製し、評価した。
11、12 密着性補強樹脂層
21 バインダー樹脂/フィラー複合体
31、32 接着材層
41 離型基材
Claims (10)
- 多層成形体を具備する電磁波シールド部材であって、
前記多層成形体は、
バインダー樹脂、および30体積%以上、95体積%以下の無機フィラーが含有されたバインダー樹脂/フィラー複合体と、
前記バインダー樹脂/フィラー複合体の少なくとも一主面上に積層された密着性補強樹脂層とを備え、
前記密着性補強樹脂層は、厚みが50nm以上、9μm以下、ガラス転移温度が120℃以上、260℃未満であり、主鎖に炭素数3以上の脂肪族ユニットを含むポリイミド樹脂を主成分とするポリイミド組成物からなる電磁波シールド部材。 - 前記ポリイミド樹脂が、テトラカルボン酸二無水物とジアミンの重縮合ユニットを含むポリイミドであって、前記テトラカルボン酸二無水物および前記ジアミンの少なくとも一方にベンゾフェノン骨格を含み、かつ、分子末端にアミノ基を含む請求項1に記載の電磁波シールド部材。
- 前記ポリイミド樹脂は、テトラカルボン酸二無水物とジアミンの重縮合ユニットを含むポリイミドであって、前記テトラカルボン酸二無水物が、下記一般式(1)で表されるベンゾフェノン骨格を有する芳香族テトラカルボン酸二無水物、または/および前記ポリイミドを構成するジアミンが、下記一般式(2)で表されるベンゾフェノン骨格を有する芳香族ジアミンを含み、
前記一般式(1)で表されるベンゾフェノン骨格を有する芳香族テトラカルボン酸二無水物と前記一般式(2)で表されるベンゾフェノン骨格を有する芳香族ジアミンの合計含有量が、前記ポリイミド樹脂を構成するテトラカルボン酸二無水物とジアミンの合計に対して5モル%以上、49モル%以下であり、かつアミン当量が4,000以上、20,000以下であるポリイミド樹脂を含むことを特徴とする請求項1又は2に記載の電磁波シールド部材。
- 前記ポリイミド樹脂は、テトラカルボン酸二無水物とジアミンの重縮合ユニットを含むポリイミドであって、前記炭素数3以上の脂肪族ユニットは、前記ジアミンの少なくとも一部に含まれ、その割合は、全ジアミンユニットの5モル%以上であることを特徴とする請求項1〜3のいずれか1項に記載の電磁波シールド部材。
- 前記ポリイミド樹脂は、テトラカルボン酸二無水物とジアミンの重縮合ユニットを含むポリイミドであって、全テトラカルボン酸二無水物ユニット中にビフェニルテトラカルボン酸二無水物が40mol%以上、90mol%以下含まれていることを特徴とする請求項1〜4のいずれか1項に記載の電磁波シールド部材。
- 前記ポリイミド樹脂は、テトラカルボン酸二無水物とジアミンの重縮合ユニットを含むポリイミドであって、前記ジアミンが、下記一般式(3)または/および(4)で表される脂肪族ジアミンを含む、ポリイミド樹脂組成物であることを特徴とする請求項1〜5のいずれか1項に記載の電磁波シールド部材。
(式(3)中、R1は主鎖にN原子、O原子を含んでいてもよい前記炭素数3以上の脂肪族ユニットであり、前記主鎖を構成する原子数の合計が3〜500であり;前記炭素数3以上の脂肪族ユニットは、C、N、H、Oのいずれか一以上の原子からなる側鎖をさらに有してもよく、前記側鎖1つあたりの原子数の合計は10以下である)
(式(4)中、R2は、主鎖にN原子、O原子を含んでいてもよい炭素数3以上の脂肪族ユニットであり、前記主鎖を構成する原子数の合計が3〜500であり;前記脂肪族ユニットは、C、N、H、Oのいずれか一以上の原子からなる側鎖をさらに有してもよく、前記側鎖1つあたりの原子数の合計は10以下である) - 前記一般式(3)のR1又は前記一般式(4)のR2は、アルキレンオキシ基またはポリアルキレンオキシ基を含む主鎖を有する脂肪族ユニットであって、前記アルキレンオキシ基のアルキレン部分、および前記ポリアルキレンオキシ基を構成するアルキレンオキシユニットのアルキレン成分の炭素数が1〜10であることを特徴とする請求項6に記載の電磁波シールド部材。
- 前記一般式(1)で表されるベンゾフェノン骨格を有する芳香族テトラカルボン酸二無水物は、3,3',4,4'−ベンゾフェノンテトラカルボン酸二無水物および2,3',3,4'−ベンゾフェノンテトラカルボン酸二無水物からなる群より選ばれる一以上であり、前記一般式(2)で表されるベンゾフェノン骨格を有する芳香族ジアミンは、3,3'−ジアミノベンゾフェノン、3,4'−ジアミノベンゾフェノン及び4,4'−ジアミノベンゾフェノンからなる群より選ばれる一以上であることを特徴とする請求項3に記載の電磁波シールド部材。
- 少なくとも一の主面の最表面に、さらに、接着材層が形成されていることを特徴とする請求項1〜9のいずれか1項に記載の電磁波シールド部材。
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