KR101529364B1 - 배리스터 및 반도체 소자를 포함하는 전기 소자 장치 - Google Patents

배리스터 및 반도체 소자를 포함하는 전기 소자 장치 Download PDF

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Publication number
KR101529364B1
KR101529364B1 KR1020107028769A KR20107028769A KR101529364B1 KR 101529364 B1 KR101529364 B1 KR 101529364B1 KR 1020107028769 A KR1020107028769 A KR 1020107028769A KR 20107028769 A KR20107028769 A KR 20107028769A KR 101529364 B1 KR101529364 B1 KR 101529364B1
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South Korea
Prior art keywords
varistor
varistor body
semiconductor element
carrier
ceramic
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Korean (ko)
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KR20110010806A (ko
Inventor
건터 엥겔
토마스 페이츠틴거
악셀 페시나
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에프코스 아게
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors; Arresters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
KR1020107028769A 2008-05-21 2009-05-14 배리스터 및 반도체 소자를 포함하는 전기 소자 장치 Active KR101529364B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008024481.3A DE102008024481B4 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung
DE102008024481.3 2008-05-21
PCT/EP2009/055861 WO2009141266A1 (de) 2008-05-21 2009-05-14 Elektrische bauelementanordnung mit einem varistor und einem halbleiterbauelement

Publications (2)

Publication Number Publication Date
KR20110010806A KR20110010806A (ko) 2011-02-07
KR101529364B1 true KR101529364B1 (ko) 2015-06-16

Family

ID=41077724

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107028769A Active KR101529364B1 (ko) 2008-05-21 2009-05-14 배리스터 및 반도체 소자를 포함하는 전기 소자 장치

Country Status (7)

Country Link
US (1) US8378455B2 (https=)
EP (1) EP2289074B1 (https=)
JP (1) JP5548194B2 (https=)
KR (1) KR101529364B1 (https=)
CN (1) CN102105949A (https=)
DE (1) DE102008024481B4 (https=)
WO (1) WO2009141266A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202009001611U1 (de) * 2009-02-09 2009-07-02 Ephy-Mess Gesellschaft für Elektro-Physikalische Meßgeräte mbH Halbleiter-Temperatursensor mit ESD-Schutz
US9194573B2 (en) * 2010-12-15 2015-11-24 Illinois Tool Works Inc. Heat-sink/connector system for light emitting diode
KR200465693Y1 (ko) 2010-12-24 2013-03-06 이용재 온도감지센서 구조
CN102683327A (zh) * 2011-03-18 2012-09-19 泰科电子公司 片型电路保护器件
KR101915961B1 (ko) * 2011-09-06 2019-01-31 삼성전자주식회사 전자 장치 및 그 전자 장치에 사용 가능한 보드
DE102012101606B4 (de) 2011-10-28 2024-11-21 Tdk Electronics Ag ESD-Schutzbauelement und Bauelement mit einem ESD-Schutzbauelement und einer LED
US9210767B2 (en) 2011-12-20 2015-12-08 Everlight Electronics Co., Ltd. Lighting apparatus and light emitting diode device thereof
DE102012104494A1 (de) * 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung
TW201434134A (zh) 2013-02-27 2014-09-01 億光電子工業股份有限公司 發光裝置、背光模組及照明模組
DE102024130465A1 (de) * 2024-10-21 2026-04-23 Innovative Sensor Technology Ist Ag Sensorelement mit Überspannungsschutz

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11228261A (ja) * 1998-02-03 1999-08-24 Taiheiyo Cement Corp ヒートシンク用材料及びその製造方法
JP2005244220A (ja) * 2004-02-25 2005-09-08 Lumileds Lighting Us Llc 基体にｅｓｄ保護を組み入れた発光ダイオード用基体
EP1858033A1 (en) * 2005-04-01 2007-11-21 Matsushita Electric Industrial Co., Ltd. Varistor and electronic component module using same

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5480547A (en) * 1977-12-09 1979-06-27 Matsushita Electric Industrial Co Ltd Ceramic varister
JPH10270633A (ja) * 1997-03-21 1998-10-09 Tokin Corp 集積回路装置
US6737168B1 (en) * 1999-06-14 2004-05-18 Sumitomo Electric Industries, Ltd. Composite material and semiconductor device using the same
KR20060103864A (ko) * 2005-03-28 2006-10-04 타이코 일렉트로닉스 코포레이션 Ｐｐｔｃ 층들 사이에 능동 소자를 갖는 표면 장착식 다층전기 회로 보호 장치
US7696856B2 (en) 2006-03-20 2010-04-13 Tdk Corporation Varistor element
JP4487963B2 (ja) * 2006-03-27 2010-06-23 Ｔｄｋ株式会社 バリスタ及び発光装置
US7714348B2 (en) * 2006-10-06 2010-05-11 Ac-Led Lighting, L.L.C. AC/DC light emitting diodes with integrated protection mechanism

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11228261A (ja) * 1998-02-03 1999-08-24 Taiheiyo Cement Corp ヒートシンク用材料及びその製造方法
JP2005244220A (ja) * 2004-02-25 2005-09-08 Lumileds Lighting Us Llc 基体にｅｓｄ保護を組み入れた発光ダイオード用基体
EP1858033A1 (en) * 2005-04-01 2007-11-21 Matsushita Electric Industrial Co., Ltd. Varistor and electronic component module using same

Also Published As

Publication number Publication date
DE102008024481B4 (de) 2021-04-15
KR20110010806A (ko) 2011-02-07
EP2289074A1 (de) 2011-03-02
WO2009141266A1 (de) 2009-11-26
US20110221037A1 (en) 2011-09-15
JP5548194B2 (ja) 2014-07-16
EP2289074B1 (de) 2017-09-13
JP2011523776A (ja) 2011-08-18
US8378455B2 (en) 2013-02-19
CN102105949A (zh) 2011-06-22
DE102008024481A1 (de) 2009-12-03

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