CN102105949A - 电器件装置 - Google Patents

电器件装置 Download PDF

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Publication number
CN102105949A
CN102105949A CN2009801285833A CN200980128583A CN102105949A CN 102105949 A CN102105949 A CN 102105949A CN 2009801285833 A CN2009801285833 A CN 2009801285833A CN 200980128583 A CN200980128583 A CN 200980128583A CN 102105949 A CN102105949 A CN 102105949A
Authority
CN
China
Prior art keywords
carrier
piezo
varistor
aforementioned
resistance body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2009801285833A
Other languages
English (en)
Chinese (zh)
Inventor
G.恩格尔
T.费克廷格
A.佩西纳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of CN102105949A publication Critical patent/CN102105949A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors; Arresters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
CN2009801285833A 2008-05-21 2009-05-14 电器件装置 Pending CN102105949A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008024481.3A DE102008024481B4 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung
DE102008024481.3 2008-05-21
PCT/EP2009/055861 WO2009141266A1 (de) 2008-05-21 2009-05-14 Elektrische bauelementanordnung mit einem varistor und einem halbleiterbauelement

Publications (1)

Publication Number Publication Date
CN102105949A true CN102105949A (zh) 2011-06-22

Family

ID=41077724

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2009801285833A Pending CN102105949A (zh) 2008-05-21 2009-05-14 电器件装置

Country Status (7)

Country Link
US (1) US8378455B2 (https=)
EP (1) EP2289074B1 (https=)
JP (1) JP5548194B2 (https=)
KR (1) KR101529364B1 (https=)
CN (1) CN102105949A (https=)
DE (1) DE102008024481B4 (https=)
WO (1) WO2009141266A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103890866A (zh) * 2011-10-28 2014-06-25 埃普科斯股份有限公司 Esd保护结构元件和带有esd保护结构元件与led的结构元件

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202009001611U1 (de) * 2009-02-09 2009-07-02 Ephy-Mess Gesellschaft für Elektro-Physikalische Meßgeräte mbH Halbleiter-Temperatursensor mit ESD-Schutz
US9194573B2 (en) * 2010-12-15 2015-11-24 Illinois Tool Works Inc. Heat-sink/connector system for light emitting diode
KR200465693Y1 (ko) 2010-12-24 2013-03-06 이용재 온도감지센서 구조
CN102683327A (zh) * 2011-03-18 2012-09-19 泰科电子公司 片型电路保护器件
KR101915961B1 (ko) * 2011-09-06 2019-01-31 삼성전자주식회사 전자 장치 및 그 전자 장치에 사용 가능한 보드
US9210767B2 (en) 2011-12-20 2015-12-08 Everlight Electronics Co., Ltd. Lighting apparatus and light emitting diode device thereof
DE102012104494A1 (de) * 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung
TW201434134A (zh) 2013-02-27 2014-09-01 億光電子工業股份有限公司 發光裝置、背光模組及照明模組
DE102024130465A1 (de) * 2024-10-21 2026-04-23 Innovative Sensor Technology Ist Ag Sensorelement mit Überspannungsschutz

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5480547A (en) * 1977-12-09 1979-06-27 Matsushita Electric Industrial Co Ltd Ceramic varister
JPH10270633A (ja) * 1997-03-21 1998-10-09 Tokin Corp 集積回路装置
JPH11228261A (ja) 1998-02-03 1999-08-24 Taiheiyo Cement Corp ヒートシンク用材料及びその製造方法
US6737168B1 (en) * 1999-06-14 2004-05-18 Sumitomo Electric Industries, Ltd. Composite material and semiconductor device using the same
US7279724B2 (en) * 2004-02-25 2007-10-09 Philips Lumileds Lighting Company, Llc Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection
KR20060103864A (ko) * 2005-03-28 2006-10-04 타이코 일렉트로닉스 코포레이션 Ｐｐｔｃ 층들 사이에 능동 소자를 갖는 표면 장착식 다층전기 회로 보호 장치
US7940155B2 (en) * 2005-04-01 2011-05-10 Panasonic Corporation Varistor and electronic component module using same
US7696856B2 (en) 2006-03-20 2010-04-13 Tdk Corporation Varistor element
JP4487963B2 (ja) * 2006-03-27 2010-06-23 Ｔｄｋ株式会社 バリスタ及び発光装置
US7714348B2 (en) * 2006-10-06 2010-05-11 Ac-Led Lighting, L.L.C. AC/DC light emitting diodes with integrated protection mechanism

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103890866A (zh) * 2011-10-28 2014-06-25 埃普科斯股份有限公司 Esd保护结构元件和带有esd保护结构元件与led的结构元件
CN103890866B (zh) * 2011-10-28 2017-03-22 埃普科斯股份有限公司 Esd保护结构元件和带有esd保护结构元件与led的结构元件

Also Published As

Publication number Publication date
DE102008024481B4 (de) 2021-04-15
KR20110010806A (ko) 2011-02-07
EP2289074A1 (de) 2011-03-02
WO2009141266A1 (de) 2009-11-26
US20110221037A1 (en) 2011-09-15
JP5548194B2 (ja) 2014-07-16
EP2289074B1 (de) 2017-09-13
JP2011523776A (ja) 2011-08-18
US8378455B2 (en) 2013-02-19
DE102008024481A1 (de) 2009-12-03
KR101529364B1 (ko) 2015-06-16

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C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C12 Rejection of a patent application after its publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20110622