DE102008024481B4 - Elektrische Bauelementanordnung - Google Patents

Elektrische Bauelementanordnung Download PDF

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Publication number
DE102008024481B4
DE102008024481B4 DE102008024481.3A DE102008024481A DE102008024481B4 DE 102008024481 B4 DE102008024481 B4 DE 102008024481B4 DE 102008024481 A DE102008024481 A DE 102008024481A DE 102008024481 B4 DE102008024481 B4 DE 102008024481B4
Authority
DE
Germany
Prior art keywords
varistor body
varistor
component
arrangement according
semiconductor component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102008024481.3A
Other languages
German (de)
English (en)
Other versions
DE102008024481A1 (de
Inventor
Dr. Engel Günter
Thomas Feichtinger
Dr. Pecina Axel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
TDK Electronics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DE102008024481.3A priority Critical patent/DE102008024481B4/de
Application filed by TDK Electronics AG filed Critical TDK Electronics AG
Priority to PCT/EP2009/055861 priority patent/WO2009141266A1/de
Priority to JP2011509932A priority patent/JP5548194B2/ja
Priority to US12/994,141 priority patent/US8378455B2/en
Priority to CN2009801285833A priority patent/CN102105949A/zh
Priority to KR1020107028769A priority patent/KR101529364B1/ko
Priority to EP09749756.4A priority patent/EP2289074B1/de
Publication of DE102008024481A1 publication Critical patent/DE102008024481A1/de
Application granted granted Critical
Publication of DE102008024481B4 publication Critical patent/DE102008024481B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors; Arresters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
DE102008024481.3A 2008-05-21 2008-05-21 Elektrische Bauelementanordnung Active DE102008024481B4 (de)

Priority Applications (7)

Application Number Priority Date Filing Date Title
DE102008024481.3A DE102008024481B4 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung
JP2011509932A JP5548194B2 (ja) 2008-05-21 2009-05-14 バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ
US12/994,141 US8378455B2 (en) 2008-05-21 2009-05-14 Electronic component arrangement comprising a varistor and a semiconductor component
CN2009801285833A CN102105949A (zh) 2008-05-21 2009-05-14 电器件装置
PCT/EP2009/055861 WO2009141266A1 (de) 2008-05-21 2009-05-14 Elektrische bauelementanordnung mit einem varistor und einem halbleiterbauelement
KR1020107028769A KR101529364B1 (ko) 2008-05-21 2009-05-14 배리스터 및 반도체 소자를 포함하는 전기 소자 장치
EP09749756.4A EP2289074B1 (de) 2008-05-21 2009-05-14 Elektrische bauelementanordnung mit einem varistor und einem halbleiterbauelement

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102008024481.3A DE102008024481B4 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung

Publications (2)

Publication Number Publication Date
DE102008024481A1 DE102008024481A1 (de) 2009-12-03
DE102008024481B4 true DE102008024481B4 (de) 2021-04-15

Family

ID=41077724

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102008024481.3A Active DE102008024481B4 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung

Country Status (7)

Country Link
US (1) US8378455B2 (https=)
EP (1) EP2289074B1 (https=)
JP (1) JP5548194B2 (https=)
KR (1) KR101529364B1 (https=)
CN (1) CN102105949A (https=)
DE (1) DE102008024481B4 (https=)
WO (1) WO2009141266A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202009001611U1 (de) * 2009-02-09 2009-07-02 Ephy-Mess Gesellschaft für Elektro-Physikalische Meßgeräte mbH Halbleiter-Temperatursensor mit ESD-Schutz
US9194573B2 (en) * 2010-12-15 2015-11-24 Illinois Tool Works Inc. Heat-sink/connector system for light emitting diode
KR200465693Y1 (ko) 2010-12-24 2013-03-06 이용재 온도감지센서 구조
CN102683327A (zh) * 2011-03-18 2012-09-19 泰科电子公司 片型电路保护器件
KR101915961B1 (ko) * 2011-09-06 2019-01-31 삼성전자주식회사 전자 장치 및 그 전자 장치에 사용 가능한 보드
DE102012101606B4 (de) 2011-10-28 2024-11-21 Tdk Electronics Ag ESD-Schutzbauelement und Bauelement mit einem ESD-Schutzbauelement und einer LED
US9210767B2 (en) 2011-12-20 2015-12-08 Everlight Electronics Co., Ltd. Lighting apparatus and light emitting diode device thereof
DE102012104494A1 (de) * 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung
TW201434134A (zh) 2013-02-27 2014-09-01 億光電子工業股份有限公司 發光裝置、背光模組及照明模組
DE102024130465A1 (de) * 2024-10-21 2026-04-23 Innovative Sensor Technology Ist Ag Sensorelement mit Überspannungsschutz

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2853134C2 (de) * 1977-12-09 1983-07-28 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka Keramikvaristor
EP1114807B1 (en) * 1999-06-14 2005-07-27 Sumitomo Electric Industries, Ltd. Semiconductor device or heat dissipating substrate therefor using a composite material
EP1580809A2 (en) * 2004-02-25 2005-09-28 LumiLeds Lighting U.S., LLC Ceramic substrate incorporating an ESD protection for a light emitting diode
US20060215342A1 (en) * 2005-03-28 2006-09-28 Wayne Montoya Surface mount multi-layer electrical circuit protection device with active element between PPTC layers
DE102007014300A1 (de) * 2006-03-27 2007-10-11 Tdk Corp. Varistor und Licht emittierende Vorrichtung
EP1858033A1 (en) * 2005-04-01 2007-11-21 Matsushita Electric Industrial Co., Ltd. Varistor and electronic component module using same

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10270633A (ja) * 1997-03-21 1998-10-09 Tokin Corp 集積回路装置
JPH11228261A (ja) 1998-02-03 1999-08-24 Taiheiyo Cement Corp ヒートシンク用材料及びその製造方法
US7696856B2 (en) 2006-03-20 2010-04-13 Tdk Corporation Varistor element
US7714348B2 (en) * 2006-10-06 2010-05-11 Ac-Led Lighting, L.L.C. AC/DC light emitting diodes with integrated protection mechanism

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2853134C2 (de) * 1977-12-09 1983-07-28 Matsushita Electric Industrial Co., Ltd., Kadoma, Osaka Keramikvaristor
EP1114807B1 (en) * 1999-06-14 2005-07-27 Sumitomo Electric Industries, Ltd. Semiconductor device or heat dissipating substrate therefor using a composite material
EP1580809A2 (en) * 2004-02-25 2005-09-28 LumiLeds Lighting U.S., LLC Ceramic substrate incorporating an ESD protection for a light emitting diode
US20060215342A1 (en) * 2005-03-28 2006-09-28 Wayne Montoya Surface mount multi-layer electrical circuit protection device with active element between PPTC layers
EP1858033A1 (en) * 2005-04-01 2007-11-21 Matsushita Electric Industrial Co., Ltd. Varistor and electronic component module using same
DE102007014300A1 (de) * 2006-03-27 2007-10-11 Tdk Corp. Varistor und Licht emittierende Vorrichtung

Also Published As

Publication number Publication date
KR20110010806A (ko) 2011-02-07
EP2289074A1 (de) 2011-03-02
WO2009141266A1 (de) 2009-11-26
US20110221037A1 (en) 2011-09-15
JP5548194B2 (ja) 2014-07-16
EP2289074B1 (de) 2017-09-13
JP2011523776A (ja) 2011-08-18
US8378455B2 (en) 2013-02-19
CN102105949A (zh) 2011-06-22
DE102008024481A1 (de) 2009-12-03
KR101529364B1 (ko) 2015-06-16

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OP8 Request for examination as to paragraph 44 patent law
R016 Response to examination communication
R081 Change of applicant/patentee

Owner name: TDK ELECTRONICS AG, DE

Free format text: FORMER OWNER: EPCOS AG, 81669 MUENCHEN, DE

R082 Change of representative

Representative=s name: EPPING HERMANN FISCHER PATENTANWALTSGESELLSCHA, DE

R018 Grant decision by examination section/examining division
R020 Patent grant now final
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0025160000

Ipc: H10W0090000000