JP5548194B2 - バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ - Google Patents

バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ Download PDF

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Publication number
JP5548194B2
JP5548194B2 JP2011509932A JP2011509932A JP5548194B2 JP 5548194 B2 JP5548194 B2 JP 5548194B2 JP 2011509932 A JP2011509932 A JP 2011509932A JP 2011509932 A JP2011509932 A JP 2011509932A JP 5548194 B2 JP5548194 B2 JP 5548194B2
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JP
Japan
Prior art keywords
varistor body
semiconductor component
varistor
electrical
carrier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011509932A
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English (en)
Japanese (ja)
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JP2011523776A (ja
JP2011523776A5 (https=
Inventor
エンゲル、ギュンター
ファイヒティンガー、トーマス
ペチナ、アクセル
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Electronics AG
Original Assignee
Epcos AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Epcos AG filed Critical Epcos AG
Publication of JP2011523776A publication Critical patent/JP2011523776A/ja
Publication of JP2011523776A5 publication Critical patent/JP2011523776A5/ja
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Publication of JP5548194B2 publication Critical patent/JP5548194B2/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C1/00—Details
    • H01C1/08—Cooling, heating or ventilating arrangements
    • H01C1/084—Cooling, heating or ventilating arrangements using self-cooling, e.g. fins, heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
    • H01C7/12—Overvoltage protection resistors; Arresters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257—Overvoltage protection
    • H05K1/0259—Electrostatic discharge [ESD] protection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10022—Non-printed resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermistors And Varistors (AREA)
JP2011509932A 2008-05-21 2009-05-14 バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ Active JP5548194B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102008024481.3A DE102008024481B4 (de) 2008-05-21 2008-05-21 Elektrische Bauelementanordnung
DE102008024481.3 2008-05-21
PCT/EP2009/055861 WO2009141266A1 (de) 2008-05-21 2009-05-14 Elektrische bauelementanordnung mit einem varistor und einem halbleiterbauelement

Publications (3)

Publication Number Publication Date
JP2011523776A JP2011523776A (ja) 2011-08-18
JP2011523776A5 JP2011523776A5 (https=) 2012-04-05
JP5548194B2 true JP5548194B2 (ja) 2014-07-16

Family

ID=41077724

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011509932A Active JP5548194B2 (ja) 2008-05-21 2009-05-14 バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ

Country Status (7)

Country Link
US (1) US8378455B2 (https=)
EP (1) EP2289074B1 (https=)
JP (1) JP5548194B2 (https=)
KR (1) KR101529364B1 (https=)
CN (1) CN102105949A (https=)
DE (1) DE102008024481B4 (https=)
WO (1) WO2009141266A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202009001611U1 (de) * 2009-02-09 2009-07-02 Ephy-Mess Gesellschaft für Elektro-Physikalische Meßgeräte mbH Halbleiter-Temperatursensor mit ESD-Schutz
US9194573B2 (en) * 2010-12-15 2015-11-24 Illinois Tool Works Inc. Heat-sink/connector system for light emitting diode
KR200465693Y1 (ko) 2010-12-24 2013-03-06 이용재 온도감지센서 구조
CN102683327A (zh) * 2011-03-18 2012-09-19 泰科电子公司 片型电路保护器件
KR101915961B1 (ko) * 2011-09-06 2019-01-31 삼성전자주식회사 전자 장치 및 그 전자 장치에 사용 가능한 보드
DE102012101606B4 (de) 2011-10-28 2024-11-21 Tdk Electronics Ag ESD-Schutzbauelement und Bauelement mit einem ESD-Schutzbauelement und einer LED
US9210767B2 (en) 2011-12-20 2015-12-08 Everlight Electronics Co., Ltd. Lighting apparatus and light emitting diode device thereof
DE102012104494A1 (de) * 2012-05-24 2013-11-28 Epcos Ag Leuchtdiodenvorrichtung
TW201434134A (zh) 2013-02-27 2014-09-01 億光電子工業股份有限公司 發光裝置、背光模組及照明模組
DE102024130465A1 (de) * 2024-10-21 2026-04-23 Innovative Sensor Technology Ist Ag Sensorelement mit Überspannungsschutz

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5480547A (en) * 1977-12-09 1979-06-27 Matsushita Electric Industrial Co Ltd Ceramic varister
JPH10270633A (ja) * 1997-03-21 1998-10-09 Tokin Corp 集積回路装置
JPH11228261A (ja) 1998-02-03 1999-08-24 Taiheiyo Cement Corp ヒートシンク用材料及びその製造方法
US6737168B1 (en) * 1999-06-14 2004-05-18 Sumitomo Electric Industries, Ltd. Composite material and semiconductor device using the same
US7279724B2 (en) * 2004-02-25 2007-10-09 Philips Lumileds Lighting Company, Llc Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection
KR20060103864A (ko) * 2005-03-28 2006-10-04 타이코 일렉트로닉스 코포레이션 Ｐｐｔｃ 층들 사이에 능동 소자를 갖는 표면 장착식 다층전기 회로 보호 장치
US7940155B2 (en) * 2005-04-01 2011-05-10 Panasonic Corporation Varistor and electronic component module using same
US7696856B2 (en) 2006-03-20 2010-04-13 Tdk Corporation Varistor element
JP4487963B2 (ja) * 2006-03-27 2010-06-23 Ｔｄｋ株式会社 バリスタ及び発光装置
US7714348B2 (en) * 2006-10-06 2010-05-11 Ac-Led Lighting, L.L.C. AC/DC light emitting diodes with integrated protection mechanism

Also Published As

Publication number Publication date
DE102008024481B4 (de) 2021-04-15
KR20110010806A (ko) 2011-02-07
EP2289074A1 (de) 2011-03-02
WO2009141266A1 (de) 2009-11-26
US20110221037A1 (en) 2011-09-15
EP2289074B1 (de) 2017-09-13
JP2011523776A (ja) 2011-08-18
US8378455B2 (en) 2013-02-19
CN102105949A (zh) 2011-06-22
DE102008024481A1 (de) 2009-12-03
KR101529364B1 (ko) 2015-06-16

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