JP2011523776A5 - - Google Patents
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- Publication number
- JP2011523776A5 JP2011523776A5 JP2011509932A JP2011509932A JP2011523776A5 JP 2011523776 A5 JP2011523776 A5 JP 2011523776A5 JP 2011509932 A JP2011509932 A JP 2011509932A JP 2011509932 A JP2011509932 A JP 2011509932A JP 2011523776 A5 JP2011523776 A5 JP 2011523776A5
- Authority
- JP
- Japan
- Prior art keywords
- assembly according
- electrical component
- component assembly
- carrier
- varistor body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims 10
- 239000000919 ceramic Substances 0.000 claims 4
- 239000003990 capacitor Substances 0.000 claims 2
- 239000000945 filler Substances 0.000 claims 2
- AMWRITDGCCNYAT-UHFFFAOYSA-L hydroxy(oxo)manganese;manganese Chemical compound [Mn].O[Mn]=O.O[Mn]=O AMWRITDGCCNYAT-UHFFFAOYSA-L 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229910002601 GaN Inorganic materials 0.000 claims 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims 1
- 239000002131 composite material Substances 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims 1
- 230000001419 dependent effect Effects 0.000 claims 1
- 229910000449 hafnium oxide Inorganic materials 0.000 claims 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 230000005693 optoelectronics Effects 0.000 claims 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 1
- 229910010271 silicon carbide Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102008024481.3A DE102008024481B4 (de) | 2008-05-21 | 2008-05-21 | Elektrische Bauelementanordnung |
| DE102008024481.3 | 2008-05-21 | ||
| PCT/EP2009/055861 WO2009141266A1 (de) | 2008-05-21 | 2009-05-14 | Elektrische bauelementanordnung mit einem varistor und einem halbleiterbauelement |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011523776A JP2011523776A (ja) | 2011-08-18 |
| JP2011523776A5 true JP2011523776A5 (https=) | 2012-04-05 |
| JP5548194B2 JP5548194B2 (ja) | 2014-07-16 |
Family
ID=41077724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011509932A Active JP5548194B2 (ja) | 2008-05-21 | 2009-05-14 | バリスタおよび半導体構成要素を備える電気的構成要素アセンブリ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US8378455B2 (https=) |
| EP (1) | EP2289074B1 (https=) |
| JP (1) | JP5548194B2 (https=) |
| KR (1) | KR101529364B1 (https=) |
| CN (1) | CN102105949A (https=) |
| DE (1) | DE102008024481B4 (https=) |
| WO (1) | WO2009141266A1 (https=) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202009001611U1 (de) * | 2009-02-09 | 2009-07-02 | Ephy-Mess Gesellschaft für Elektro-Physikalische Meßgeräte mbH | Halbleiter-Temperatursensor mit ESD-Schutz |
| US9194573B2 (en) * | 2010-12-15 | 2015-11-24 | Illinois Tool Works Inc. | Heat-sink/connector system for light emitting diode |
| KR200465693Y1 (ko) | 2010-12-24 | 2013-03-06 | 이용재 | 온도감지센서 구조 |
| CN102683327A (zh) * | 2011-03-18 | 2012-09-19 | 泰科电子公司 | 片型电路保护器件 |
| KR101915961B1 (ko) * | 2011-09-06 | 2019-01-31 | 삼성전자주식회사 | 전자 장치 및 그 전자 장치에 사용 가능한 보드 |
| DE102012101606B4 (de) | 2011-10-28 | 2024-11-21 | Tdk Electronics Ag | ESD-Schutzbauelement und Bauelement mit einem ESD-Schutzbauelement und einer LED |
| US9210767B2 (en) | 2011-12-20 | 2015-12-08 | Everlight Electronics Co., Ltd. | Lighting apparatus and light emitting diode device thereof |
| DE102012104494A1 (de) * | 2012-05-24 | 2013-11-28 | Epcos Ag | Leuchtdiodenvorrichtung |
| TW201434134A (zh) | 2013-02-27 | 2014-09-01 | 億光電子工業股份有限公司 | 發光裝置、背光模組及照明模組 |
| DE102024130465A1 (de) * | 2024-10-21 | 2026-04-23 | Innovative Sensor Technology Ist Ag | Sensorelement mit Überspannungsschutz |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5480547A (en) * | 1977-12-09 | 1979-06-27 | Matsushita Electric Industrial Co Ltd | Ceramic varister |
| JPH10270633A (ja) * | 1997-03-21 | 1998-10-09 | Tokin Corp | 集積回路装置 |
| JPH11228261A (ja) | 1998-02-03 | 1999-08-24 | Taiheiyo Cement Corp | ヒートシンク用材料及びその製造方法 |
| US6737168B1 (en) * | 1999-06-14 | 2004-05-18 | Sumitomo Electric Industries, Ltd. | Composite material and semiconductor device using the same |
| US7279724B2 (en) * | 2004-02-25 | 2007-10-09 | Philips Lumileds Lighting Company, Llc | Ceramic substrate for a light emitting diode where the substrate incorporates ESD protection |
| KR20060103864A (ko) * | 2005-03-28 | 2006-10-04 | 타이코 일렉트로닉스 코포레이션 | Ｐｐｔｃ 층들 사이에 능동 소자를 갖는 표면 장착식 다층전기 회로 보호 장치 |
| US7940155B2 (en) * | 2005-04-01 | 2011-05-10 | Panasonic Corporation | Varistor and electronic component module using same |
| US7696856B2 (en) | 2006-03-20 | 2010-04-13 | Tdk Corporation | Varistor element |
| JP4487963B2 (ja) * | 2006-03-27 | 2010-06-23 | Ｔｄｋ株式会社 | バリスタ及び発光装置 |
| US7714348B2 (en) * | 2006-10-06 | 2010-05-11 | Ac-Led Lighting, L.L.C. | AC/DC light emitting diodes with integrated protection mechanism |
-
2008
- 2008-05-21 DE DE102008024481.3A patent/DE102008024481B4/de active Active
-
2009
- 2009-05-14 US US12/994,141 patent/US8378455B2/en not_active Expired - Fee Related
- 2009-05-14 KR KR1020107028769A patent/KR101529364B1/ko active Active
- 2009-05-14 CN CN2009801285833A patent/CN102105949A/zh active Pending
- 2009-05-14 JP JP2011509932A patent/JP5548194B2/ja active Active
- 2009-05-14 EP EP09749756.4A patent/EP2289074B1/de active Active
- 2009-05-14 WO PCT/EP2009/055861 patent/WO2009141266A1/de not_active Ceased
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