KR101527631B1 - 인쇄 회로 기판, 전원 장치, 화상 형성 장치 및 인쇄 회로 기판의 제조 방법 - Google Patents

인쇄 회로 기판, 전원 장치, 화상 형성 장치 및 인쇄 회로 기판의 제조 방법 Download PDF

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KR101527631B1
KR101527631B1 KR1020120066595A KR20120066595A KR101527631B1 KR 101527631 B1 KR101527631 B1 KR 101527631B1 KR 1020120066595 A KR1020120066595 A KR 1020120066595A KR 20120066595 A KR20120066595 A KR 20120066595A KR 101527631 B1 KR101527631 B1 KR 101527631B1
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South Korea
Prior art keywords
piezoelectric element
circuit board
printed circuit
resistor
voltage
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KR1020120066595A
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Korean (ko)
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KR20130007445A (ko
Inventor
오사무 나가사끼
마사미찌 이이다
히로시 마노
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캐논 가부시끼가이샤
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0254High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
    • H05K1/0257Overvoltage protection
    • H05K1/0259Electrostatic discharge [ESD] protection
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03GELECTROGRAPHY; ELECTROPHOTOGRAPHY; MAGNETOGRAPHY
    • G03G15/00Apparatus for electrographic processes using a charge pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3468Applying molten solder
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00Piezoelectric or electrostrictive devices
    • H10N30/40Piezoelectric or electrostrictive devices with electrical input and electrical output, e.g. functioning as transformers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10083Electromechanical or electro-acoustic component, e.g. microphone
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/044Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304Protecting a component during manufacturing
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/42Piezoelectric device making

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Dc-Dc Converters (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Electrostatic Charge, Transfer And Separation In Electrography (AREA)
  • Control Or Security For Electrophotography (AREA)
  • Structure Of Printed Boards (AREA)
KR1020120066595A 2011-06-29 2012-06-21 인쇄 회로 기판, 전원 장치, 화상 형성 장치 및 인쇄 회로 기판의 제조 방법 Active KR101527631B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2011144549 2011-06-29
JPJP-P-2011-144549 2011-06-29
JP2012110924A JP5806640B2 (ja) 2011-06-29 2012-05-14 プリント配線基板、電源装置、画像形成装置およびプリント配線基板の製造方法
JPJP-P-2012-110924 2012-05-14

Publications (2)

Publication Number Publication Date
KR20130007445A KR20130007445A (ko) 2013-01-18
KR101527631B1 true KR101527631B1 (ko) 2015-06-09

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KR1020120066595A Active KR101527631B1 (ko) 2011-06-29 2012-06-21 인쇄 회로 기판, 전원 장치, 화상 형성 장치 및 인쇄 회로 기판의 제조 방법

Country Status (5)

Country Link
US (2) US9918393B2 (enExample)
EP (2) EP2900042B1 (enExample)
JP (1) JP5806640B2 (enExample)
KR (1) KR101527631B1 (enExample)
CN (2) CN105555022B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6057591B2 (ja) * 2012-08-03 2017-01-11 キヤノン株式会社 画像形成装置用の高圧電源
JP6143499B2 (ja) 2013-03-08 2017-06-07 キヤノン株式会社 電源装置及び画像形成装置
US9450493B2 (en) 2013-09-04 2016-09-20 Canon Kabushiki Kaisha Voltage generating apparatus for stably controlling voltage
DE102014007242B4 (de) 2014-05-16 2024-02-22 Nidec Motors & Actuators (Germany) Gmbh Bürstenhaltevorrichtung für eine Kommutatormaschine
DE102014007244B4 (de) * 2014-05-16 2024-08-29 Nidec Motors & Actuators (Germany) Gmbh Bürstenhaltevorrichtung für eine Kommutatormaschine
DE102014007240A1 (de) 2014-05-16 2015-11-19 Nidec Motors & Actuators (Germany) Gmbh Bürstenhaltevorrichtung für eine Kornmutatormaschine
CN106934083B (zh) * 2015-12-30 2020-07-21 小米科技有限责任公司 电路设计方法和装置
US10671009B2 (en) 2017-02-13 2020-06-02 Canon Kabushiki Kaisha Printed circuit board mounting piezoelectric transformer

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5847491A (en) * 1996-06-19 1998-12-08 Nec Corporation Piezoelectric transformer
US20030025587A1 (en) * 2001-07-10 2003-02-06 Whitney Stephen J. Electrostatic discharge multifunction resistor
JP2009153293A (ja) * 2007-12-20 2009-07-09 Canon Inc 圧電トランス高圧電源回路

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3142426B2 (ja) 1993-10-29 2001-03-07 株式会社八幡電機製作所 定電圧・定電流電源装置
EP0730312B1 (en) * 1995-02-28 2003-07-30 Nec Corporation Packaged piezoelectric transformer unit
JP3548309B2 (ja) 1996-01-09 2004-07-28 キヤノン株式会社 フォトセンサ
DE19627585A1 (de) * 1996-07-09 1998-01-15 Thomson Brandt Gmbh Hochspannungstransformator für einen Fernsehempfänger
JPH11252931A (ja) 1998-02-27 1999-09-17 Canon Inc 高圧電源装置
US6229249B1 (en) * 1998-08-31 2001-05-08 Kyocera Corporation Surface-mount type crystal oscillator
JP2000307166A (ja) 1999-04-21 2000-11-02 Tdk Corp 圧電トランスおよびそのための駆動安定化装置
JP2003033017A (ja) 2001-07-06 2003-01-31 Sharp Corp スイッチング電源装置
US7062212B2 (en) * 2003-04-17 2006-06-13 Ricoh Company, Ltd. Cleaning apparatus, image forming apparatus, and process cartridge
JP2004328948A (ja) 2003-04-28 2004-11-18 Noritz Corp スイッチング電源回路およびこれを備えたスイッチングレギュレータ
JP4332528B2 (ja) 2005-03-31 2009-09-16 キヤノン株式会社 電源装置、電源装置を有する画像形成装置
US7548708B2 (en) 2005-04-01 2009-06-16 Canon Kabushiki Kaisha Power supply unit in image forming apparatus
JP4420458B2 (ja) 2005-06-06 2010-02-24 キヤノン株式会社 高圧電源装置、画像形成装置
US7579749B2 (en) * 2005-07-08 2009-08-25 Canon Kabushiki Kaisha Power supply device and image forming apparatus using the power supply device
JP5433148B2 (ja) 2007-11-28 2014-03-05 株式会社タムラ製作所 圧電トランスの実装方法及び圧電トランス
WO2009069590A1 (ja) * 2007-11-28 2009-06-04 Tamura Corporation 圧電トランス
JP5622395B2 (ja) * 2007-12-05 2014-11-12 株式会社タムラ製作所 圧電トランス装置の製造方法及び圧電トランス装置
JP5281478B2 (ja) 2009-05-15 2013-09-04 キヤノン株式会社 電子装置、回路基板、高圧電源装置、および、電子部品と圧電素子とを回路基板に半田付けする方法
JP5864845B2 (ja) 2009-10-27 2016-02-17 キヤノン株式会社 高圧電源装置および画像形成装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5847491A (en) * 1996-06-19 1998-12-08 Nec Corporation Piezoelectric transformer
US20030025587A1 (en) * 2001-07-10 2003-02-06 Whitney Stephen J. Electrostatic discharge multifunction resistor
JP2009153293A (ja) * 2007-12-20 2009-07-09 Canon Inc 圧電トランス高圧電源回路

Also Published As

Publication number Publication date
KR20130007445A (ko) 2013-01-18
JP2013033929A (ja) 2013-02-14
CN102858089B (zh) 2016-03-30
EP2900042A1 (en) 2015-07-29
EP2542040B1 (en) 2015-02-25
US20130004196A1 (en) 2013-01-03
EP2900042B1 (en) 2016-12-21
US9918393B2 (en) 2018-03-13
US10412839B2 (en) 2019-09-10
JP5806640B2 (ja) 2015-11-10
CN102858089A (zh) 2013-01-02
EP2542040A2 (en) 2013-01-02
CN105555022B (zh) 2020-07-28
US20180160544A1 (en) 2018-06-07
CN105555022A (zh) 2016-05-04
EP2542040A3 (en) 2013-07-10

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