KR101503332B1 - 폴리이미드 필름 및 이의 제조방법 - Google Patents

폴리이미드 필름 및 이의 제조방법 Download PDF

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Publication number
KR101503332B1
KR101503332B1 KR20130158268A KR20130158268A KR101503332B1 KR 101503332 B1 KR101503332 B1 KR 101503332B1 KR 20130158268 A KR20130158268 A KR 20130158268A KR 20130158268 A KR20130158268 A KR 20130158268A KR 101503332 B1 KR101503332 B1 KR 101503332B1
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KR
South Korea
Prior art keywords
particles
fluorine
average
less
polyimide film
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KR20130158268A
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English (en)
Korean (ko)
Inventor
조성일
이길남
김성원
Original Assignee
에스케이씨코오롱피아이 주식회사
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Application filed by 에스케이씨코오롱피아이 주식회사 filed Critical 에스케이씨코오롱피아이 주식회사
Priority to KR20130158268A priority Critical patent/KR101503332B1/ko
Priority to CN201480068818.5A priority patent/CN106062049B/zh
Priority to PCT/KR2014/011634 priority patent/WO2015093749A1/ko
Priority to TW103143613A priority patent/TWI661004B/zh
Application granted granted Critical
Publication of KR101503332B1 publication Critical patent/KR101503332B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09D179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Manufacture Of Porous Articles, And Recovery And Treatment Of Waste Products (AREA)
KR20130158268A 2013-12-18 2013-12-18 폴리이미드 필름 및 이의 제조방법 KR101503332B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR20130158268A KR101503332B1 (ko) 2013-12-18 2013-12-18 폴리이미드 필름 및 이의 제조방법
CN201480068818.5A CN106062049B (zh) 2013-12-18 2014-12-01 聚酰亚胺薄膜及其制备方法
PCT/KR2014/011634 WO2015093749A1 (ko) 2013-12-18 2014-12-01 폴리이미드 필름 및 이의 제조방법
TW103143613A TWI661004B (zh) 2013-12-18 2014-12-15 聚醯亞胺薄膜及其製備方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR20130158268A KR101503332B1 (ko) 2013-12-18 2013-12-18 폴리이미드 필름 및 이의 제조방법

Publications (1)

Publication Number Publication Date
KR101503332B1 true KR101503332B1 (ko) 2015-03-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR20130158268A KR101503332B1 (ko) 2013-12-18 2013-12-18 폴리이미드 필름 및 이의 제조방법

Country Status (4)

Country Link
KR (1) KR101503332B1 (zh)
CN (1) CN106062049B (zh)
TW (1) TWI661004B (zh)
WO (1) WO2015093749A1 (zh)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019027207A1 (ko) * 2017-08-02 2019-02-07 에스케이씨코오롱피아이 주식회사 흄드 실리카 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름
WO2021101324A3 (ko) * 2019-11-22 2021-07-15 피아이첨단소재 주식회사 저유전 폴리이미드 복합 분말 및 그 제조방법
KR102306950B1 (ko) * 2021-02-05 2021-09-29 최유경 폴리이미드 필름, 이의 제조방법 및 이를 포함하는 연성인쇄회로기판
KR20220064771A (ko) 2020-11-12 2022-05-19 한국화학연구원 저유전성 폴리이미드 수지 및 그 제조방법
WO2023017876A1 (ko) * 2021-08-13 2023-02-16 엘지전자 주식회사 복합 폴리이미드 기판, 복합 폴리이미드 조성물 및 이를 이용한 인쇄 회로 기판
KR102550250B1 (ko) * 2022-12-02 2023-06-30 (주)상아프론테크 고속통신용 저유전 필름 및 이를 포함하는 동박적층판

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101728100B1 (ko) * 2015-01-21 2017-04-18 에스케이씨코오롱피아이 주식회사 기공을 갖는 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름
CN109867954B (zh) 2017-12-05 2021-07-27 财团法人工业技术研究院 树脂组合物
KR102069709B1 (ko) * 2018-01-22 2020-01-23 에스케이씨코오롱피아이 주식회사 2 종 이상의 필러를 포함하는 고열전도성 폴리이미드 필름
CN113248773B (zh) * 2021-05-17 2022-07-08 上海瑞暨新材料科技有限公司 一种聚酰亚胺多孔膜及其制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005246793A (ja) 2004-03-04 2005-09-15 Nitto Denko Corp 賦形加工したポリイミドフィルムの製造方法
JP2007030501A (ja) 2005-06-21 2007-02-08 Ist Corp ポリイミド複合フィルム及びその製造方法
JP2010043134A (ja) 2008-08-08 2010-02-25 Nitto Denko Corp ポリイミド管状体及びその製造方法
KR20130027442A (ko) * 2011-09-07 2013-03-15 주식회사 엘지화학 불소수지 함유 연성 금속 적층판

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WO1997017382A1 (fr) * 1995-11-09 1997-05-15 Daikin Industries, Ltd. Poudre fine de polytetrafluoroethylene, sa fabrication et son utilisation
CN1890838B (zh) * 2003-12-08 2012-08-29 松下电器产业株式会社 半导体电极及其制造方法、和使用该半导体电极的光电池
JP2006232996A (ja) * 2005-02-24 2006-09-07 Toray Ind Inc ポリイミド樹脂成形用材料、それを用いた成形品、ポリイミドのマテリアルリサイクル方法
WO2007011038A1 (ja) * 2005-07-22 2007-01-25 Krosaki Harima Corporation カーボン含有耐火物及びその製造方法並びにピッチ含有耐火原料
CN101831175A (zh) * 2010-04-01 2010-09-15 辽宁科技大学 一种无色透明的聚酰亚胺纳米复合材料膜及其制备方法
US9462688B2 (en) * 2011-09-07 2016-10-04 Lg Chem, Ltd. Flexible metal laminate containing fluoropolymer

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005246793A (ja) 2004-03-04 2005-09-15 Nitto Denko Corp 賦形加工したポリイミドフィルムの製造方法
JP2007030501A (ja) 2005-06-21 2007-02-08 Ist Corp ポリイミド複合フィルム及びその製造方法
JP2010043134A (ja) 2008-08-08 2010-02-25 Nitto Denko Corp ポリイミド管状体及びその製造方法
KR20130027442A (ko) * 2011-09-07 2013-03-15 주식회사 엘지화학 불소수지 함유 연성 금속 적층판

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019027207A1 (ko) * 2017-08-02 2019-02-07 에스케이씨코오롱피아이 주식회사 흄드 실리카 입자를 이용한 폴리이미드 필름의 제조방법 및 저유전율의 폴리이미드 필름
WO2021101324A3 (ko) * 2019-11-22 2021-07-15 피아이첨단소재 주식회사 저유전 폴리이미드 복합 분말 및 그 제조방법
KR20220064771A (ko) 2020-11-12 2022-05-19 한국화학연구원 저유전성 폴리이미드 수지 및 그 제조방법
KR102306950B1 (ko) * 2021-02-05 2021-09-29 최유경 폴리이미드 필름, 이의 제조방법 및 이를 포함하는 연성인쇄회로기판
US11596065B2 (en) 2021-02-05 2023-02-28 Yu Kyoung Choi Method of manufacturing polyimide film
WO2023017876A1 (ko) * 2021-08-13 2023-02-16 엘지전자 주식회사 복합 폴리이미드 기판, 복합 폴리이미드 조성물 및 이를 이용한 인쇄 회로 기판
KR102550250B1 (ko) * 2022-12-02 2023-06-30 (주)상아프론테크 고속통신용 저유전 필름 및 이를 포함하는 동박적층판

Also Published As

Publication number Publication date
TW201529729A (zh) 2015-08-01
TWI661004B (zh) 2019-06-01
CN106062049A (zh) 2016-10-26
WO2015093749A1 (ko) 2015-06-25
CN106062049B (zh) 2019-05-03

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