KR101466759B1 - 금속 인쇄회로기판의 제조방법 - Google Patents

금속 인쇄회로기판의 제조방법 Download PDF

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Publication number
KR101466759B1
KR101466759B1 KR1020120125712A KR20120125712A KR101466759B1 KR 101466759 B1 KR101466759 B1 KR 101466759B1 KR 1020120125712 A KR1020120125712 A KR 1020120125712A KR 20120125712 A KR20120125712 A KR 20120125712A KR 101466759 B1 KR101466759 B1 KR 101466759B1
Authority
KR
South Korea
Prior art keywords
thermally conductive
layer
circuit pattern
printing
insulating layer
Prior art date
Application number
KR1020120125712A
Other languages
English (en)
Korean (ko)
Other versions
KR20140059080A (ko
Inventor
정광춘
윤광백
안희용
한영구
유명봉
조남부
온웅구
Original Assignee
주식회사 잉크테크
(주)해은피엔씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 잉크테크, (주)해은피엔씨 filed Critical 주식회사 잉크테크
Priority to KR1020120125712A priority Critical patent/KR101466759B1/ko
Priority to TW105134293A priority patent/TW201707532A/zh
Priority to CN201380069763.5A priority patent/CN104904328B/zh
Priority to TW102140502A priority patent/TWI622335B/zh
Priority to PCT/KR2013/010064 priority patent/WO2014073876A1/ko
Publication of KR20140059080A publication Critical patent/KR20140059080A/ko
Application granted granted Critical
Publication of KR101466759B1 publication Critical patent/KR101466759B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2054—Light-reflecting surface, e.g. conductors, substrates, coatings, dielectrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
    • H05K3/246—Reinforcing conductive paste, ink or powder patterns by other methods, e.g. by plating

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020120125712A 2012-11-07 2012-11-07 금속 인쇄회로기판의 제조방법 KR101466759B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020120125712A KR101466759B1 (ko) 2012-11-07 2012-11-07 금속 인쇄회로기판의 제조방법
TW105134293A TW201707532A (zh) 2012-11-07 2013-11-07 金屬印刷電路板之製造方法
CN201380069763.5A CN104904328B (zh) 2012-11-07 2013-11-07 用于制造金属印刷电路板的方法
TW102140502A TWI622335B (zh) 2012-11-07 2013-11-07 金屬印刷電路板之製造方法
PCT/KR2013/010064 WO2014073876A1 (ko) 2012-11-07 2013-11-07 금속 인쇄회로기판의 제조방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120125712A KR101466759B1 (ko) 2012-11-07 2012-11-07 금속 인쇄회로기판의 제조방법

Publications (2)

Publication Number Publication Date
KR20140059080A KR20140059080A (ko) 2014-05-15
KR101466759B1 true KR101466759B1 (ko) 2014-11-28

Family

ID=50684908

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120125712A KR101466759B1 (ko) 2012-11-07 2012-11-07 금속 인쇄회로기판의 제조방법

Country Status (4)

Country Link
KR (1) KR101466759B1 (zh)
CN (1) CN104904328B (zh)
TW (2) TW201707532A (zh)
WO (1) WO2014073876A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106793534A (zh) * 2015-11-20 2017-05-31 富泰华工业（深圳）有限公司 电路板钢网印刷方法
CN106793535A (zh) * 2015-11-20 2017-05-31 富泰华工业（深圳）有限公司 电路板丝网印刷方法
CN106634177A (zh) * 2016-10-25 2017-05-10 林俊宝 一种固态的pcb印制线路板感光阻焊油墨及其制备方法
CN108093561A (zh) * 2017-12-22 2018-05-29 珠海市航达科技有限公司 一种热电分离印制电路板的制作方法
CN112582524A (zh) * 2019-09-12 2021-03-30 群创光电股份有限公司 发光装置及其制造方法
CN115515297A (zh) * 2021-06-22 2022-12-23 欣兴电子股份有限公司 线路板及其制作方法
CN114481672B (zh) * 2022-01-28 2023-08-22 赣州龙邦材料科技有限公司 一种制造覆铜板用芳纶纸增强基材的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100404562B1 (ko) * 2000-09-22 2003-11-05 마쯔시다덴기산교 가부시키가이샤 열전도 기판 및 이를 이용한 반도체 모듈
JP2008205453A (ja) 2007-01-26 2008-09-04 Teijin Ltd 放熱性実装基板およびその製造方法
KR101022873B1 (ko) * 2009-09-14 2011-03-16 삼성전기주식회사 인쇄회로기판의 제조방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FI20045501A (fi) * 2004-12-23 2006-06-24 Aspocomp Technology Oy Johdinkuvio, kytkentäalusta ja johdinkuvion ja kytkentäalustan valmistusmenetelmä
TWM366860U (en) * 2009-06-25 2009-10-11 Asia Electronic Material Co Covering film for printed circuit board
KR20110029285A (ko) * 2009-09-15 2011-03-23 도레이첨단소재 주식회사 백색 커버레이 필름 및 그 제조 방법
JP5901141B2 (ja) * 2010-05-17 2016-04-06 昭和電工株式会社 発光素子用実装基板、発光素子用実装基板の製造方法、発光装置及び発光装置の製造方法並びに白色樹脂組成物

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100404562B1 (ko) * 2000-09-22 2003-11-05 마쯔시다덴기산교 가부시키가이샤 열전도 기판 및 이를 이용한 반도체 모듈
JP2008205453A (ja) 2007-01-26 2008-09-04 Teijin Ltd 放熱性実装基板およびその製造方法
KR101022873B1 (ko) * 2009-09-14 2011-03-16 삼성전기주식회사 인쇄회로기판의 제조방법

Also Published As

Publication number Publication date
CN104904328B (zh) 2018-12-04
WO2014073876A1 (ko) 2014-05-15
TW201440593A (zh) 2014-10-16
TW201707532A (zh) 2017-02-16
KR20140059080A (ko) 2014-05-15
CN104904328A (zh) 2015-09-09
TWI622335B (zh) 2018-04-21

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