KR101466759B1 - Manufacturing for metal printed circuit board - Google Patents

Abstract

The present invention provides a method of manufacturing a light emitting device, comprising: printing a light reflection layer on a release film; Printing a circuit pattern on the light reflection layer; Applying a thermally conductive insulating layer on the circuit pattern; And removing the release film. The present invention also provides a method of manufacturing a metal printed circuit board.

Description

Technical Field [0001] The present invention relates to a method of manufacturing a metal printed circuit board,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a metal printed circuit board, and more particularly, to a method of manufacturing a metal printed circuit board by forming a light reflecting layer, a circuit pattern, and a thermally conductive insulating layer on a release film using a printing method, A circuit pattern, and a method of manufacturing a metal printed circuit board by forming a thermally conductive insulating layer and hot pressing the thermally conductive base layer.

Although LEDs (Light Emitting Diodes) are used as simple display devices in various colors in the form of point light sources, they are increasingly used in various fields such as monitors and area display devices of laptops / desktop computers due to their light efficiency and long life . Especially recently, it is about to expand its use range for lighting and LCD TV backlight.

In the case of LCD TV backlight and LED lighting, an array is formed on a substrate using a plurality of light emitting devices for reasons of high luminance per unit area and plane light emission. It is an important factor for LED lifetime and quality maintenance to effectively emit heat generated from LED by the array configuration.

LED array substrate uses metal core printed circuit board (MCPCB) instead of copper clad laminate (CCL) used in conventional PCB for smooth heat dissipation. Usually, such a MCPCB has a three-layer structure of a metal base layer, a dielectric layer, and a copper foil.

The dielectric layer may be made of an epoxy resin filled with thermally conductive particles to increase the thermal conductivity. The electrode circuit is formed by forming a resist pattern using a lithography technique or the like and etching the same as a conventional printed circuit board (PCB). However, the etching process for forming such an electrode circuit has a complicated manufacturing process, and there is a problem that a large amount of etching wastewater is generated during the process. In addition, the LED board based on MCPCB has a disadvantage that the heat dissipation performance is largely limited due to the epoxy dielectric layer.

In Korean Utility Model No. 20-0404237, an electrode circuit is formed by etching using MCPCB, and an opening to an insulating layer is formed at a portion where the LED is mounted, and a heat sink slug is attached to the opening, and the remaining LED member is mounted thereon However, it is not only difficult to cleanly remove the bonded insulating layer, but also it is a technique that is not economically feasible because it is contrary to the trend of the assembling method as described above.

Korean Patent No. 696063 discloses an LED array substrate in which only LED chips are extracted without using packaged LEDs and mounted on a separate substrate constituting a recess mounting portion, an insulating layer, a bonding die, a reflector, and an electrode. However, such a substrate can not be unified in terms of its characteristics, and involves complicated processing such as machining, formation of various layers, pattern formation, and direct molding on the substrate, and is contrary to the trend of assembly method. to be.

SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a method of forming a light reflection layer, a circuit pattern, and a thermally conductive insulation layer on a release film using a printing method, A metal printed circuit having excellent electrical characteristics, light reflection efficiency, and adhesion can be obtained by forming a light reflecting layer, a circuit pattern, and a thermally conductive insulating layer on a film by a printing method and performing hot pressing with the thermally conductive base layer. And a method of manufacturing a substrate.

The present invention provides a method of manufacturing a light emitting device, comprising: printing a light reflection layer on a release film; Printing a circuit pattern on the light reflection layer; Applying a thermally conductive insulating layer on the circuit pattern; And removing the release film. The present invention also provides a method of manufacturing a metal printed circuit board.

The present invention also provides a method of manufacturing a light emitting device, comprising: printing a light reflecting layer on a release film; Printing a circuit pattern on the light reflection layer; Applying a thermally conductive insulating layer on the circuit pattern; Stacking a thermally conductive base layer on the thermally conductive insulating layer, and thermally bonding the thermally conductive base layer; And removing the release film. The present invention also provides a method of manufacturing a metal printed circuit board.

According to the present invention, there is provided a method of manufacturing a metal printed circuit board excellent in electrical characteristics, light reflection efficiency, and adhesion.

Specifically, when the light reflection layer is disposed on the upper side of the circuit pattern, especially when the circuit pattern is formed of silver (Ag), it is possible to provide a significantly higher reflection efficiency than when the light reflection layer is provided on the copper circuit pattern.

Further, in the case of using a release coat film whose release force is adjusted as a release film, and sequentially printing a light reflection layer, a circuit pattern, and a thermal conductive insulation layer thereon using a direct printing method, and then thermally compressing the heat conductive base layer, A metal printed circuit board excellent in electrical characteristics and adhesion can be produced.

In addition, when the present invention is applied to a roll-to-roll process, which is a continuous printing process, it is possible to reduce manufacturing cost and mass production, thereby improving productivity.

1 is a view illustrating a method of manufacturing a metal printed circuit board according to an embodiment of the present invention.
FIG. 2 is a view illustrating a method of manufacturing a metal printed circuit board including the electrolytic / electroless plating process in FIG. 1 according to another embodiment of the present invention.
3 is a view illustrating a method of manufacturing a metal printed circuit board including a process of sequentially printing a conductive printed circuit pattern on a primary and a secondary in accordance with another embodiment of the present invention.
FIG. 4 is a view illustrating a method of manufacturing a metal printed circuit board including a process of sequentially applying a thermally conductive insulating layer on a primary and a secondary in accordance with another embodiment of the present invention.
5 is a view illustrating a method of manufacturing a metal printed circuit board that does not include a thermally conductive base layer according to another embodiment of the present invention.
FIG. 6 is a view illustrating a process of manufacturing a metal printed circuit board according to the present invention in a roll-to-roll continuous process.

A method of manufacturing a metal printed circuit board according to the present invention includes: printing a light reflection layer on a release film; Printing a circuit pattern on the light reflection layer; Applying a thermally conductive insulating layer on the circuit pattern; And removing the release film.

The releasing film may be a releasing coat film whose releasing force is controlled. Here, the releasing coat film can be produced by applying a releasing agent onto the heat-resistant film.

The heat-resistant film may be a film formed of PEN, PET, PE, PI, PC, or Al. However, the heat-resistant film is not limited thereto and heat resistant films of various materials may be used.

As the releasing agent, a silicone or an acrylic releasing agent can be used. In the case of the silicone releasing agent, the releasing agent has a heat resistance characteristic in which severe shrinkage does not occur during a thermocompression bonding process, and the releasing force can be easily controlled. In addition, various types of release agents known in the art may be used.

The release agent may be applied using microgravure, gravure, slot die, reverse kiss, or rotary screen coating method. In addition, various methods capable of applying a release agent in the field can be applied.

The light reflecting layer can be formed of various types of light reflecting layer forming inks including a light reflecting filler having a light reflecting property and a resin. As an example of such a light reflection layer forming ink, a white photo solder resist ink may be used, but it is not limited thereto and various inks known in the field can be used.

As the resin, a thermosetting resin or a UV curable resin can be used. In addition, various resins can be used as long as they are capable of various crosslinking reactions and have heat resistance, water resistance, abrasion resistance, and no yellowing property.

Here, as the light-reflecting filler, any filler having excellent reflection characteristics in the wavelength range of light emitted from the LED can be used. Examples include, but are not limited to _, SiO _2, TiO _2, Al ₂ O _3, BaSO 4, CaCo 3, Al flakes coated with insulating resin, or Ag flakes. In the case of using the metal flake, it is preferable to use the electrical insulating property by surface treatment.

The light reflecting layer may be printed by gravure printing, screen printing, or rotary screen printing, but the present invention is not limited thereto, and printing may be performed by various printing methods in the field.

The circuit pattern is a conductive printed circuit pattern formed by printing a metal paste by a printing method and may be printed by a gravure printing method, a flexo printing method, an offset printing method, a screen printing method, a rotary screen printing method, or an inkjet printing method However, it is not necessarily limited to this, and it is of course possible to print in various ways.

The circuit pattern may be formed of a metal paste. More specifically, an ink made of a metal such as Ag, Cu, Ag / Cu, Sn, Ag / Cu / Zn, Au, Ni, or Al excellent in electrical conductivity or doping, .

As a specific example, a circuit pattern may be printed and heat-treated using an Ag complex, Ag salts, or an Ag-acid / base complex, which is an Ag transparent electronic ink. As another example, a circuit pattern may be printed using Ag Nano paste, Ag Flake paste, or Ag Granule paste, and heat treatment may be performed. Here, besides curing by heat treatment, UV curing or e-beam may be used.

The ink for forming the circuit pattern is not limited to the above-described example. It is needless to say that any ink that is conductive in the technical field of the present invention and can be printed by a printing method is applicable.

As another example of forming the circuit pattern, it is also possible to include a first printing step of printing a first circuit pattern on the light reflecting layer and a second printing step of printing a second circuit pattern on the first pattern The circuit pattern may be printed while controlling the position on the light reflection layer. Concretely, by sequentially performing the primary and secondary circuit patterns, a pattern can be realized more precisely, and printing defects that may occur due to the step difference of the light reflection layer can be solved.

In addition to the above-described method, the circuit pattern may be formed by depositing or sputtering Al, Ag, Cu, Ni, etc., which are electrically conductive metals, using a mask pattern.

The method may further include plating the circuit pattern between the step of printing the circuit pattern on the light reflecting layer and the step of applying the thermally conductive insulating layer on the circuit pattern, , Electroplating or electroless plating may be performed.

As described above, the circuit pattern may be used alone, or may be adjusted to the plating thickness of the plated copper according to the amount of the applied current, so that the seed pattern characteristic may be maintained.

Here, the circuit pattern may be formed by printing an ink containing a catalyst such as Pd colloid, PdCl _2, etc. on a circuit pattern, followed by electroless copper plating or nickel plating to form a printed circuit board circuit. In addition, when a high capacity (W ↑) LED (LED) with high current consumption is used, the copper electroplating can be plated with an appropriate plating thickness according to the current consumption.

As described above, the electroplating can be performed by electroless plating, electroplating, deep coating or the like, and there is no limitation on the metal used for plating, but copper may be preferable. The deep coat method may be preferable when treating Sn, Zn, and the like. It is needless to say that the present invention can be applied variously to Ni, Sn, Pd, Zn, Ag, and Au in addition to Cu.

The thermally conductive insulating layer may be formed of a thermally conductive insulating layer coating liquid as a thermosetting coating resin ink. Here, in addition to the thermosetting resin, a UV-curable resin can be used for UV curing, and various crosslinking reactions are possible, and the resin composition is not limited. However, it is preferable to have the characteristics of heat resistance and weather resistance. In the case of using a metal flake having high electrical conductivity, it is desirable to impart electrical insulation through surface treatment and to have only thermal conductivity characteristics.

For example, epoxy resin, urethane resin, urea resin, melamine resin, phenol resin, silicone resin, polyimide resin, polysulfone resin, polyester resin, polyphenylene sulfide resin and the like can be used as the resin used for the thermally conductive insulating layer However, it is preferable to use a thermosetting resin, though not necessarily limited thereto.

UV curable resin or radical polymerizable resin can be used, and both of the resin surfaces having good heat resistance and weather resistance can be used, and they can be formed of at least one selected from the modifications of these resins.

With the resin SiO _2, TiO _2, Al₂O₃, BaSO₄, CaCo₃, Al flakes (flake), Ag flakes (flake), oxidized graphene, graphite oxide, oxidized carbon nanotubes, ITO, selected from AlN, BN, and MgO It is preferable to further include a filler. Here, in the case of Al or Ag flakes, it may be preferable that an insulating resin is coated. However, the fillers are not limited to these.

As an example of the thermally conductive insulating layer coating solution, bisphenol A type modified epoxy resin, phenol novolac epoxy resin, hexahydrophthalic anhydride, quaternary ammonium salt, alumina, dispersant, and solvent (MEK) , But the composition is not limited thereto.

The thermally conductive insulating layer can be applied by an S-knife, a gravure, a flexo, a screen, a rotary screen, a slot die, or a microgravure coating method.

Here, the thermally conductive insulating layer may be formed as a single layer or divided into primary and secondary layers.

Specifically, the method includes a first coating step of applying a first thermal conductive insulating layer on the circuit pattern and a second coating step of coating a second thermal conductive insulating layer on the first thermal conductive insulating layer .

Here, in the case of the first application step, it can be applied by a method selected from microgravure, S-knife, gravure, flexo, screen, and rotary screen.

In the case of the second application step, it can be applied by a method selected from slot die, S-knife, and microgravure. However, this is not necessarily the case.

Specifically, in the case of the first coating step, the entire surface can be coated using a printing method such as microgravure, flexo, screen, and rotary screen. In the case of a copper-plated printed circuit board, It may be preferable to use a die coater or an S-knife coater to uniformize the surface roughness. Here, when uniformity of the surface can not be ensured even by the first application of the thermally conductive insulating layer, or if the thickness of the thermally conductive insulating layer needs to be made thick, the second application of the thermally conductive insulating layer may be performed by using a slot die, S-knife, microgravure It may be desirable to use it. Further, in order to optimize the heat dissipation characteristics and the insulation characteristics, it may be preferable to proceed to two stages as described above.

A metal printed circuit board may be manufactured in this manner, and a heat conductive base layer may be further included.

Specifically, the method includes: printing a light reflection layer on a release film; Printing a circuit pattern on the light reflection layer; Applying a thermally conductive insulating layer on the circuit pattern; Stacking a thermally conductive base layer on the thermally conductive insulating layer, and thermally bonding the thermally conductive base layer; And removing the release film.

Here, as the thermally conductive base layer, a hot-rolled steel sheet, a cold rolled steel plate, an aluminum plate, a galvanized steel plate, a copper plate, a stainless steel plate, a tinned gold plate, a brass plate, or a resin- coated steel plate may be used, A heat sink of various materials used in the field of the present invention can be applied.

In this case, when the thermally conductive base layer is further included, the thermally conductive insulation layer may be formed by forming a semi-cured non-stage (B-stage) in order to bond the thermally conductive base layer such as an Al plate It may be preferred if it is lined with a thermally conductive base layer. On the other hand, in the case of an LED printed circuit board (LED PCB), a thermally conductive base layer is not included, and the function can be sufficiently performed. When the thermally conductive base layer is not included, it may be preferable to include a filler such as graphene or carbon nanotube in the thermally conductive insulating layer which is applied in the secondary.

In the step of laminating the thermally conductive base layer on the thermally conductive insulating layer and thermally bonding the thermally conductive base layer, the thermally conductive base layer may be performed at a temperature of 120 to 200 ° C, preferably at a temperature of 140 to 175 ° C .

As described above, each step of the method of manufacturing a metal printed circuit board according to the present invention can be performed by a roll-to-roll continuous process. In this case, the production speed is increased, So that it can be preferable.

1, a light reflecting layer and a circuit pattern are printed on a release film, and then a thermally conductive insulating layer is applied and bonded to the thermally conductive base layer. The metal foil film may be removed to produce a metal printed circuit board.

As shown in another example shown in FIG. 2, a light reflection layer and a circuit pattern are printed on a release film, electrolytic / electroless plating is performed on the light reflection layer and a circuit pattern, and then a thermally conductive insulating layer is applied. After that, the release film may be removed to produce a metal printed circuit board.

As shown in another example shown in Fig. 3, a light reflection layer is printed on a release film, the primary circuit pattern and the secondary circuit pattern are sequentially printed, a thermally conductive insulating layer is applied, After bonding with the base layer, the release film may be removed to produce a metal printed circuit board.

4, a light reflection layer and a circuit pattern are printed on a release film, and then a primary thermal conductive insulation layer and a secondary thermal conductive insulation layer are coated and bonded to the thermally conductive base layer. Then, the release film is removed, A circuit board may be manufactured.

As shown in FIG. 5, a metal printed circuit board may be manufactured by printing a light reflecting layer and a circuit pattern on a release film, applying a thermally conductive insulating layer containing a thermally conductive filler having excellent effects, and removing the release film.

As shown in FIG. 6, when the process shown in FIG. 1 to FIG. 5 is performed by applying to the roll-to-roll continuous process, the productivity can be improved, which is more preferable.

Hereinafter, the present invention will be specifically described with reference to examples and comparative examples, but the scope of the present invention is not limited thereto.

Example 1

White Photo Solder Resist ink / InkTech, SWP-020) was applied onto a heat-resistant silicone release coat film (MR-50, BioVisionChem Co., Ltd.) as a release film by a screen printing method (Tokai-seiki, SFA -RR350), and dried at 100 DEG C for 20 minutes to form a light reflecting layer having a thickness of 5 mu m.

A circuit pattern was printed on a light reflecting layer by a screen printing method (Tokai-seiki, SFA-RR350) with an Ag paste (Ink Tec, TEC-PF-021) and dried at 150 ° C for 5 minutes to form a 3 μm To form a circuit pattern.

Using a slot die coater (Pectiv), a thermally conductive insulating layer coating liquid (Table 1) as a thermosetting coating resin ink was coated on the circuit pattern with a dry thickness of 25 mu m to form a thermally conductive insulating layer.

Here, the compositions of the thermally conductive insulating layer coating liquid were as shown in Table 1.

[Table 1]

An aluminum plate (AL5052, Sejong Metal Co., Ltd.) having a thickness of 0.8 mm was laminated as a thermally conductive base layer on the thermally conductive insulating layer, thermocompression-bonded by hot press for 60 minutes at a temperature of 170 캜, The silicone release coat film was removed to produce a metal printed circuit board.

Example 2

A metal printed circuit board composed of a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive base layer was manufactured in the same manner as in Example 1 except that the light reflecting layer was formed to a thickness of 10 mu m.

Example 3

A metal printed circuit board composed of a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive base layer was manufactured in the same manner as in Example 1 except that the light reflecting layer was formed to a thickness of 15 mu m.

Example 4

A circuit pattern, a thermally conductive insulating film, and the like were formed in the same manner as in Example 1 except that a light reflection layer was formed using a white photo solder resist ink (Taiyo ink Co., Ltd., S-200W) Layer, and a thermally conductive base layer.

Example 5

A metal printed circuit board composed of a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive base layer was produced in the same manner as in Example 4 except that the light reflecting layer was formed to a thickness of 10 mu m.

Example 6

A metal printed circuit board composed of a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive base layer was produced in the same manner as in Example 4 except that the light reflecting layer was formed to a thickness of 15 mu m.

Example 7

A light reflection layer was formed to a thickness of 2 mu m using a rotary screen printing method (Stock, RSI 16 " R), and the resultant was subjected to rotary screen printing (Stock, RSI 16 A metal printed circuit board composed of a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive base layer was formed in the same manner as in Example 4 except that a circuit pattern having a thickness of 5 mu m was formed using the above- .

Example 8

A metal printed circuit board composed of a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive base layer was produced in the same manner as in Example 7 except that the circuit pattern was formed to a thickness of 2 탆.

Example 9

A circuit pattern, a thermoelectric conversion layer, and a transparent conductive layer were formed in the same manner as in Example 7 except that a circuit pattern having a thickness of 1 mu m was formed by using direct gravure printing method (COTech) with an Ag paste (Ink Tec, TEC-R2A) A conductive insulating layer, and a thermally conductive base layer.

Example 10

A metal printed circuit board composed of a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive base layer was produced in the same manner as in Example 9 except that the circuit pattern was formed to a thickness of 0.5 탆.

Example 11

L of 65 ml / L of PdCl ₂ and 30 g / L of sulfuric acid was heated to 30 ° C and the circuit pattern was immersed for 10 minutes to adsorb Pd. Then, 100 ml / L of the Cu mixture solution, 25 ml / L of the stabilizer and chelate mixture, And an aldehyde of 8 ml / L, and immersed in a mixed solution heated to 40 ° C for 30 minutes to conduct electroless plating to form a copper plating layer having a thickness of 0.5 탆, a light reflecting layer and a copper plating layer were formed in the same manner as in Example 10 A metal printed circuit board composed of a formed circuit pattern, a thermally conductive insulating layer, and a thermally conductive base layer was produced.

Example 12

2.5 ASD current was applied to the electrolytic copper plating solution composed of 200 g / L of sulfuric acid, 80 g / L of copper sulfate, 70 ppm / L of chlorine, and 5 ml / L of A3 company PC-900 gloss agent for 15 minutes to form copper plating layer 5 A metal printed circuit board composed of a light reflecting layer, a circuit pattern formed with a copper plating layer, a thermally conductive insulating layer, and a thermally conductive base layer was produced in the same manner as in Example 10 except that the thermally conductive base layer was formed.

Example 13

A metal printed circuit board composed of a circuit pattern having a light reflecting layer, a copper plating layer, a thermally conductive insulating layer, and a thermally conductive base layer was formed in the same manner as in Example 12 except that the copper plating layer was formed to 10 mu m by copper plating for 25 minutes. .

Example 14

A metal printed circuit board composed of a circuit pattern having a light reflecting layer, a copper plating layer, a thermally conductive insulating layer, and a thermally conductive base layer was formed in the same manner as in Example 12 except that the copper plating layer was formed to a thickness of 15 탆 for 35 minutes. .

Example 15

A metal printed circuit board composed of a circuit pattern having a light reflecting layer, a copper plating layer, a thermally conductive insulating layer, and a thermally conductive base layer was formed in the same manner as in Example 12 except that the copper plating layer was formed in a thickness of 20 탆 for 50 minutes .

Example 16

A metal printed circuit board composed of a circuit pattern having a light reflecting layer, a copper plating layer, a thermally conductive insulating layer, and a thermally conductive base layer was formed in the same manner as in Example 12 except that the copper plating layer was formed to have a thickness of 30 μm .

Example 17

Except that a circuit pattern having a thickness of 0.5 占 퐉 was formed by using a flexo printing method (POENG, Kodak company resin plate) with an Ag paste (Ink Tec, TEC-PR-020) A metal printed circuit board composed of a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive base layer was produced.

Example 18

White Photo Solder Resist ink / Taiyo ink, S-200W) was coated on a heat resistant silicone release coat film (MR-50, BioVisionChem Co., Ltd.) as a release film by a rotary screen printing method 16 " R), and dried at 100 DEG C for 20 minutes to form a light reflection layer with a thickness of 5 mu m.

The chip mounting portion was printed on the light reflecting layer in one step using a screen printing method (Tokai-seiki, SFA-RR350) with an Ag paste (Ink Tec, TEC-PF-021) and heat treated at 150 캜 for 5 minutes , And the circuit pattern portion was printed in two steps in the same manner as paste and the same method, followed by heat treatment at 150 DEG C for 5 minutes to form a circuit pattern with a thickness of 3 mu m.

A 2.5 ASD current was applied to an electrolytic copper plating solution composed of 200 g / L of sulfuric acid, 80 g / L of copper sulfate, 70 ppm / L of chlorine, and 5 mL / L of "A3 PC-900" polishing agent for 50 minutes to form a copper layer 20 mu m.

Next, the same thermally conductive insulating layer coating solution as in Table 1 of Example 1 was coated with a dry thickness of 25 占 퐉 using a slot die coater (Pectiv) to form a thermally conductive insulating layer.

An aluminum plate (AL5052, Sejong Metal Co., Ltd.) having a thickness of 0.8 mm was laminated as a thermally conductive base layer on the thermally conductive insulating layer, thermocompression-bonded by hot press for 60 minutes at a temperature of 170 캜, The silicon release coat film was removed to produce a metal printed circuit board composed of a light reflecting layer, a printed circuit pattern twice, a thermally conductive insulating layer, and a thermally conductive base layer.

Example 19

On the copper plating layer, a thermally conductive insulating layer coating liquid of Table 2 containing graphene oxide was coated with a dry thickness of 25 占 퐉 using a slot die coater (Pectiv) to form a thermally conductive insulating layer, A metal printed circuit board composed of a heat reflecting layer including a light reflecting layer, a circuit pattern formed with a copper plating layer, and a thermally conductive insulating layer containing oxidized grains was formed in the same manner as in Example 15 except that a thermally conductive base layer was not laminated on the insulating layer. .

[Table 2]

Example 20

Conducting thermal insulation with the thermally conductive insulation layer coating solution of Table 3 containing oxidized CNT (see Table 3) obtained by reacting unoxidized MWCNT (Multi-Walled CNT, Enano Tec, 900-1255-1G) with 65% HNO ₃ A metal printed circuit board composed of a light reflecting layer, a circuit pattern formed with a copper plating layer, and a thermally conductive insulating layer containing oxidized CNTs was produced in the same manner as in Example 19.

[Table 3]

Example 21

On the copper plating layer, a microgravure coater (POENG Co., Microgravure Coater #

H24) was used to primarily coat the same thermally conductive insulating layer coating solution as in Table 1 of Example 1 with a dry thickness of 25 占 퐉, and then dry the same thermally conductive insulating layer coating solution using a slot die coater (Pectiv) Except that the heat conductive base layer was not laminated on the thermally conductive insulation layer to form a circuit pattern having a light reflection layer and a copper plating layer, , And a two-coat thermally conductive insulating layer.

Example 22

A circuit pattern in which a light reflection layer and a copper plating layer were formed, and a circuit pattern in which a copper plating layer was formed in the same manner as in Example 21 except that a heat-conductive insulating layer was formed by secondary coating with a dry thickness of 75 탆 in the secondary coating, A metal printed circuit board composed of a heat-coated insulating layer was formed.

Comparative Example 1

The same thermally conductive insulating layer coating solution as in Table 1 of Example 1 was coated on a copper-clad laminate (Uncoated Copper Foil) using a slot die coater (Pectiv) to a dry thickness of 25 占 퐉 to form a thermally conductive insulating layer .

An aluminum plate (AL5052, Sejong Metal Co., Ltd.) having a thickness of 0.8 mm was laminated as a thermally conductive base layer on the thermally conductive insulating layer, thermocompression-bonded by hot press for 60 minutes at a temperature of 170 캜, A copper foil circuit pattern was formed through a photoetching process, and a white photo solder resist ink (White Photo Solder Resist ink / Taiyo ink, S-200W) was printed with a screen printing method (Tokai-seiki, SFA-RR350) And dried at 100 DEG C for 20 minutes to form a light reflective layer with a thickness of 5 mu m.

Comparative Example 2

Except that a light reflection layer was formed at a thickness of 10 mu m.

Comparative Example 3

Except that the light reflection layer was formed to a thickness of 15 mu m.

Experimental Example

1) Measurement method

The thickness after drying of the light reflection layer, the circuit pattern and the thermally conductive insulating layer was measured using a non-contact three-dimensional measuring instrument (Nano System NANO SYSTEM, NV-P1010) manufactured according to Examples and Comparative Examples. The reflectance was measured with a reflectance meter [VARIAN Co., Cary 5000], and the results were shown in Table 4. The results are shown in Table 4 below. [Table 4] < tb > < tb > Respectively.

2) Measurement result

[Table 4]

　

　

As described above, according to the present invention, when the light reflection layer is disposed on the upper side of the circuit pattern, it is possible to provide an excellent reflection efficiency of about 4 to 10% as compared with the comparative example of the same thickness (Examples 1 to 6). In addition, when the light reflection layer and the circuit pattern are formed by the continuous printing method, the reflection efficiency is not significantly decreased even though the thickness of the light reflection layer is lower than that of the comparative example. Thus, productivity and process cost reduction can be expected. In particular, when a circuit pattern is printed with a thickness low enough to form a copper plating layer and then a copper plating layer is formed to a thickness of about 10 탆 or more (Examples 13 to 16), a copper film thickness of 18 탆 or more It is possible to maintain an electrical characteristic equivalent to that of the conventional method, thereby providing a method of preventing the consumption of unnecessary raw materials. Therefore, by forming a light reflecting layer, a circuit pattern, and a thermally conductive insulating layer in this order on a release film by a direct printing method, and by hot pressing the thermally conductive base layer, a metal printed circuit board And it is possible to manufacture a metal printed circuit board which can be easily applied in a roll-to-roll continuous process, which can reduce manufacturing cost and mass production, thereby improving productivity.

Claims (13)

Printing an ink for forming a light reflection layer including a light reflection filler and a resin on a release film to form a light reflection layer;
Printing a circuit pattern on the light reflection layer;
Applying a thermally conductive insulating layer on the circuit pattern; And
And removing the release film,
Further comprising a step of thermally compressing the thermally conductive base layer after laminating the thermally conductive base layer on the thermally conductive insulation layer between the step of applying the thermally conductive insulation layer and the step of removing the release film. A method of manufacturing a printed circuit board. delete The method according to claim 1,
Wherein the thermally conductive base layer is a hot-rolled steel plate, a cold-rolled steel plate, an aluminum plate, a galvanized steel plate, a copper plate, a stainless steel plate, a tin-plated plate, a brass plate, or a resin- . The method according to claim 1,
Wherein the step of laminating the thermally conductive base layer on the thermally conductive insulating layer and thermally bonding the thermally conductive base layer is performed at a temperature of 120 to 200 ° C. The method of claim 1, 3, or 4,
Wherein the light reflecting layer is printed by a gravure printing method, a screen printing method, or a rotary screen printing method. The method of claim 1, 3, or 4,
Wherein the circuit pattern is printed by gravure printing, flexographic printing, offset printing, screen printing, rotary screen printing, or inkjet printing. The method of claim 1, 3, or 4,
The step of printing the circuit pattern on the light reflecting layer includes a primary printing step of printing a primary circuit pattern on the light reflecting layer and a secondary printing step of printing a secondary circuit pattern on the primary pattern Wherein the metal substrate is a metal substrate. The method of claim 1, 3, or 4,
Further comprising the step of plating on the circuit pattern between the step of printing the circuit pattern on the light reflecting layer and the step of applying the thermally conductive insulating layer on the circuit pattern, ≪ / RTI > The method of claim 8,
Wherein the plating step is carried out by electrolytic plating or electroless plating. The method of claim 1, 3, or 4,
Wherein the thermally conductive insulating layer is applied by S-knife, gravure, flexo, screen, rotary screen, slot die, or microgravure coating method. The method of claim 1, 3, or 4,
Wherein the step of applying the thermally conductive insulating layer on the circuit pattern includes a first coating step of coating a first thermally conductive insulating layer on the circuit pattern and a second coating step of coating a second thermally conductive insulating layer on the first thermally conductive insulating layer And a second coating step of coating the metal substrate. The method of claim 1, 3, or 4,
Wherein the thermally conductive insulating layer is made of a material selected from the group consisting of SiO2 _, TiO2 _, Al2O3, BaSO4, CaCo3, Al flake, Ag flake, oxide graphene, graphite oxide, carbon oxide nanotube, ITO, AlN, BN, MgO, < / RTI > and the like. The method of claim 1, 3, or 4,
Wherein the steps are performed by a roll-to-roll continuous process.

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