TW201707532A - Method of manufacturing metal printed circuit board - Google Patents

Abstract

Provided is a method of manufacturing a metal printed circuit board (PCB), the method including: printing a light reflection layer on a releasing film; printing circuit patterns on the light reflection layer; applying a thermal conductive insulating layer onto the circuit patterns; and removing the releasing film.

Description

Metal printed circuit board manufacturing method

The present invention relates to a method of manufacturing a metal printed circuit board (PCB); more particularly, to manufacturing a metal printing by forming a light reflecting layer, a circuit pattern, and a thermally conductive insulating layer on a release film by a printing method. a method of manufacturing a printed circuit board (PCB), or by forming a light-reflecting layer, a circuit pattern and a thermally conductive insulating layer on a release film by a printing method, and hot-pressing the thermally conductive underlying layer to manufacture a metal printed circuit board ( PCB) method.

Although, initially, light-emitting diodes (LEDs) were used in simple lighting devices with different color point sources, LEDs are increasingly being used in a variety of different ways due to the long life of LEDs, for example, laptops. Display, large area display device. In particular, recently, the application range of LEDs has gradually expanded in the field of lighting and LCD TVs.

In the field of illumination and LCD TVs, an array comprising a plurality of light-emitting elements is disposed on a substrate due to the brightness per unit area and the characteristics of planar emission. Array configuration is a key factor in maintaining LEDs' lifetime, as arrayed configurations can efficiently help dissipate heat.

The LED array substrate uses a metal core printed circuit board (MCPCB) instead of a copper foil substrate (CCL) used in a conventional printed circuit board, so that the generated heat can be smoothly discharged. MCPCBs typically have a three-layer construction that includes a metal substrate layer, a dielectric layer, and a copper layer.

An epoxy resin filled with heat transfer particles is applied to the dielectric layer to increase thermal conductivity. Like conventional PCBs, electrode circuits are formed by etching using lithography. However, forming an electrode circuit by an etching process is very complicated, and a large amount of treated wastewater is generated during the etching process. At the same time, due to the relationship of the epoxy dielectric layer, the heat dissipation performance of the LED array substrate using the metal core printed circuit board (MCPCB) is very limited.

According to the South Korean utility model patent application (Case No. 20-0404237), the electrode circuit is formed by etching treatment using MCPCB, an opening is formed on the insulating layer where the LEDs are located, and the heat conducting block is attached to the opening, and the other The LED component is disposed on the heat conducting block. However, it is difficult to completely remove the attached insulating layer from the electrode circuit, and this assembly method is not used for the current assembly trend, making the economic feasibility lower.

The Korean Patent Application (Case No.: 696063) discloses an LED array substrate disposed on a separate substrate, including a recessed portion, an insulating layer, a bonding die, a reflective plate, and an electrode, and an LED chip is selected. Not using packaged LEDs. However, due to the characteristics of the LED array substrate, the specifications are not uniform and the process is complicated, such as mechanical processing, forming different layers, forming patterns, and directly forming on the substrate, but the assembly method is not suitable for the current assembly trend, so that Economic viability has become lower.

One or more embodiments of the present invention provide a method of fabricating a metal printed circuit board (PCB) in which a metal printed circuit board utilizes a printing method to form a light reflective layer, a circuit pattern, and a thermally conductive insulating layer. Manufactured on the release film, or by a printing method to form a light-reflecting layer, a circuit pattern, and a thermally conductive insulating layer on the release film, and the metal thermal conductive substrate layer is hot-pressed, thus, metal printing The board will have good electrical characteristics, good light reflection efficiency, and excellent adhesion between materials.

Other aspects of the invention will be described hereinafter and will be apparent from the written description.

According to one or more embodiments of the present invention, a method of manufacturing a metal printed circuit board (PCB) includes: printing a light reflecting layer on a release film; printing a circuit pattern on the light reflecting layer; coating a thermal conductive insulation Laying on the circuit pattern; and removing the release film.

According to one or more embodiments of the present invention, a method of manufacturing a metal printed circuit board (PCB) includes: printing a light reflecting layer on a release film; printing a circuit pattern on the light reflecting layer; coating a thermal conductive insulation Laminating on the circuit pattern; stacking a metal thermally conductive substrate layer on the thermally conductive insulating layer and thermally pressing the metal thermally conductive substrate layer; and removing the release film.

1 is a cross-sectional view showing a method of fabricating a metal printed circuit board (PCB) according to an exemplary embodiment of the present invention.

2 is a cross-sectional view showing a method of fabricating a metal printed circuit board (PCB) incorporating electroplating and electroless plating according to another exemplary embodiment of the present invention.

3 is a cross-sectional view showing a method of fabricating a metal printed circuit board (PCB) including successive first and second printed conductive circuit patterns, in accordance with another exemplary embodiment of the present invention.

4 is a cross-sectional view showing a method of fabricating a metal printed circuit board (PCB) including a first and second application of a thermally conductive insulating layer in succession, in accordance with another exemplary embodiment of the present invention.

5 is a cross-sectional view showing a method of fabricating a metal printed circuit board (PCB) that does not include a thermally conductive substrate layer, in accordance with an exemplary embodiment of the present invention.

Figure 6 is a view showing a process in which the manufacture of a metal printed circuit board (PCB) is performed in a roll-to-roll continuous process.

The invention now will be described more fully hereinafter with reference to the accompanying drawings, in which However, the invention may be embodied in many different forms and should not be construed as being limited to the embodiments set forth herein. Rather, these embodiments are provided The present disclosure is intended to be thorough and comprehensive, and the scope of the invention can be fully conveyed to those skilled in the art. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Similar numbers always indicate similar components. It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements, such elements are not limited by the terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be termed a second element without departing from the teachings of the inventive concept. As used herein, the term "and/or" includes any of the associated listed items and all combinations of one or more. Various illustrative embodiments of the invention are described in detail below with reference to the drawings.

A method of manufacturing a metal printed circuit board (PCB) according to an embodiment of the present invention includes: printing a light reflecting layer on a release film; printing a circuit pattern on the light reflecting layer; applying a thermal conductive insulating layer to The circuit pattern; and removing the release film.

A release coating having an adjusted release force is used as a release film. Here, the release coating film is produced by applying a release agent onto a heat-resistant film.

The heat resistant film is formed of PEN, PET, PE, PI, PC or Al. However, the present invention is not limited thereto, and the heat resistant film is conventionally formed of different materials.

A ruthenium type release agent or an acryl release agent can be used as the release agent of the present invention. The ruthenium type release agent has heat resistance, which can cause severe shrinkage during hot pressing, and the release force of the ruthenium type release agent can be easily adjusted. In addition, other types of release agents conventionally known in the art to which the present invention pertains can also be used as the release agent of the present invention.

The release agent can be applied in a number of ways, for example, a micro gravure coating, a gravure coating, a slit coating, a reverse anastomotic coating, or a cylinder screen coating. In addition, other methods of applying a release agent known in the art to which the present invention pertains can also be utilized in the present invention.

The light reflecting layer can be formed using different kinds of inks, and the light reflecting layer contains a light reflecting filler, and a resin having light reflecting properties. For example, the ink used to form the light reflecting layer may be a white solder resist ink. However, the present invention is not limited, and other kinds of inks conventionally known in the art to which the present invention pertains can also be utilized in the present invention.

Here, a thermosetting resin or an ultraviolet curing resin can be used in the present invention. In addition to this, any kind of resin having characteristics can be utilized in the present invention, for example, heat resistance, water repellency, abrasion resistance, and non-yellowing characteristics, and a crosslinking reaction is generated therein.

Here, any type of filler having a reflective property (the wavelength range of light is a wavelength range of light of the LED) can be used as the light-reflecting filler of the present invention. For example, the light reflective filler of the present invention may be SiO ₂ , TiO ₂ , Al ₂ O ₃ , BaSO ₄ , CaCo ₃ , aluminum flakes or silver flakes coated with an insulating resin. However, the invention is not limited. When the foil is used as a filler, surface treatment will be utilized to make the surface of the foil electrically insulating.

The light reflecting layer can be printed by different methods, for example, gravure printing, screen printing or cylinder screen printing. However, the invention is not limited. Other printing methods known in the art to which the present invention pertains can also be utilized in the present invention.

The circuit pattern is a conductive printed circuit pattern formed by a metal coating using a printing method. For example, printing methods that can be utilized are gravure, flexographic, lithographic, screen printing, cylinder screen printing or ink jet printing. However, the invention is not limited. Other methods of printing circuit patterns as known in the art to which the present invention pertains can also be utilized in the present invention.

The circuit pattern is formed by a metallic coating. In more detail, the circuit pattern is formed by an ink formed of a metal, for example, Ag, Cu, Ag/Cu, Sn, Ag/Cu/Zn, Au, Ni, and Al having good electrical conductivity, or borrowed By doping and coating, or alloys of these metals.

In detail, the circuit pattern is printed and surface treated with a transparent electronic ink of silver, for example, a mixture of silver, a salt containing silver, or a mixture of an acid or a base containing silver. In addition to this, the circuit pattern is printed and heat treated (using, for example, silver nano paint, silver flake paint or silver particle paint). Here, ultraviolet light heat treatment or electron beam heat treatment can be utilized in the present invention.

The ink forming the circuit pattern is not limited to the foregoing embodiments, and any conventional ink having a conductive property and a conventional printing method can be utilized in the present invention.

In another embodiment of the invention, the circuit pattern is printed on the reflective layer by controlling the composition of the circuit pattern. This method includes a first printing operation for printing a first circuit pattern on the light reflecting layer and a second printing operation for printing the second circuit pattern on the first circuit pattern. In detail, the first circuit pattern and the second circuit pattern are continuously printed to form a more precise circuit pattern, and the problem of defects caused by the difference in height between the light reflecting layer and the circuit pattern can be solved.

The circuit pattern can be formed by depositing and sputtering a conductive metal using a mask pattern or other manner as described above, for example, Al, Ag, Cu or Ni.

The method of manufacturing a metal printed circuit board may further include a step of printing a circuit pattern on the light reflective layer and a step of applying a thermally conductive insulating layer on the circuit pattern, and further comprising the step of performing electroplating on the circuit pattern, the step being applicable Performed by electroplating or electroless plating.

As described above, the circuit pattern can be used alone, or the circuit pattern can be plated with copper to have a plating thickness by using the amount of current applied as long as the circuit pattern can maintain the characteristics of the seed layer.

Here, the ink may contain a catalyst such as palladium colloid or PdCl ₂ and is printed according to a circuit pattern, followed by performing electroless copper plating or nickel electroless plating on the circuit pattern, thereby forming a printed circuit board circuit. Likewise, when a high capacity (W↑) LED having a high current consumption is used, copper electroless plating is performed on the circuit pattern in accordance with the amount of current consumed to achieve a suitable plating thickness.

As described above, the electroplating method can be used to improve conductivity, for example, electroless plating, electroplating or deep coating, and the present invention does not limit the metal used in the electroplating process. The deep coating is used to treat Sn or Zn. Like Cu, Ni, Sn, Pd, Zn, Ag, and Au can be used in different ways.

The thermally conductive insulating layer is formed by applying a solution of a thermally conductive insulating layer, and the thermally conductive insulating layer coating solution is used as a thermosetting coating resin ink. Both the UV coating resin or the UV curable resin can be used for UV curing, and many different crosslinking reactions are produced, and the present invention does not limit the composition of the resin. However, when a highly conductive metal foil is used, the metal foil can have electrical insulation and thermal conductivity via surface treatment.

For example, epoxy resin, urethane resin, urea resin, melamine resin, phenol resin, oxime resin, polyamido resin, polyfluorene resin, polyester resin or polyphenylene sulfide resin It can be used as a resin used in the thermally conductive insulating layer, and the present invention is not limited thereto, and the thermally crosslinked resin is also one of usable resins.

A UV curable resin or a radical polymerizable resin can also be used. Any resin having good heat resistance and weather resistance can be used, and the resin can be formed of a deformed substance of one or more of the foregoing resins.

Filled with SiO ₂ , TiO ₂ , Al ₂ O, BaSO ₄ , CaCo ₃ , aluminum flakes, silver flakes, graphene oxide flakes, graphite oxide, carbon nanotubes (CNTs), ITO, AlN, BN, and MgO The material may be further included in the thermally conductive insulating layer together with the resin. Here, the aluminum foil and the silver foil are coated with an insulating resin. However, the present invention is not limited thereto for the filler.

The coating solution as the thermally conductive insulating layer can be prepared by mixing and dispersing a double-aromatic A denatured epoxy resin, a novolac epoxy resin, a hexahydropeptidic anhydride, a quaternary ammonium salt, an alumina, a dispersing agent, and a soluble cyclohexanone. A coating solution of a thermally conductive insulating layer. However, the present invention is not limited to the composition of the thermally conductive insulating layer.

The thermally conductive insulating layer may be coated by a S blade coating film, a gravure coating film, a flexographic coating film, a screen coating film, a cylinder screen coating film, or a micro gravure coating.

Here, the thermally conductive insulating layer may be a single layer structure or a structure formed by the first operation and the second operation.

In detail, the coating of the thermally conductive insulating layer on the circuit pattern may include a first coating operation of coating the first thermally conductive insulating layer and a second coating operation of coating the second thermally conductive insulating layer, thereby forming a thermally conductive insulating layer. .

Here, in the first coating operation, the first thermal conductive insulating layer may be coated by a printing method, which may be a micro gravure coating, an S-knife coating, a gravure coating, a flexographic coating, or a screen. Coating film and cylinder screen coating film.

In the second coating operation, the second thermal conductive insulating layer may be coated by a printing method, which may be a slit coating, an S-blade coating, and a micro-gravure coating. However, the present invention does not have any limit.

In detail, in the first coating operation, the entire surface of the first thermally conductive insulating layer is coated by a printing method, which may be gravure printing, flexographic printing, screen printing or cylindrical screen printing. Since the copper-plated printed circuit board generates a large surface height difference, the surface roughness is uniformized by slit coating or S-knife coating. Here, when the surface uniformity cannot be achieved by the first coating of the thermally conductive insulating layer, or when a large thickness of the thermally conductive insulating layer is required, the slit coating, the S-knife coating or the micro is used. The gravure is applied to perform the second coating of the thermally conductive insulating layer. At the same time, the thermally conductive insulating layer can be formed by two operations to optimize heat transfer characteristics and insulation.

The metal circuit board can be fabricated by the foregoing method or further comprise a thermally conductive substrate layer.

In detail, a method of manufacturing a printed circuit board includes: printing a light reflecting layer on a release film; printing a circuit pattern on the light reflecting layer; coating a thermally conductive insulating layer on the circuit pattern; and stacking the thermally conductive substrate layer on thermal conductivity On the insulating layer, and thermally pressing the thermally conductive substrate layer; and removing the release film.

Here, the hot rolled steel plate, the cold rolled steel plate, the aluminum plate, the galvanized sheet, the copper plate, the stainless steel plate, the tin plate, the brass plate or the resin coated steel plate can be used as the thermal conductive substrate. The layer is not limited by this invention. Also, any of the heat transfer plates formed of different materials in the prior art can be utilized in the present invention. In this manner, when the metal printed circuit board further comprises a thermally conductive base layer, a semi-cured state is formed after the thermosetting resin is polymerized to a preliminary hardening stage, and the thermally conductive insulating layer is combined with the thermally conductive base layer. For example, an aluminum plate. At the same time, LED printed circuit boards can be used as an alternative function even if they do not contain a thermally conductive substrate. When the thermally conductive underlayer is not included, the coating of the filler, such as graphene or CNTs, is performed twice.

The step of stacking the thermally conductive underlayer on the thermally conductive insulating layer and thermally pressing the thermally conductive underlayer is performed at a temperature of 120 to 200 degrees Celsius, for example, 140 to 175 degrees Celsius.

As described above, the operation of the method of manufacturing a metal printed circuit board according to an embodiment of the present invention is carried out in a continuous operation of a roll-to-roller. In this case, it is possible to increase the manufacturing rate and improve the production efficiency.

Hereinafter, embodiments of the present invention will be described in detail in conjunction with the drawings. As shown in FIG. 1, the light reflecting layer and the circuit pattern are printed onto the release film, the thermally conductive insulating layer is printed onto the light reflecting layer and the circuit pattern, the thermally conductive insulating layer is bonded to the thermally conductive substrate layer, and the mold release is performed. After the film is removed, a metal printed circuit board can be fabricated.

As shown in FIG. 2, according to another embodiment of the present invention, the light reflecting layer and the circuit pattern are printed on the release film, and electroless plating is performed on the light reflecting layer and the circuit pattern, and the thermal conductive insulating layer is coated. The light-reflecting layer and the circuit pattern are bonded to each other, and the thermally conductive insulating layer is bonded to the thermally conductive substrate layer, and finally the release film is removed to produce a metal printed circuit board.

As shown in FIG. 3, according to another embodiment of the present invention, the light reflecting layer is printed on the release film, and the first circuit pattern and the second circuit pattern are continuously printed on the release film, and the thermal conductive layer is thermally conductive. The light-reflecting layer and the first circuit pattern and the second circuit pattern are coated, and the thermally conductive insulating layer is bonded to the thermally conductive substrate layer, and finally the release film is removed to manufacture a metal printed circuit board.

As shown in FIG. 4, the light reflective layer and the circuit pattern are printed onto the release film, and the first thermal conductive insulating layer and the second thermal conductive insulating layer are coated on the light reflective layer and the circuit pattern, and the first thermal conductive insulating layer The second thermally conductive insulating layer is bonded to the thermally conductive substrate layer, and finally the release film is removed to produce a metal printed circuit board.

As shown in FIG. 5, a thermally conductive insulating layer containing a filler having a good effect is printed on the light-reflecting layer and the circuit pattern onto the release film, and is applied to the light-reflecting layer and the circuit pattern, and finally, the mold-releasing is removed. The film is used to make a metal printed circuit board.

As shown in Fig. 6, when the embodiment shown in Figs. 1 to 5 is carried out in a continuous process of roll-to-roll, productivity can be improved.

Hereinafter, examples, comparative examples, and experimental examples showing the present invention will be described in detail. However, embodiments of the invention are not limited herein.

First embodiment

White solder resist ink (Inktec, SWP-020) was printed on a heat-resistant 脱-type release coating by screen printing (Tokai-seiki company, SFA-RR350) as a release film at a temperature of 200 ° C. Drying was carried out for 20 minutes under conditions, and a light reflecting layer having a thickness of 5 μm was formed.

After printing the circuit pattern onto the light-reflecting layer by screen printing (Tokai-seiki company, SFA-RR350) and silver paint, the circuit pattern was dried at a temperature of 150 degrees Celsius for 5 minutes and formed into 3 μm. thickness.

The thermally conductive insulating layer coating solution (Table 1) was used as a thermosetting coating resin ink coated on a circuit pattern by a slit mold coater (Pactive company), and reached a dry thickness of 25 μm to form a thermally conductive insulating layer.

Here, the composition of the coating solution of the thermally conductive insulating layer is shown in Table 1.

An aluminum plate (Sejong metal company, AL5052) having a thickness of 0.8 mm as a thermally conductive base layer was stacked on a thermally conductive insulating layer, and subjected to hot pressing treatment at a temperature of 170 ° C for 60 minutes, and finally heat-removed. Strip-type release coating to produce metal printed circuit boards.

Second embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive underlayer is manufactured in the same manner as the first embodiment, except that the light reflecting layer in this embodiment is The thickness is 10 μm.

Third embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive underlayer is manufactured in the same manner as the first embodiment, except that the light reflecting layer in this embodiment is The thickness is 15 μm.

Fourth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive underlayer is manufactured in the same manner as the first embodiment, except that the light reflecting layer utilizes white solder resist ink. (Taiyo ink company, S-200W) was formed.

Fifth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive substrate layer is manufactured in the same manner as the fourth embodiment, except that the light reflecting layer in this embodiment is The thickness is 10 μm.

Sixth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive substrate layer is manufactured in the same manner as the fourth embodiment, except that the light reflecting layer in this embodiment is The thickness is 15 μm.

Seventh embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive underlayer is manufactured in the same manner as the fourth embodiment, but the difference is that the cylinder is used in this embodiment. A screen printing method (Stock company, RSI 16"R) forms a light reflecting layer having a thickness of 2 μm, and utilizes a cylinder screen printing method (Stock company, RSI 16"R) and silver paint (Inktec, TEC-RS-S55). A circuit pattern having a thickness of 5 μm was formed.

Eighth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive underlayer is manufactured in the same manner as the seventh embodiment, but the difference is in the thickness of the circuit pattern in this embodiment. It is 2 μm.

Ninth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive underlayer is manufactured in the same manner as the seventh embodiment, but the difference is in the thickness of the circuit pattern in this embodiment. It is 1 μm and is formed by a gravure printing method (COTech company) and a silver coating (Inktec, TEC-R2A).

Tenth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive underlayer is manufactured in the same manner as the ninth embodiment, but differs in the thickness of the circuit pattern in this embodiment. It is 0.5 μm.

Eleventh embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive substrate layer is manufactured in the same manner as the tenth embodiment, but the difference is that in this embodiment, by heating and mixing Solution (composition of 65 mg/L of PdCl ₂ and 30 g/L of sulfuric acid), by depositing a circuit pattern for 10 minutes, by absorbing Pd, by depositing Pd to a mixed solution (composition of 100 ml/L of copper, 25 ml/ The stabilizer of L was chelated with a chelating extractant and 8 ml/L of formaldehyde; heated at a temperature of 40 degrees Celsius for 30 minutes; electroless plating was performed to form a copper plating layer having a thickness of 0.5 μm.

Twelfth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive underlayer is manufactured in the same manner as the tenth embodiment, except that in this embodiment, 2.5 is applied. ASD current to copper plating solution (composition of 200g / L sulfuric acid, 80g / L of copper sulfate, 70ppm / L of chlorine and 5ml / L of lubricant <A3 company, PC-900>) and for 15 minutes of copper Electroplating was performed to form a copper plating layer having a thickness of 5 μm on the circuit pattern.

Thirteenth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive underlayer is manufactured in the same manner as the twelfth embodiment, but the difference is that in this embodiment Copper plating was performed for 25 minutes to form a copper plating layer having a thickness of 10 μm.

Fourteenth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive underlayer is manufactured in the same manner as the twelfth embodiment, but the difference is that in this embodiment Copper plating was performed for 35 minutes to form a copper plating layer having a thickness of 15 μm.

Fifteenth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive underlayer is manufactured in the same manner as the twelfth embodiment, but the difference is that in this embodiment Copper plating was performed for 50 minutes to form a copper plating layer having a thickness of 20 μm.

Sixteenth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive underlayer is manufactured in the same manner as the twelfth embodiment, but the difference is that in this embodiment Copper plating was performed for 70 minutes to form a copper plating layer having a thickness of 30 μm.

Seventeenth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern, a thermally conductive insulating layer, and a thermally conductive underlayer is manufactured in the same manner as the seventh embodiment, except that the flexographic printing is utilized in this embodiment. The printing method POENG company, Kodak company, resin plate) and the silver paint (Inktec, TEC-PR-020) form a circuit pattern having a thickness of 0.5 μm.

Eighteenth embodiment

Taiyo ink company (S-200W) was printed on a heat-resistant enamel release coating by a screen printing (Stock company, RSI 16"R) as a release film, and was used at 100 ° C. Drying was carried out for 20 minutes under temperature conditions, and a light reflecting layer having a thickness of 5 μm was formed.

In the first stage, the wafer mounting portion was printed on the light reflecting layer by a screen printing method (Tokai-seiki company, SFA-RR350) and silver paint (Inktec, TEC-PF-021) at 150 degrees Celsius. The temperature was heat-treated for 5 minutes. In the second stage, the circuit pattern was printed using the same printing method and paint, and heat was applied for 5 minutes at a temperature of 150 degrees Celsius to form a thickness of 3 μm.

By applying a current of 2.5 ASD to a copper plating solution (composition of 200 g/L sulfuric acid, 80 g/L copper sulfate, 70 ppm/L chlorine and 5 ml/L lubricant <A3 company, PC-900>) and Electroplating was performed for 50 minutes to form a copper layer having a thickness of 20 μm on the circuit pattern.

Next, the thermally conductive insulating layer coating solution (as shown in Table 1) used in the first embodiment was coated with a Pactive company to form a dry thickness of 25 μm, thereby forming a thermally conductive insulating layer.

An aluminum plate (Sejon metal company, AL5052) which is stacked on a thermally conductive insulating layer and has a thickness of 0.8 mm as a thermally conductive underlayer is heat-pressed for 60 minutes at a temperature of 170 ° C. The film is removed to produce a metal printed circuit board comprising a light reflecting layer, a circuit pattern formed by two printings, a thermally conductive insulating layer, and a thermally conductive substrate layer.

Nineteenth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern in which a copper plating layer is formed, and a thermally conductive insulating layer containing a graphene oxide sheet is manufactured in the same manner as in the fifteenth embodiment, but the difference lies in In this embodiment, a thermally conductive insulating layer coating solution (shown in Table 2) containing a graphene oxide sheet is coated on a copper plating layer by a slit type die coater of Pactive Company (Pactive Company). A thermally conductive insulating layer having a dry thickness of 25 μm was formed, and the thermally conductive underlying layer was not stacked on the thermally conductive insulating layer.

Twentyth embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern in which a copper plating layer is formed, and a thermally conductive insulating layer containing oxidized CNTs is manufactured in the same manner as in the nineteenth embodiment, but the difference is that In this embodiment, a solution is coated with a thermally conductive insulating layer (shown in Table 3; comprising an oxidation reaction using non-oxidized multi-walled CNT (MWCNT) (Enano Tec company, 900-1255-1G) and 65% nitric acid). CNTs) to form a thermally conductive insulating layer.

Twenty-first embodiment

A metal printed circuit board including a light reflecting layer, a circuit pattern in which a copper plating layer is formed, and a thermally conductive insulating layer is manufactured in the same manner as the fifteenth embodiment, but the difference is that in this embodiment Using a micro-concave coating agent (POENG company, Micro gravure coater #H24) First, the same thermal conductive insulating layer coating solution as that of the thermal conductive insulating layer coating solution shown in Table 1 in the first embodiment was applied on the copper plating layer to form a dry thickness of 25 μm. The same thermal conductive insulating layer coating solution was applied twice by a slit type die coater (Pactive company) to form a dry thickness of 50 μm, and the thermally conductive base layer was not stacked on the thermally conductive insulating layer.

Twenty-second embodiment

A metal printed circuit board comprising a light reflecting layer, a circuit pattern in which a copper plating layer is formed, and a thermally conductive insulating layer applied twice is manufactured in the same manner as in the twenty-first embodiment, but the difference is that In this example, after the first coating, the second coating formed a dry thickness of 75 μm.

First comparative example

The same thermal conductive insulating layer as that of the first embodiment (shown in Table 1) was applied to an uncoated copper foil (Iljin material company) using a slit type die coater of Pactive Company. A dry thickness of 25 μm was formed, thereby forming a thermally conductive insulating layer.

An aluminum plate having a thickness of 0.8 mm as a thermally conductive base layer was stacked on the thermally conductive insulating layer, and subjected to hot pressing treatment for 60 minutes on plating at 170 ° C. Then, the copper foil circuit pattern was subjected to a general photolithography process. It was printed with a white solder resist ink by screen printing (Tokai-seiki company, SFA-RR350), and dried at a temperature of 100 ° C for 20 minutes to form a light reflecting layer having a thickness of 5 μm.

Second comparative example

The conditions of the second comparative example were the same as those of the first comparative example, but the difference was that the thickness of the light reflection layer in the second comparative example was 10 μm.

Third comparative example

The conditions of the second comparative example were the same as those of the first comparative example, but the difference was that the thickness of the light reflection layer in the second comparative example was 15 μm.

Experimental example

Measurement method

In the metal printed circuit boards manufactured according to the first to twenty-second embodiments and the first to third comparative examples, the thickness of the light reflecting layer, the thickness of the circuit pattern, and the thickness of the thermally conductive insulating layer are in the light reflecting layer, the circuit The pattern and the thermally conductive insulating layer were dried and measured by a non-contact three-dimensional measuring device [Nano system NANO SYSTEM company, NV-P1010]. The sheet resistance value of the light-reflecting layer, the sheet resistance value of the circuit pattern, and the sheet resistance value of the thermally conductive insulating layer are measured by a sheet resistance measuring device [MITSUBISHI CHEMICAL ANALYTEC company, Laresta-GP MCP-610 (4 probe Type) Then, the average value of the sheet resistance values is calculated again, and the conductivity of the light reflecting layer, the conductivity of the circuit pattern, and the conductivity of the thermally conductive insulating layer are shown. The reflectance of the light-reflecting layer, the reflectance of the circuit pattern, and the reflectance of the thermally conductive insulating layer were measured by a reflectance measuring device [VARIAN company, Cary 5000], and the results are shown in Table 4.

2. Measurement results

Herein, according to the present invention, when the light reflection layer is disposed on the upper side of the circuit pattern, the good reflectance is about 4% to 10% (first to sixth implementations). example). Similarly, if the light-reflecting layer and the circuit pattern are formed by a continuous printing method, although the thickness of the light-reflecting layer is smaller than that of the comparative example, the phenomenon of greatly reducing the reflectance is not caused, so that productivity can be improved and Reduce processing costs. In particular, after the circuit pattern is formed (in which a copper plating layer is formed), if the thickness of the copper plating layer is about 10 μm or more (the thirteenth to sixteenth embodiments), when applied to an existing metal printed circuit board The thickness of the copper layer is 18 μm or more, so that the same power characteristics can be maintained, so that unnecessary waste of raw materials can be avoided. Therefore, the light reflecting layer, the circuit pattern, and the thermally conductive insulating layer are continuously formed on the release film by a direct printing method, and the thermally conductive substrate layer is subjected to hot pressing treatment to produce a good electrical property and good adhesion. The metal printed circuit board, at the same time, can be easily processed by the roll-to-roll process in the metal printed circuit board of the present invention, so that the manufacturing cost, the throughput, and the productivity can be reduced.

As described above, according to one or more embodiments of the present invention, a method of manufacturing a metal printed circuit board can be provided, and the fabricated metal printed circuit board has good electrical characteristics and good light reflection. Rate and good adhesion between materials.

In detail, if the light reflecting layer is disposed on the upper side of the circuit pattern, in particular, if the circuit pattern is formed of silver, it may have a better reflection than when the light reflecting layer is disposed on the upper side of the copper circuit pattern. rate.

Further, if a release coating film having an adjusted release force is used as the release film, the light reflection layer, the circuit pattern, and the thermally conductive insulating layer are continuously printed by a printing method The metal printed circuit board having good electrical properties and good adhesion can be produced by brushing on the release film and then subjecting the thermally conductive substrate to hot pressing.

In addition, in the method of manufacturing a metal printed circuit board, by using a roll-to-roll process as a continuous printing method, manufacturing cost, productivity, and productivity can be reduced.

The above description does not depart from the scope of exemplifying the technical idea of the present invention, and therefore, various modifications can be made without departing from the nature of the invention. And deformation. Therefore, the embodiments of the present invention are not intended to limit the scope of the technical idea of the present invention. The scope of the invention must be construed as the scope of the following claims, and all the technical ideas within the scope of the invention must be construed as being included in the scope of the invention.

Claims (13)

A method of manufacturing a metal printed circuit board (PCB), the method comprising: printing a light reflecting layer on a release film; printing a circuit pattern on the light reflecting layer; coating a thermally conductive insulating layer on the circuit pattern; and removing the Release film. The method for manufacturing a metal printed circuit board (PCB) according to claim 1, wherein the step of coating the thermally conductive insulating layer on the circuit pattern and the step of removing the release film further comprises: stacking the thermally conductive substrate Laminating on the thermally conductive insulating layer and hot pressing the thermally conductive underlayer. The method of manufacturing a metal printed circuit board (PCB) according to claim 2, wherein the thermally conductive base layer is a hot rolled steel plate, a cold rolled steel plate, an aluminum plate, a galvanized plate, a copper plate, a stainless steel plate, or a tin plated Plate, brass plate or resin coated steel plate. The method of manufacturing a metal printed circuit board (PCB) according to claim 2, wherein the step of stacking the thermally conductive substrate layer on the thermally conductive insulating layer and thermally pressing the thermally conductive substrate layer is performed at 120 degrees Celsius To a temperature of 200 degrees Celsius. The method of manufacturing a metal printed circuit board (PCB) according to any one of claims 1 to 4, wherein the light reflecting layer is printed by gravure printing, screen printing or cylindrical screen printing. The method of manufacturing a metal printed circuit board (PCB) according to any one of claims 1 to 4, wherein the gravure printing, flexographic printing, lithography, screen printing, cylinder screen printing, or inkjet printing is utilized. The circuit pattern is printed by printing. The method of manufacturing a metal printed circuit board (PCB) according to any one of claims 1 to 4, wherein the step of printing the circuit pattern on the light reflecting layer comprises printing the circuit pattern on the light reflecting layer a first printing operation and a second printing operation of printing the circuit pattern on the light reflecting layer. A method of manufacturing a metal printed circuit board (PCB) according to any one of claims 1 to 4, wherein the step of printing the circuit pattern on the light reflecting layer and coating the thermal conductivity The step of insulating the layer on the circuit pattern further comprises: performing electroplating on the circuit pattern. The method of manufacturing a metal printed circuit board (PCB) according to claim 8, wherein the step of performing electroplating on the circuit pattern comprises performing electroplating or electroless plating. The method of manufacturing a metal printed circuit board (PCB) according to any one of claims 1 to 4, wherein the method of S blade coating, gravure coating, flexographic coating, screen coating, cylindrical screen coating, slit The thermally conductive insulating layer is applied by coating or microgravure coating. The method of manufacturing a metal printed circuit board (PCB) according to any one of claims 1 to 4, wherein the step of applying the thermally conductive insulating layer to the circuit pattern comprises applying the thermally conductive insulating layer to the circuit pattern And a first coating operation, and a second coating operation of coating the thermally conductive insulating layer on the circuit pattern. The method of manufacturing a metal printed circuit board (PCB) according to any one of claims 1 to 4, wherein the thermally conductive insulating layer comprises a filler selected from the group consisting of SiO ₂ , TiO ₂ , and Al ₂ O. _3. Groups of BaSO ₄ , CaCo ₃ , aluminum flakes, silver flakes, graphene oxide, graphite oxide, carbon nanotubes (CNTs), ITO, AlN, BN and MgO. The method of manufacturing a metal printed circuit board (PCB) according to any one of claims 1 to 4, wherein the operations are performed in a roll-to-roll continuous process.