M311116 八、新型說明： 【新型所屬之技術領域】 本創作是有關於一種發光二極體載板之印刷電路 板之結構改良，尤指一種可使該印刷電路板於使用時 達到較佳之散熱效果，並於製作時具有降低成本及易 於製作之功效者。 【先前技術】 按，一般習用之印刷電路板結構如中華民國專利 公報，公告第430959號之「印刷電路板之熱導結構」， 1包括有一熱導層，具一凹凸圖形結構的表面；一黏 膠層，在该熱導層；以及一表面金屬層，在該熱導層 及該黏膠層上，其中，部分的該表面金屬層直接或近 乎直接與該熱導層相連。另該「印刷電路板之熱導結 ，」亦可包含有—熱導層，具—凹凸圖形結構的表面； 熱導層表面；一表面金屬層’在該熱 戎=' θ上，其中，部分的該表面金屬層直接 接與該熱導層相連；以及一外接散熱片，裝 置在該表面金屬層上。 「印刷電路板之熱導結構」 須要耗費較層叠方式加以製成，所以必 費較间之成本及較長之工時及工序，且該印刷 M311116 電路板僅以一熱導層做為熱源之傳導，因此，其導熱 之效果並不理想。 【新型内容】 本創作之主要目的係在於，可使該印刷電路板於 使用時，達到較佳之散熱效果。M311116 VIII. New Description: [New Technology Field] This creation is about the structural improvement of a printed circuit board of a light-emitting diode carrier board, especially a kind of heat dissipation effect which can be achieved when the printed circuit board is used. And at the time of production, it has the effect of reducing cost and being easy to manufacture. [Prior Art] According to the conventional printed circuit board structure, such as the Republic of China Patent Gazette, Announcement No. 430959, "The Thermal Conduction Structure of a Printed Circuit Board", 1 includes a heat conductive layer having a surface having a concave-convex structure; An adhesive layer on the thermal conductive layer; and a surface metal layer on the thermal conductive layer and the adhesive layer, wherein a portion of the surface metal layer is directly or nearly directly connected to the thermal conductive layer. The "thermal conduction junction of the printed circuit board" may also include a surface of the heat conductive layer having a concave-convex structure; a surface of the heat conductive layer; and a surface metal layer 'in the heat 戎=' θ, wherein A portion of the surface metal layer is directly connected to the thermal conductive layer; and an external heat sink is disposed on the surface metal layer. "The thermal conductivity structure of the printed circuit board" needs to be made in a stacked manner, so it is necessary to cost more and a longer working time and process, and the printed M311116 circuit board uses only a thermal conductive layer as a heat source. Conduction, therefore, its heat transfer effect is not ideal. [New Content] The main purpose of this creation is to achieve better heat dissipation when the printed circuit board is used.
為達上述之目的，本創作係一種發光二極體载板 之印刷電路板之結構改良，包含單面及雙面印刷電路 板。該單面印刷電路板係由一基板；一層疊於基板一 面上之第一絕緣層；一層疊於第一絕緣層一面上具有 第一絕緣層之銅層；以及疊於銅層一面上且鄰近於第 一絕緣層一側之表層。而該雙面印刷電路板係由一基 板，一層疊於基板一面上之第一絕緣層；一層疊於第 一絕緣層一面上之第一銅層；一層疊於第一銅層一面 上之第二絕緣層；一層疊於第二絕緣層一面上且耳有 第三絕緣層之第二銅層；以及層疊於第二銅層一面上 且鄰近於第三絕緣層一側之表層。 【實施方式】 請參閱『第1圖』所示’係本創作第一實施例之 剖面狀態示意圖。如圖所示：本創作係—種發光二極 體載板之印刷電路板之結構改良’包含單面及雙面印 6 刷電路板’該單面印刷電路板1至少係由一基板工 0、一第一絕緣層1 1、一銅層i 2以及表層1 3所 上述所提之基板1 〇係可為鋁板、或為鋁片，且 該基板1 0之厚度係介於〇 · 1 mm〜4 ππη之間。For the above purposes, the present invention is a structural improvement of a printed circuit board of a light-emitting diode carrier, comprising single-sided and double-sided printed circuit boards. The single-sided printed circuit board is composed of a substrate; a first insulating layer laminated on one side of the substrate; a copper layer laminated on one side of the first insulating layer with a first insulating layer; and stacked on one side of the copper layer and adjacent thereto a surface layer on one side of the first insulating layer. The double-sided printed circuit board comprises a substrate, a first insulating layer laminated on one side of the substrate; a first copper layer laminated on one side of the first insulating layer; and a layer stacked on one side of the first copper layer a second insulating layer; a second copper layer laminated on one side of the second insulating layer and having a third insulating layer; and a surface layer laminated on one side of the second copper layer adjacent to the side of the third insulating layer. [Embodiment] Please refer to the "FIG. 1" for a schematic view of a cross-sectional state of the first embodiment of the present creation. As shown in the figure: The structure of the printed circuit board of the present invention is a modified single-sided and double-sided printed circuit board. The single-sided printed circuit board 1 is at least a substrate. The first insulating layer 1 1 , the copper layer i 2 , and the surface layer 1 3 may be an aluminum plate or an aluminum plate, and the substrate 10 has a thickness of 〇·1 mm. Between ~4 ππη.
該第一絕緣層1 1係層疊於上述基板i 〇之一面 上’且該第-絕緣層1 1係可以以陽極處理、硬式陽 極處理、喷塗、濺塗或其他化學處理等方式形成於基 板1 0之-©上’而該第-絕緣層i i係為具有導= 效果之絶緣陶㈣膜、或為具有導熱效果之絶緣薄、 膜，另該第一絕緣層i丄之厚度係介於2μιη〜ΐ2. m 之間。The first insulating layer 11 is laminated on one surface of the substrate i ' and the first insulating layer 11 can be formed on the substrate by anodization, hard anodic treatment, spray coating, sputtering or other chemical treatment. 1 0-©上' and the first insulating layer ii is an insulating ceramic (four) film having a conductive effect, or an insulating thin film having a heat conducting effect, and the thickness of the first insulating layer is 2μιη~ΐ2. m between.
構成，可使該印刷電路板於使用時達到較佳之散熱效 果，並於製作時具有降低成本及易於製作之功效了〆 該銅層1 2係可以以無電解化學方式、喷塗或賤 鍍（SPUTTER)等方式形成於第一絕緣層丄丄之一面 上，且該銅層1 2上係可先製作遮罩（MASK)，將所 需要之線路（LAYOUT)外的區域遮住以形成線路（圖 中未示），而該銅層i 2之厚度係介於12μιη〜ΐ75μιη 之間，且該銅層1 2係可以電鍍銅或噴塗方式增厚至 需求厚度，另該銅層1 2上係具有第二絕緣層工2 1，該第二絕緣層1 2 1係可為塗佈於銅層j 2上之 阻焊油墨、防焊綠漆，或為形成於銅層丄2上之絶緣 陶莞薄膜等具有導熱效果线緣薄膜，且該第二絕緣 M311116 層1 2 1之厚度係介於2μπι〜125μηι之間。 該表層1 3係叠於上述銅層i 2之一面上且鄰近 於第二絕緣層1 2 1之-側’且該表層i 3係可為化 學鎳金、有機保焊冑（OSP)、化銀、化錫、喷錫等表 面處理方式。 請參閱『第2圖』所示，係本創作第一實施例之 使用狀態剖面示意圖。如圖所示：當本創作第一實施 例於運用時，係可於該銅層i 2之上設置有所需之電 子元件1 4，並於該電子元件卫4上以導線丄4工與 表層1 3電性連接或直接連結（B0NDING)於表層工3 1，當使用時該基板1 〇與銅層丄2係會產生有熱 源，此時，即可以該第一絕緣層i i與第二絕緣層工 2 1進行散熱，而使該單面印刷電路板i於使用時， 可達到較佳之散熱效果。 請參閱『第3圖』所示，係本封作第二實施例之 剖面狀態示意圖。如圖所示··本創作第二實施例之雙 面印刷電路板2至少係由一基板2 〇、一第一絕緣層 21、一第一銅層22、一第二絕緣層23、一第二 銅層24以及表層2 5及具導熱孔銅層2 4 2，其中 具導熱孔銅層2 4 2具一導熱孔2 4 3，可將第二銅 層2 4之熱導至第一銅層2 2所構成，可使該印刷電 路板於使用時達到較佳之散熱效果，並於製作時具有 降低成本及易於製作之功效。 M311116 上述所提之基板2 0係可為鋁板、或為鋁片，且 …該基板2 〇之厚度係介於〇 1麵〜4 mffl之間。 該第一絕緣層2 1係以陽極處理、硬式陽極處 理、其他化學處理等方式形成於基板2 〇之一面上， 且該第一絕緣層2 1係為具有導熱效果之絶緣陶瓷薄 膜等具有導熱效果之絶緣薄膜，而該第一絕緣層2工 之厚度係介於2μιη〜125μιη之間9 • 該第一銅層2 2係以無電解化學方式、喷塗或濺 鍍（SPUTTER) $城形成於第 一絕緣層2 1之一面 上而該第一銅層2 2之厚度係介於12口111〜175从111之 間，另該第一銅層2 2係可以電鍍銅或喷塗方式增厚 至需求厚度。The composition can make the printed circuit board achieve better heat dissipation effect during use, and has the advantages of reduced cost and easy fabrication during production. The copper layer 12 can be electrolessly chemically sprayed or ruthenium plated ( SPUTTER) or the like is formed on one surface of the first insulating layer, and the copper layer 12 can be first made of a mask (MASK) to cover a region outside the required line (LAYOUT) to form a line ( The thickness of the copper layer i 2 is between 12 μm and ΐ75 μm, and the copper layer 12 can be thickened to a desired thickness by electroplating copper or spray coating, and the copper layer 12 is The second insulating layer 1 2 1 may be a solder resist ink coated on the copper layer j 2 , a solder resist green paint, or an insulating ceramic formed on the copper layer 2 The film of the film has a heat-conducting edge film, and the thickness of the second insulating layer M311116 is between 2 μm and 125 μm. The surface layer 13 is laminated on one side of the copper layer i 2 and adjacent to the side of the second insulating layer 1 2 1 and the surface layer i 3 may be chemical nickel gold, organic solder paste (OSP), Surface treatment methods such as silver, tin, and tin spray. Referring to Fig. 2, it is a schematic cross-sectional view showing the state of use of the first embodiment of the present invention. As shown in the figure, when the first embodiment of the present invention is used, the required electronic component 14 can be disposed on the copper layer i 2, and the electronic component 4 is connected with the wire. The surface layer 13 is electrically connected or directly connected (B0NDING) to the surface layer 3 1. When used, the substrate 1 〇 and the copper layer 丄 2 system generate a heat source. In this case, the first insulating layer ii and the second layer The insulating layer 2 1 performs heat dissipation, so that the single-sided printed circuit board i can achieve better heat dissipation when used. Please refer to Fig. 3 for a schematic view of the cross-sectional state of the second embodiment. As shown in the figure, the double-sided printed circuit board 2 of the second embodiment of the present invention comprises at least a substrate 2, a first insulating layer 21, a first copper layer 22, a second insulating layer 23, and a first The second copper layer 24 and the surface layer 25 and the copper layer 242 having a heat conducting hole, wherein the copper layer of the heat conducting hole 242 has a heat conducting hole 243 to guide the heat of the second copper layer 24 to the first copper The layer 2 2 is configured to achieve better heat dissipation effect when used in the printed circuit board, and has the advantages of reduced cost and easy fabrication during production. M311116 The substrate 20 mentioned above may be an aluminum plate or an aluminum plate, and the thickness of the substrate 2 is between 〇1 and 4 mffl. The first insulating layer 2 1 is formed on one surface of the substrate 2 by anodization, hard anodization, other chemical treatment, etc., and the first insulating layer 21 is thermally conductive or the like having thermal conductivity. The effect of the insulating film, and the thickness of the first insulating layer 2 is between 2 μm and 125 μm 9 • The first copper layer 2 2 is formed by electroless chemical, spraying or sputtering (SPUTTER) On the first surface of the first insulating layer 21, the thickness of the first copper layer 2 2 is between 12 ports 111~175 and 111, and the first copper layer 2 2 can be electroplated or sprayed. Thick to the required thickness.
該第二絕緣層2 3係以陽極處理、硬式陽極處 理、喷塗或其他化學處料方式形成於第—銅層2 2 =面上’且该第二絕緣層2 3係為具有導熱效果之 、、色緣陶㈣膜等具有導熱效果之絶緣薄臈，而該第二 絕緣層2 3之厚度係介於2μπι〜125μπι之間。 5玄第二銅層2 4係以無電解化學方式、噴塗或濺 鍍（卿咖）等方式形成於第二絕緣層23之= 上’且该第二鋼層2 4上係可先製作遮罩（MASK)， =所需要之料（LAY贿）㈣區域雜以形成線 =^中未示），而該第二銅層24之厚度係介於12叫 μηι之間’另該第二銅層2 4係可以電鑛銅或喷 9 M311116 =切厚至需求職，並於該第二鋼層 =絕緣層24b該第三絕緣層24ι係可為塗 =二==上之阻焊油墨、防烊綠漆、或為形 成；第二銅層24上之絶緣陶莞薄 之絶緣薄膜，且該第三絕緣層2 :、有導熱效果 一、之間。縣之厚度係介於 該表層2 5係層叠於上述第二匈層 且鄰近於第三絕緣層2 4 2之一上 可為化學鎳金、有機保焊劑 錫等表面處理方式。 4銀、化錫、嘴 請參閱『第4圖』所千，# ‘ > 使用狀綠圳而-立 ’、、本創作第一實施例之 ，用狀態相不⑽。如圖所示··當本創作 虽本創作第二實施例於運用時，係可、-奶' ::上設置有所需之電子元件2 6，並二= =以導線261與表層2 子元件2 6連結於具導熱孔銅m將電 時該基板20與第―、二銅層 :之上’Λ使用 熱源，此時，即可以該第Ί 4儀會產生有 2 3與第三絕緣層2 4 ] : θ 1、第二絕緣層 電路板2於使用時，可達而使該雙面印刷 了達到較佳之散熱效果。 綜上所述，本創作發 結構改良可有效改善習用，—極體载板之印刷電路板 路板於使用時達到較佳2種缺點’可使該印刷電 佳之政熱效果，並於製作時具有 M311116 -成本及g於製作之功效，進而使本創作之産生能 更進步、更實用、更符合使用者之所須，確已符合創 作專利申請之要件，爰依法提出專利申請。 惟以上所述者，㈣本創作之較佳實施例而已， 當不能以此限定本創作實施之範圍；故，凡依本創作 申請專利範圍及㈣說明書内容所作之簡單的等效變 化與修飾，皆應仍屬本創作專利涵蓋之範圍内。 【圖式簡單說明】 第1圖’係本創作苐-實施例之剖面狀態示意圖。 第2圖，係本創作第一實施例之使用狀態剖面示意 圖。 第3圖，係本創作第二 第4圖’係本創作第 圖。 _實施例之剖面狀態示意圖。 二實施例之使用狀態剖面示意 【主要元件符號說明】 單面印刷電路板1 基板1 0 第一絕緣層1 1 銅層1 2 第二絕緣層1 2 1 表層1 3、表層1 3 J 電子元件1 4 導線1 4 1 雙面印刷電路板2 基板2 0 第一絕緣層2 1 第一銅層2 2 M311116 第二絕緣層2 3 第二銅層2 4 第三絕緣層2 4 1 具導熱孔銅層2 4 2 導熱孔2 4 3 表層2 5 電子元件2 6 導線2 6 1The second insulating layer 23 is formed on the first copper layer 2 2 surface by anodization, hard anodizing, spraying or other chemical processing, and the second insulating layer 23 has a heat conducting effect. An insulating thin film having a heat conducting effect, such as a color ceramic (4) film, and the thickness of the second insulating layer 23 is between 2 μm and 125 μm. 5 Xuan second copper layer 2 4 is formed on the second insulating layer 23 by the electroless chemical method, spraying or sputtering, and the second steel layer 24 can be made first. Mask (MASK), = required material (LAY bribe) (4) area mixed to form line = ^ not shown), and the thickness of the second copper layer 24 is between 12 called μηι 'the other second copper Layer 2 4 series can be electro-mineralized copper or spray 9 M311116 = cut thick to the demand position, and in the second steel layer = insulating layer 24b the third insulating layer 24ι can be coated = two == upper solder mask ink, The tamper-proof green lacquer is formed or formed; the insulating film of the insulating layer of the second copper layer 24 is provided, and the third insulating layer 2 has a heat conducting effect. The thickness of the county is such that the surface layer is laminated on the second Hung layer and adjacent to one of the third insulating layers 2 4 2 to be a surface treatment such as chemical nickel gold or organic solder resist tin. 4 Silver, tin, and mouth Please refer to "4th" for the thousand, # ‘ > use the greenery and the vertical ‘, the first embodiment of this creation, the state of use is not (10). As shown in the figure, when the second embodiment of the present creation is used, the desired electronic component 2 6 and the === with the wire 261 and the surface layer 2 are provided. The element 26 is connected to the heat-dissipating hole copper m when the substrate 20 and the first and second copper layers are on the top, and the heat source is used. At this time, the fourth device can generate the 23 and the third insulation. Layer 2 4 ] : θ 1 , the second insulating layer circuit board 2 is accessible, so that the double-sided printing achieves a better heat dissipation effect. In summary, the structural improvement of the creation can effectively improve the conventional use, and the printed circuit board of the polar carrier board achieves two better shortcomings in use, which can make the printing power better than the political heat effect. With M311116 - cost and g in production, so that the creation of this creation can be more progressive, more practical, more in line with the needs of users, has indeed met the requirements of the creation of patent applications, and filed a patent application according to law. However, the above description, (4) the preferred embodiment of the present creation, can not limit the scope of the implementation of this creation; therefore, the simple equivalent changes and modifications made by the scope of the patent application and (4) the contents of the specification, All should remain within the scope of this creation patent. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a cross-sectional state of the present invention. Fig. 2 is a schematic cross-sectional view showing the state of use of the first embodiment of the present invention. Figure 3 is the second picture of this creation. _ Schematic diagram of the cross-sectional state of the embodiment. Description of the use state of the second embodiment [Description of the main components] Single-sided printed circuit board 1 Substrate 1 0 First insulating layer 1 1 Copper layer 1 2 Second insulating layer 1 2 1 Surface layer 1 3, surface layer 1 3 J Electronic components 1 4 wire 1 4 1 double-sided printed circuit board 2 substrate 2 0 first insulating layer 2 1 first copper layer 2 2 M311116 second insulating layer 2 3 second copper layer 2 4 third insulating layer 2 4 1 with heat conducting holes Copper layer 2 4 2 Thermal hole 2 4 3 Surface layer 2 5 Electronic component 2 6 Wire 2 6 1