KR101439742B1 - 기판의 반전 장치, 반전 방법 및 기판의 처리 장치 - Google Patents

기판의 반전 장치, 반전 방법 및 기판의 처리 장치 Download PDF

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Publication number
KR101439742B1
KR101439742B1 KR1020130016485A KR20130016485A KR101439742B1 KR 101439742 B1 KR101439742 B1 KR 101439742B1 KR 1020130016485 A KR1020130016485 A KR 1020130016485A KR 20130016485 A KR20130016485 A KR 20130016485A KR 101439742 B1 KR101439742 B1 KR 101439742B1
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South Korea
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substrate
pair
movable
support members
driven
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KR1020130016485A
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Korean (ko)
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KR20130095227A (ko
Inventor
마사아키 후루야
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시바우라 메카트로닉스 가부시끼가이샤
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Publication of KR20130095227A publication Critical patent/KR20130095227A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020130016485A 2012-02-17 2013-02-15 기판의 반전 장치, 반전 방법 및 기판의 처리 장치 Active KR101439742B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012033016 2012-02-17
JPJP-P-2012-033016 2012-02-17

Publications (2)

Publication Number Publication Date
KR20130095227A KR20130095227A (ko) 2013-08-27
KR101439742B1 true KR101439742B1 (ko) 2014-09-17

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ID=49218674

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KR1020130016485A Active KR101439742B1 (ko) 2012-02-17 2013-02-15 기판의 반전 장치, 반전 방법 및 기판의 처리 장치

Country Status (3)

Country Link
JP (1) JP6068181B2 (enExample)
KR (1) KR101439742B1 (enExample)
TW (1) TWI513646B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12266549B2 (en) 2022-05-12 2025-04-01 Apet Co., Ltd. Fluid supply nozzle for semiconductor substrate treatment and semiconductor substrate treatment apparatus having the same

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101495544B1 (ko) 2013-08-12 2015-02-26 현대자동차주식회사 인터쿨러파이프의 장착구조
JP6917846B2 (ja) * 2017-09-25 2021-08-11 株式会社Ｓｃｒｅｅｎホールディングス 基板反転装置、基板処理装置および基板挟持装置
JP7377659B2 (ja) * 2019-09-27 2023-11-10 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置
KR102876906B1 (ko) * 2023-07-21 2025-10-28 (주)마스 웨이퍼 반전 장치
KR102871240B1 (ko) * 2024-03-26 2025-10-15 주식회사 나인벨 웨이퍼 반전 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020076819A (ko) * 2001-03-30 2002-10-11 (주)케이.씨.텍 기판을 파지하는 장치 및 이를 갖는 핸들링 장치
JP2002302248A (ja) * 2001-03-30 2002-10-18 Shibaura Mechatronics Corp 基板反転装置、及びそれを用いたパネル製造装置
JP2006012880A (ja) 2004-06-22 2006-01-12 Dainippon Screen Mfg Co Ltd 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法
KR20070045534A (ko) * 2005-10-27 2007-05-02 엘지.필립스 엘시디 주식회사 반전 기능이 구비된 액정 표시 장치용 리페어 장비 및 이의기판 반전 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3724361B2 (ja) * 2000-10-31 2005-12-07 ダイキン工業株式会社 基板搬送装置
JP2003100695A (ja) * 2001-09-26 2003-04-04 Dainippon Screen Mfg Co Ltd 基板洗浄装置
JP2005203452A (ja) * 2004-01-13 2005-07-28 Serubakku:Kk 基板保持反転装置
JP4595740B2 (ja) * 2005-08-16 2010-12-08 パナソニック株式会社 チップ反転装置およびチップ反転方法ならびにチップ搭載装置
JP4726776B2 (ja) * 2006-12-27 2011-07-20 大日本スクリーン製造株式会社 反転装置およびそれを備えた基板処理装置
TWI556346B (zh) * 2010-06-25 2016-11-01 愛發科股份有限公司 基板反轉裝置、真空成膜裝置及基板反轉方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020076819A (ko) * 2001-03-30 2002-10-11 (주)케이.씨.텍 기판을 파지하는 장치 및 이를 갖는 핸들링 장치
JP2002302248A (ja) * 2001-03-30 2002-10-18 Shibaura Mechatronics Corp 基板反転装置、及びそれを用いたパネル製造装置
JP2006012880A (ja) 2004-06-22 2006-01-12 Dainippon Screen Mfg Co Ltd 基板反転装置、基板搬送装置、基板処理装置、基板反転方法、基板搬送方法および基板処理方法
KR20070045534A (ko) * 2005-10-27 2007-05-02 엘지.필립스 엘시디 주식회사 반전 기능이 구비된 액정 표시 장치용 리페어 장비 및 이의기판 반전 방법

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12266549B2 (en) 2022-05-12 2025-04-01 Apet Co., Ltd. Fluid supply nozzle for semiconductor substrate treatment and semiconductor substrate treatment apparatus having the same

Also Published As

Publication number Publication date
TW201343519A (zh) 2013-11-01
JP2013191844A (ja) 2013-09-26
TWI513646B (zh) 2015-12-21
JP6068181B2 (ja) 2017-01-25
KR20130095227A (ko) 2013-08-27

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