KR101437194B1 - Aps 셀 구조물 및 그 형성 방법, cmos 이미지 센서 어레이 및 카메라 디바이스 - Google Patents
Aps 셀 구조물 및 그 형성 방법, cmos 이미지 센서 어레이 및 카메라 디바이스 Download PDFInfo
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- KR101437194B1 KR101437194B1 KR1020097011278A KR20097011278A KR101437194B1 KR 101437194 B1 KR101437194 B1 KR 101437194B1 KR 1020097011278 A KR1020097011278 A KR 1020097011278A KR 20097011278 A KR20097011278 A KR 20097011278A KR 101437194 B1 KR101437194 B1 KR 101437194B1
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- doped region
- conductive
- transfer gate
- region
- gate
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/803—Pixels having integrated switching, control, storage or amplification elements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/014—Manufacture or treatment of image sensors covered by group H10F39/12 of CMOS image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/565,801 | 2006-12-01 | ||
| US11/565,801 US7675097B2 (en) | 2006-12-01 | 2006-12-01 | Silicide strapping in imager transfer gate device |
| PCT/US2007/024684 WO2008069994A2 (en) | 2006-12-01 | 2007-11-30 | Silicide strapping in imager transfer gate device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20090087896A KR20090087896A (ko) | 2009-08-18 |
| KR101437194B1 true KR101437194B1 (ko) | 2014-09-03 |
Family
ID=39434223
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020097011278A Active KR101437194B1 (ko) | 2006-12-01 | 2007-11-30 | Aps 셀 구조물 및 그 형성 방법, cmos 이미지 센서 어레이 및 카메라 디바이스 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7675097B2 (enExample) |
| EP (1) | EP2089905B1 (enExample) |
| JP (1) | JP5096483B2 (enExample) |
| KR (1) | KR101437194B1 (enExample) |
| CN (1) | CN101281918B (enExample) |
| TW (1) | TWI420659B (enExample) |
| WO (1) | WO2008069994A2 (enExample) |
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| WO2008056289A1 (en) * | 2006-11-06 | 2008-05-15 | Nxp B.V. | Method of manufacturing a fet gate |
| US7675097B2 (en) | 2006-12-01 | 2010-03-09 | International Business Machines Corporation | Silicide strapping in imager transfer gate device |
| KR100810423B1 (ko) * | 2006-12-27 | 2008-03-04 | 동부일렉트로닉스 주식회사 | 이미지 센서 및 이미지 센서의 제조 방법 |
| US20080217679A1 (en) * | 2007-03-08 | 2008-09-11 | Macronix International Co., Ltd. | Memory unit structure and operation method thereof |
| KR20090003854A (ko) * | 2007-07-05 | 2009-01-12 | 삼성전자주식회사 | 이미지 센서 및 그 제조 방법 |
| US8110465B2 (en) * | 2007-07-30 | 2012-02-07 | International Business Machines Corporation | Field effect transistor having an asymmetric gate electrode |
| US7741217B2 (en) * | 2007-10-25 | 2010-06-22 | International Business Machines Corporation | Dual workfunction silicide diode |
| US8743247B2 (en) * | 2008-01-14 | 2014-06-03 | International Business Machines Corporation | Low lag transfer gate device |
| US8227844B2 (en) * | 2008-01-14 | 2012-07-24 | International Business Machines Corporation | Low lag transfer gate device |
| TWI347009B (en) * | 2008-02-04 | 2011-08-11 | Jack Kuo | Continuous multigate transistors |
| US20090261393A1 (en) * | 2008-04-18 | 2009-10-22 | United Microelectronics Corp. | Composite transfer gate and fabrication thereof |
| JP5091886B2 (ja) | 2009-02-13 | 2012-12-05 | 浜松ホトニクス株式会社 | イメージセンサ |
| JP5271104B2 (ja) | 2009-02-13 | 2013-08-21 | 浜松ホトニクス株式会社 | リニアイメージセンサ |
| US20100314667A1 (en) * | 2009-06-11 | 2010-12-16 | Omnivision Technologies, Inc. | Cmos pixel with dual-element transfer gate |
| US9000500B2 (en) | 2009-12-30 | 2015-04-07 | Omnivision Technologies, Inc. | Image sensor with doped transfer gate |
| US8299505B2 (en) | 2011-02-17 | 2012-10-30 | International Business Machines Corporation | Pixel sensor cell with a dual work function gate electode |
| JP6174011B2 (ja) | 2011-05-12 | 2017-08-02 | デピュー シンセス プロダクツ, インコーポレーテッドDePuy Synthes Products, Inc. | 最小垂直相互接続を有するハイブリッド画像センサに対する積み重ねスキームを用いた画素アレイの領域最適化 |
| US9070784B2 (en) * | 2011-07-22 | 2015-06-30 | Taiwan Semiconductor Manufacturing Company, Ltd. | Metal gate structure of a CMOS semiconductor device and method of forming the same |
| JP2013084834A (ja) * | 2011-10-12 | 2013-05-09 | Sharp Corp | 固体撮像素子及び固体撮像素子の製造方法 |
| US9698185B2 (en) * | 2011-10-13 | 2017-07-04 | Omnivision Technologies, Inc. | Partial buried channel transfer device for image sensors |
| US9000527B2 (en) | 2012-05-15 | 2015-04-07 | Apple Inc. | Gate stack with electrical shunt in end portion of gate stack |
| WO2014002365A1 (ja) * | 2012-06-26 | 2014-01-03 | パナソニック株式会社 | 固体撮像装置及びその製造方法 |
| JP6461790B2 (ja) | 2012-07-26 | 2019-01-30 | デピュー シンセス プロダクツ, インコーポレーテッドDePuy Synthes Products, Inc. | 最小面積モノリシックcmosイメージセンサを用いたカメラシステム |
| US8809925B2 (en) * | 2012-10-11 | 2014-08-19 | Omnivision Technologies, Inc. | Partial buried channel transfer device in image sensors |
| US8912584B2 (en) * | 2012-10-23 | 2014-12-16 | Apple Inc. | PFET polysilicon layer with N-type end cap for electrical shunt |
| AU2014233192B2 (en) | 2013-03-15 | 2018-11-22 | DePuy Synthes Products, Inc. | Minimize image sensor I/O and conductor counts in endoscope applications |
| US10517469B2 (en) | 2013-03-15 | 2019-12-31 | DePuy Synthes Products, Inc. | Image sensor synchronization without input clock and data transmission clock |
| KR102089682B1 (ko) | 2013-07-15 | 2020-03-16 | 삼성전자 주식회사 | 반도체 장치 및 이의 제조 방법 |
| CN103456756A (zh) * | 2013-09-26 | 2013-12-18 | 哈尔滨工程大学 | 一种有源像素结构及其制作方法 |
| US9526468B2 (en) | 2014-09-09 | 2016-12-27 | General Electric Company | Multiple frame acquisition for exposure control in X-ray medical imagers |
| JP6668600B2 (ja) * | 2015-03-19 | 2020-03-18 | セイコーエプソン株式会社 | 固体撮像素子及びその製造方法 |
| US10418407B2 (en) | 2015-11-06 | 2019-09-17 | Artilux, Inc. | High-speed light sensing apparatus III |
| US10254389B2 (en) | 2015-11-06 | 2019-04-09 | Artilux Corporation | High-speed light sensing apparatus |
| TWI724164B (zh) * | 2017-05-05 | 2021-04-11 | 聯華電子股份有限公司 | 半導體元件及其製作方法 |
| US11393867B2 (en) * | 2017-12-06 | 2022-07-19 | Facebook Technologies, Llc | Multi-photodiode pixel cell |
| US10777692B2 (en) * | 2018-02-23 | 2020-09-15 | Artilux, Inc. | Photo-detecting apparatus and photo-detecting method thereof |
| US11105928B2 (en) | 2018-02-23 | 2021-08-31 | Artilux, Inc. | Light-sensing apparatus and light-sensing method thereof |
| CN110108919A (zh) * | 2019-04-16 | 2019-08-09 | 天津大学 | 一种像素内PPD pinning电压的测量方法 |
| JPWO2022137864A1 (enExample) * | 2020-12-21 | 2022-06-30 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040262651A1 (en) | 2003-06-25 | 2004-12-30 | Chandra Mouli | Tailoring gate work-function in image sensors |
| JP2006049921A (ja) | 2000-03-28 | 2006-02-16 | Toshiba Corp | 固体撮像装置及びその製造方法 |
| US20060118835A1 (en) | 2004-12-03 | 2006-06-08 | International Business Machines Corporation | Predoped transfer gate for an image sensor |
| US20060124976A1 (en) | 2004-12-15 | 2006-06-15 | International Business Machines Corporation | Recessed gate for an image sensor |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2817518B2 (ja) * | 1991-06-21 | 1998-10-30 | 松下電器産業株式会社 | 半導体装置およびその製造方法 |
| DE69630944D1 (de) | 1996-03-29 | 2004-01-15 | St Microelectronics Srl | Hochspannungsfester MOS-Transistor und Verfahren zur Herstellung |
| EP0936667A1 (en) * | 1998-01-20 | 1999-08-18 | Lucent Technologies Inc. | Lattice matched barrier for dual doped polysilicon gates |
| US6333205B1 (en) * | 1999-08-16 | 2001-12-25 | Micron Technology, Inc. | CMOS imager with selectively silicided gates |
| JP3782297B2 (ja) * | 2000-03-28 | 2006-06-07 | 株式会社東芝 | 固体撮像装置及びその製造方法 |
| JP2004506388A (ja) * | 2000-08-04 | 2004-02-26 | フォベオン・インコーポレーテッド | 完全電子化高解像度ディジタルスチルカメラ |
| US6794252B2 (en) * | 2001-09-28 | 2004-09-21 | Texas Instruments Incorporated | Method and system for forming dual work function gate electrodes in a semiconductor device |
| TWI296062B (en) * | 2001-12-28 | 2008-04-21 | Sanyo Electric Co | Liquid crystal display device |
| US7064406B2 (en) * | 2003-09-03 | 2006-06-20 | Micron Technology, Inc. | Supression of dark current in a photosensor for imaging |
| US7205584B2 (en) * | 2003-12-22 | 2007-04-17 | Micron Technology, Inc. | Image sensor for reduced dark current |
| US7214575B2 (en) * | 2004-01-06 | 2007-05-08 | Micron Technology, Inc. | Method and apparatus providing CMOS imager device pixel with transistor having lower threshold voltage than other imager device transistors |
| JP2005260077A (ja) * | 2004-03-12 | 2005-09-22 | Matsushita Electric Ind Co Ltd | 固体撮像素子ならびにその製造方法およびそれを用いたカメラ |
| JP4546201B2 (ja) * | 2004-03-17 | 2010-09-15 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JP4533155B2 (ja) * | 2005-01-12 | 2010-09-01 | 富士通セミコンダクター株式会社 | 半導体装置及びその製造方法 |
| US7115924B1 (en) * | 2005-06-03 | 2006-10-03 | Avago Technologies Sensor Ip Pte. Ltd. | Pixel with asymmetric transfer gate channel doping |
| JP4847828B2 (ja) * | 2006-09-22 | 2011-12-28 | 旭化成エレクトロニクス株式会社 | Cmosイメージセンサの製造方法 |
| US7675097B2 (en) | 2006-12-01 | 2010-03-09 | International Business Machines Corporation | Silicide strapping in imager transfer gate device |
-
2006
- 2006-12-01 US US11/565,801 patent/US7675097B2/en active Active
-
2007
- 2007-11-15 CN CN2007101869334A patent/CN101281918B/zh active Active
- 2007-11-30 WO PCT/US2007/024684 patent/WO2008069994A2/en not_active Ceased
- 2007-11-30 TW TW096145709A patent/TWI420659B/zh active
- 2007-11-30 EP EP07867600.4A patent/EP2089905B1/en active Active
- 2007-11-30 JP JP2009539352A patent/JP5096483B2/ja active Active
- 2007-11-30 KR KR1020097011278A patent/KR101437194B1/ko active Active
-
2010
- 2010-02-03 US US12/699,419 patent/US8158453B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006049921A (ja) | 2000-03-28 | 2006-02-16 | Toshiba Corp | 固体撮像装置及びその製造方法 |
| US20040262651A1 (en) | 2003-06-25 | 2004-12-30 | Chandra Mouli | Tailoring gate work-function in image sensors |
| US20060118835A1 (en) | 2004-12-03 | 2006-06-08 | International Business Machines Corporation | Predoped transfer gate for an image sensor |
| US20060124976A1 (en) | 2004-12-15 | 2006-06-15 | International Business Machines Corporation | Recessed gate for an image sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP5096483B2 (ja) | 2012-12-12 |
| EP2089905B1 (en) | 2014-01-22 |
| US7675097B2 (en) | 2010-03-09 |
| WO2008069994A3 (en) | 2008-08-28 |
| TWI420659B (zh) | 2013-12-21 |
| JP2010512004A (ja) | 2010-04-15 |
| CN101281918A (zh) | 2008-10-08 |
| TW200837941A (en) | 2008-09-16 |
| KR20090087896A (ko) | 2009-08-18 |
| EP2089905A2 (en) | 2009-08-19 |
| CN101281918B (zh) | 2010-12-08 |
| WO2008069994A2 (en) | 2008-06-12 |
| US20100136733A1 (en) | 2010-06-03 |
| US8158453B2 (en) | 2012-04-17 |
| US20080128767A1 (en) | 2008-06-05 |
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