KR101427083B1 - 기억장치 및 반도체 장치 - Google Patents

기억장치 및 반도체 장치 Download PDF

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Publication number
KR101427083B1
KR101427083B1 KR1020070121824A KR20070121824A KR101427083B1 KR 101427083 B1 KR101427083 B1 KR 101427083B1 KR 1020070121824 A KR1020070121824 A KR 1020070121824A KR 20070121824 A KR20070121824 A KR 20070121824A KR 101427083 B1 KR101427083 B1 KR 101427083B1
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South Korea
Prior art keywords
layer
electrode
flexible substrate
sealing layer
organic compound
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Expired - Fee Related
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KR1020070121824A
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English (en)
Korean (ko)
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KR20080048423A (ko
Inventor
료지 노무라
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가부시키가이샤 한도오따이 에네루기 켄큐쇼
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C13/00—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00
    • G11C13/0002—Digital stores characterised by the use of storage elements not covered by groups G11C11/00, G11C23/00, or G11C25/00 using resistive RAM [RRAM] elements
    • G11C13/0009—RRAM elements whose operation depends upon chemical change
    • G11C13/0014—RRAM elements whose operation depends upon chemical change comprising cells based on organic memory material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/50—Bistable switching devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/701—Organic molecular electronic devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80—Constructional details
    • H10K10/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • H10K19/202—Integrated devices comprising a common active layer

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Semiconductor Memories (AREA)
  • Thin Film Transistor (AREA)
  • Electroluminescent Light Sources (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020070121824A 2006-11-28 2007-11-28 기억장치 및 반도체 장치 Expired - Fee Related KR101427083B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2006-00320482 2006-11-28
JP2006320482 2006-11-28

Publications (2)

Publication Number Publication Date
KR20080048423A KR20080048423A (ko) 2008-06-02
KR101427083B1 true KR101427083B1 (ko) 2014-08-07

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KR1020070121824A Expired - Fee Related KR101427083B1 (ko) 2006-11-28 2007-11-28 기억장치 및 반도체 장치

Country Status (3)

Country Link
US (1) US7988057B2 (enExample)
JP (1) JP5475947B2 (enExample)
KR (1) KR101427083B1 (enExample)

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GB0701823D0 (en) * 2007-02-01 2007-03-14 Delphi Tech Inc A casing for an electrical component
JP5121432B2 (ja) * 2007-12-11 2013-01-16 キヤノン株式会社 液晶表示装置及びその製造方法並びに液晶プロジェクション装置
US20090193676A1 (en) * 2008-01-31 2009-08-06 Guo Shengguang Shoe Drying Apparatus
KR101041146B1 (ko) 2009-09-02 2011-06-13 삼성모바일디스플레이주식회사 표시 장치
KR101127595B1 (ko) 2010-05-04 2012-03-23 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조방법
TWI429090B (zh) * 2010-05-21 2014-03-01 國立成功大學 Crystal element and manufacturing method thereof
JP5718123B2 (ja) * 2011-03-30 2015-05-13 富士通株式会社 Ｒｆｉｄタグ
US9947688B2 (en) 2011-06-22 2018-04-17 Psemi Corporation Integrated circuits with components on both sides of a selected substrate and methods of fabrication
US20130154049A1 (en) * 2011-06-22 2013-06-20 George IMTHURN Integrated Circuits on Ceramic Wafers Using Layer Transfer Technology
CN102709257B (zh) * 2012-05-10 2015-08-19 三星半导体(中国)研究开发有限公司 半导体塑封料及其制造方法和半导体封装件
US8941128B2 (en) * 2012-11-21 2015-01-27 Intel Corporation Passivation layer for flexible display
JP6008763B2 (ja) * 2013-03-13 2016-10-19 富士フイルム株式会社 有機半導体膜の形成方法
WO2014166036A1 (zh) * 2013-04-07 2014-10-16 Liu Tajo 有机半导体装置
US9728298B2 (en) 2015-06-26 2017-08-08 Daikin America, Inc. Radiation crosslinked fluoropolymer compositions containing low level of extractable fluorides
CN108780253A (zh) * 2016-03-31 2018-11-09 陶氏环球技术有限责任公司 用钝化薄膜晶体管组件
US11479744B2 (en) * 2018-03-02 2022-10-25 Mitsubishi Gas Chemical Company, Inc. Composition having suppressed alumina damage and production method for semiconductor substrate using same
JP2023115730A (ja) * 2022-02-08 2023-08-21 タカノ株式会社 無線タグ、検査システム及び方法

Citations (2)

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JPH09208809A (ja) * 1996-02-01 1997-08-12 Mizusawa Ind Chem Ltd 半導体封止用樹脂組成物及びそれに用いる吸湿性充填剤
JP2006270059A (ja) * 2005-02-28 2006-10-05 Semiconductor Energy Lab Co Ltd 半導体装置及びその動作方法

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JPH09220891A (ja) * 1996-02-19 1997-08-26 Mitsubishi Electric Corp Ｉｃカード
US5853905A (en) * 1997-09-08 1998-12-29 Motorola, Inc. Efficient single layer electroluminescent device
JPH11307261A (ja) 1998-04-16 1999-11-05 Tdk Corp 有機ｅｌ素子
JP2000030870A (ja) 1998-07-14 2000-01-28 Tdk Corp 有機ｅｌ素子
TW516244B (en) * 1999-09-17 2003-01-01 Semiconductor Energy Lab EL display device and method for manufacturing the same
JP3942770B2 (ja) * 1999-09-22 2007-07-11 株式会社半導体エネルギー研究所 Ｅｌ表示装置及び電子装置
JP2001345431A (ja) 2000-05-31 2001-12-14 Japan Science & Technology Corp 有機強誘電体薄膜及び半導体デバイス
JP2002026277A (ja) 2000-06-30 2002-01-25 Seiko Epson Corp メモリデバイス及びその駆動方法
WO2002037500A1 (en) * 2000-10-31 2002-05-10 The Regents Of The University Of California Organic bistable device and organic memory cells
BR0117103A (pt) 2001-08-13 2004-08-10 Advanced Micro Devices Inc Célula de memória
JP3940014B2 (ja) * 2002-03-29 2007-07-04 富士通株式会社 半導体集積回路、無線タグ、および非接触型ｉｃカード
JP2004047791A (ja) 2002-07-12 2004-02-12 Pioneer Electronic Corp 有機薄膜スイッチングメモリ素子及びメモリ装置
JP2004128471A (ja) 2002-08-07 2004-04-22 Canon Inc 不揮発メモリ装置
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JP4254228B2 (ja) 2002-12-20 2009-04-15 富士電機ホールディングス株式会社 スイッチング素子及びその製造方法
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CN101676931B (zh) 2004-10-18 2012-06-27 株式会社半导体能源研究所 半导体器件以及防止用户伪造物体的方法
CN101044624A (zh) 2004-10-22 2007-09-26 株式会社半导体能源研究所 半导体器件
US7935958B2 (en) 2004-10-22 2011-05-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
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JP4884784B2 (ja) * 2005-01-28 2012-02-29 株式会社半導体エネルギー研究所 半導体装置の作製方法及び半導体装置
KR101322747B1 (ko) 2005-03-25 2013-11-04 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체장치 및 전자기기
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JPH09208809A (ja) * 1996-02-01 1997-08-12 Mizusawa Ind Chem Ltd 半導体封止用樹脂組成物及びそれに用いる吸湿性充填剤
JP2006270059A (ja) * 2005-02-28 2006-10-05 Semiconductor Energy Lab Co Ltd 半導体装置及びその動作方法

Also Published As

Publication number Publication date
KR20080048423A (ko) 2008-06-02
US20080121725A1 (en) 2008-05-29
US7988057B2 (en) 2011-08-02
JP2008166739A (ja) 2008-07-17
JP5475947B2 (ja) 2014-04-16

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