KR101419975B1 - 음이온 플라즈마를 생성하는 처리 시스템 및 중성빔 소스 - Google Patents

음이온 플라즈마를 생성하는 처리 시스템 및 중성빔 소스 Download PDF

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Publication number
KR101419975B1
KR101419975B1 KR1020107008983A KR20107008983A KR101419975B1 KR 101419975 B1 KR101419975 B1 KR 101419975B1 KR 1020107008983 A KR1020107008983 A KR 1020107008983A KR 20107008983 A KR20107008983 A KR 20107008983A KR 101419975 B1 KR101419975 B1 KR 101419975B1
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South Korea
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chamber
plasma
pressure
coupled
chamber region
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Korean (ko)
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KR20100080913A (ko
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리 첸
메릿 펑크
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도쿄엘렉트론가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32422—Arrangement for selecting ions or species in the plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32357—Generation remote from the workpiece, e.g. down-stream
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3411—Constructional aspects of the reactor
    • H01J37/3447—Collimators, shutters, apertures

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Plasma Technology (AREA)
  • Drying Of Semiconductors (AREA)
  • Particle Accelerators (AREA)
  • Electron Sources, Ion Sources (AREA)
KR1020107008983A 2007-09-27 2008-09-22 음이온 플라즈마를 생성하는 처리 시스템 및 중성빔 소스 Expired - Fee Related KR101419975B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/862,358 2007-09-27
US11/862,358 US20090084501A1 (en) 2007-09-27 2007-09-27 Processing system for producing a negative ion plasma
PCT/US2008/077163 WO2009042534A1 (en) 2007-09-27 2008-09-22 Processing system for producing a negative ion plasma

Publications (2)

Publication Number Publication Date
KR20100080913A KR20100080913A (ko) 2010-07-13
KR101419975B1 true KR101419975B1 (ko) 2014-07-16

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ID=40506851

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107008983A Expired - Fee Related KR101419975B1 (ko) 2007-09-27 2008-09-22 음이온 플라즈마를 생성하는 처리 시스템 및 중성빔 소스

Country Status (6)

Country Link
US (1) US20090084501A1 (enExample)
JP (1) JP5659425B2 (enExample)
KR (1) KR101419975B1 (enExample)
CN (1) CN101809715B (enExample)
TW (1) TWI505352B (enExample)
WO (1) WO2009042534A1 (enExample)

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US8323521B2 (en) * 2009-08-12 2012-12-04 Tokyo Electron Limited Plasma generation controlled by gravity-induced gas-diffusion separation (GIGDS) techniques
US8642974B2 (en) * 2009-12-30 2014-02-04 Fei Company Encapsulation of electrodes in solid media for use in conjunction with fluid high voltage isolation
US9793126B2 (en) 2010-08-04 2017-10-17 Lam Research Corporation Ion to neutral control for wafer processing with dual plasma source reactor
CN103262220A (zh) * 2010-12-16 2013-08-21 日立造船株式会社 利用电子束技术产生臭氧和等离子体
WO2012112187A1 (en) * 2011-02-15 2012-08-23 Applied Materials, Inc. Method and apparatus for multizone plasma generation
US9039911B2 (en) * 2012-08-27 2015-05-26 Lam Research Corporation Plasma-enhanced etching in an augmented plasma processing system
CN103290392A (zh) * 2012-03-01 2013-09-11 苏州汇智真空科技有限公司 共用电极的等离子体增强化学气相沉积装置及方法
US9431218B2 (en) 2013-03-15 2016-08-30 Tokyo Electron Limited Scalable and uniformity controllable diffusion plasma source
US9245761B2 (en) 2013-04-05 2016-01-26 Lam Research Corporation Internal plasma grid for semiconductor fabrication
US9230819B2 (en) * 2013-04-05 2016-01-05 Lam Research Corporation Internal plasma grid applications for semiconductor fabrication in context of ion-ion plasma processing
KR101799915B1 (ko) 2013-07-09 2017-11-21 피닉스 뉴클리어 랩스 엘엘씨 높은 신뢰성, 긴 수명, 음이온 소스
US9147581B2 (en) 2013-07-11 2015-09-29 Lam Research Corporation Dual chamber plasma etcher with ion accelerator
JP6247087B2 (ja) * 2013-12-18 2017-12-13 東京エレクトロン株式会社 処理装置および活性種の生成方法
US9288890B1 (en) * 2014-10-31 2016-03-15 Tokyo Electron Limited Method and apparatus for providing an anisotropic and mono-energetic neutral beam by non-ambipolar electron plasma
JP6584786B2 (ja) * 2015-02-13 2019-10-02 株式会社日立ハイテクノロジーズ プラズマイオン源および荷電粒子ビーム装置
US10475626B2 (en) 2015-03-17 2019-11-12 Applied Materials, Inc. Ion-ion plasma atomic layer etch process and reactor
CN105826220A (zh) * 2016-03-18 2016-08-03 华灿光电股份有限公司 一种干法刻蚀设备
US10062585B2 (en) * 2016-10-04 2018-08-28 Applied Materials, Inc. Oxygen compatible plasma source
US10354883B2 (en) * 2017-10-03 2019-07-16 Mattson Technology, Inc. Surface treatment of silicon or silicon germanium surfaces using organic radicals
US11462386B2 (en) * 2018-12-17 2022-10-04 Applied Materials, Inc. Electron beam apparatus for optical device fabrication
US20220119954A1 (en) * 2019-02-07 2022-04-21 Lam Research Corporation Substrate processing tool capable of modulating one or more plasma temporally and/or spatially
CN110335802B (zh) * 2019-07-11 2022-03-22 北京北方华创微电子装备有限公司 预清洗腔室及其过滤装置
US20230031722A1 (en) * 2021-07-23 2023-02-02 Taiwan Semiconductor Manufacturing Co., Ltd. Voltage Control for Etching Systems

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JPH07263353A (ja) * 1994-03-22 1995-10-13 Mitsubishi Electric Corp プラズマ処理装置及びプラズマ処理方法

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KR910016054A (ko) * 1990-02-23 1991-09-30 미다 가쓰시게 마이크로 전자 장치용 표면 처리 장치 및 그 방법
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JP4135541B2 (ja) * 2003-03-26 2008-08-20 ソニー株式会社 プラズマ表面処理方法
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Also Published As

Publication number Publication date
CN101809715A (zh) 2010-08-18
CN101809715B (zh) 2012-11-14
TWI505352B (zh) 2015-10-21
JP5659425B2 (ja) 2015-01-28
US20090084501A1 (en) 2009-04-02
JP2010541167A (ja) 2010-12-24
TW200924051A (en) 2009-06-01
KR20100080913A (ko) 2010-07-13
WO2009042534A1 (en) 2009-04-02

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