KR101409030B1 - 감광성 수지 조성물 및 이를 이용한 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 인쇄 배선판의 제조 방법 - Google Patents

감광성 수지 조성물 및 이를 이용한 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 인쇄 배선판의 제조 방법 Download PDF

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Publication number
KR101409030B1
KR101409030B1 KR1020127026557A KR20127026557A KR101409030B1 KR 101409030 B1 KR101409030 B1 KR 101409030B1 KR 1020127026557 A KR1020127026557 A KR 1020127026557A KR 20127026557 A KR20127026557 A KR 20127026557A KR 101409030 B1 KR101409030 B1 KR 101409030B1
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South Korea
Prior art keywords
photosensitive resin
resin composition
meth
compound represented
mass
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KR1020127026557A
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English (en)
Korean (ko)
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KR20120139790A (ko
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요시키 아지오카
마나미 우스바
겐지 가미오
미츠루 이시
준이치 이소
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히타치가세이가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymerisation Methods In General (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020127026557A 2010-03-19 2010-12-14 감광성 수지 조성물 및 이를 이용한 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 인쇄 배선판의 제조 방법 KR101409030B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2010064760 2010-03-19
JPJP-P-2010-064760 2010-03-19
JP2010131906 2010-06-09
JPJP-P-2010-131906 2010-06-09
PCT/JP2010/072490 WO2011114593A1 (ja) 2010-03-19 2010-12-14 感光性樹脂組成物並びにこれを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020147000469A Division KR101775206B1 (ko) 2010-03-19 2010-12-14 감광성 수지 조성물 및 이를 이용한 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 인쇄 배선판의 제조 방법

Publications (2)

Publication Number Publication Date
KR20120139790A KR20120139790A (ko) 2012-12-27
KR101409030B1 true KR101409030B1 (ko) 2014-06-18

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KR1020127026557A KR101409030B1 (ko) 2010-03-19 2010-12-14 감광성 수지 조성물 및 이를 이용한 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 인쇄 배선판의 제조 방법
KR1020147000469A KR101775206B1 (ko) 2010-03-19 2010-12-14 감광성 수지 조성물 및 이를 이용한 감광성 엘리먼트, 레지스트 패턴의 형성 방법 및 인쇄 배선판의 제조 방법

Family Applications After (1)

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Country Status (5)

Country Link
JP (1) JP5376043B2 (zh)
KR (2) KR101409030B1 (zh)
CN (1) CN102754032B (zh)
TW (1) TWI625594B (zh)
WO (1) WO2011114593A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101526678B1 (ko) * 2013-08-09 2015-06-05 동우 화인켐 주식회사 착색 감광성 수지 조성물, 컬러필터 및 이를 포함하는 액정표시장치
JP6486672B2 (ja) * 2013-12-20 2019-03-20 旭化成株式会社 感光性エレメント、及びその製造方法
CN106233204A (zh) * 2014-05-13 2016-12-14 日立化成株式会社 感光性树脂组合物、感光性元件、抗蚀图案的形成方法和印刷配线板的制造方法
JP6733553B2 (ja) * 2015-01-20 2020-08-05 日立化成株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法、及び、構造体の製造方法
WO2017015196A2 (en) 2015-07-23 2017-01-26 Bridgestone Americas Tire Operations, Llc Degradable foam-containing tires, related methods and kits for adding degradable foam to tires

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003077035A1 (fr) 2002-03-12 2003-09-18 Asahi Kasei Kabushiki Kaisha Composition de resine photosensible et utilisation de celle-ci
JP2009069465A (ja) 2007-09-13 2009-04-02 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4147920B2 (ja) * 2002-11-29 2008-09-10 日立化成工業株式会社 感光性樹脂組成物、これを用いた感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
KR100994311B1 (ko) * 2006-09-13 2010-11-12 히다치 가세고교 가부시끼가이샤 감광성 수지 조성물, 감광성 엘리먼트, 레지스트 패턴의 형성방법 및 프린트 배선판의 제조방법
JP4936848B2 (ja) * 2006-10-16 2012-05-23 旭化成イーマテリアルズ株式会社 感光性樹脂組成物およびその積層体
JP5151446B2 (ja) * 2007-07-18 2013-02-27 日立化成工業株式会社 感光性樹脂組成物、感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法
CN103064250A (zh) * 2008-06-18 2013-04-24 日立化成工业株式会社 感光性树脂组合物及使用其的感光性元件、抗蚀剂图形的形成方法及印刷电路板的制造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003077035A1 (fr) 2002-03-12 2003-09-18 Asahi Kasei Kabushiki Kaisha Composition de resine photosensible et utilisation de celle-ci
JP2009069465A (ja) 2007-09-13 2009-04-02 Asahi Kasei Electronics Co Ltd 感光性樹脂組成物

Also Published As

Publication number Publication date
JP5376043B2 (ja) 2013-12-25
KR20120139790A (ko) 2012-12-27
TW201207554A (en) 2012-02-16
CN102754032B (zh) 2015-07-15
KR20140009600A (ko) 2014-01-22
WO2011114593A1 (ja) 2011-09-22
JPWO2011114593A1 (ja) 2013-06-27
CN102754032A (zh) 2012-10-24
TWI625594B (zh) 2018-06-01
KR101775206B1 (ko) 2017-09-05

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