KR101399669B1 - 거리 측정 기능을 갖는 연마기 - Google Patents
거리 측정 기능을 갖는 연마기 Download PDFInfo
- Publication number
- KR101399669B1 KR101399669B1 KR1020110019240A KR20110019240A KR101399669B1 KR 101399669 B1 KR101399669 B1 KR 101399669B1 KR 1020110019240 A KR1020110019240 A KR 1020110019240A KR 20110019240 A KR20110019240 A KR 20110019240A KR 101399669 B1 KR101399669 B1 KR 101399669B1
- Authority
- KR
- South Korea
- Prior art keywords
- microscope
- image
- sharpness
- vertical distance
- vertical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010049407A JP5507294B2 (ja) | 2010-03-05 | 2010-03-05 | 距離測定機能付きの研削盤 |
| JPJP-P-2010-049407 | 2010-03-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20110101075A KR20110101075A (ko) | 2011-09-15 |
| KR101399669B1 true KR101399669B1 (ko) | 2014-05-27 |
Family
ID=44531742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020110019240A Active KR101399669B1 (ko) | 2010-03-05 | 2011-03-04 | 거리 측정 기능을 갖는 연마기 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US8494671B2 (https=) |
| JP (1) | JP5507294B2 (https=) |
| KR (1) | KR101399669B1 (https=) |
| TW (1) | TWI438060B (https=) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5507294B2 (ja) * | 2010-03-05 | 2014-05-28 | 東芝機械株式会社 | 距離測定機能付きの研削盤 |
| CN102371519B (zh) * | 2011-09-19 | 2014-06-04 | 重庆师范大学 | 微型非球面元件研磨或抛光跟踪加工方法 |
| JP5908327B2 (ja) * | 2011-11-01 | 2016-04-26 | 東芝機械株式会社 | ワークの溝加工方法 |
| EP2865489B1 (en) * | 2012-06-21 | 2019-04-03 | Kagoshima University National University Corporation | Observation and photography apparatus |
| CN104175222B (zh) * | 2014-08-25 | 2016-06-29 | 上海交通大学 | 大型球面磨削迹线形貌图像采集装置及球度判别方法 |
| CN104191332B (zh) * | 2014-08-25 | 2016-05-11 | 上海交通大学 | 大型球面磨削球度误差自动补偿装置及方法 |
| CN105196180A (zh) * | 2015-08-24 | 2015-12-30 | 哈尔滨工业大学 | 一种使用小尺寸工具头超精密研抛用的ccd对刀装置 |
| CN107234490A (zh) * | 2016-03-28 | 2017-10-10 | 沈阳海默数控机床有限公司 | 一种磨削方法及槽磨的控制装置 |
| JP6912284B2 (ja) * | 2017-06-23 | 2021-08-04 | 株式会社ディスコ | 研削装置 |
| EP3441773B1 (en) * | 2017-08-11 | 2022-11-23 | Anton Paar GmbH | Characterizing a height profile of a sample by side view imaging |
| EP4252964A4 (en) * | 2020-12-04 | 2024-10-16 | Metrol Co., Ltd. | AUTOMATED GRINDING SYSTEM |
| AT526928B1 (de) * | 2023-05-08 | 2024-09-15 | Univ Linz | Vorrichtung zum Bearbeiten einer Probe für eine Untersuchung mithilfe einer Transmissionselektronenmikroskopie |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05269659A (ja) * | 1991-09-20 | 1993-10-19 | Essilor Internatl (Cie Gen Opt) | 表面を機械加工するための多軸数値制御機械および方法 |
| JPH0752037A (ja) * | 1993-08-17 | 1995-02-28 | San Biruto:Kk | 自動厚さ制御石材研磨装置 |
| JPH07147004A (ja) * | 1993-11-24 | 1995-06-06 | Daido Steel Co Ltd | 基準マークに対する研削端面位置測定方法 |
| KR20090018711A (ko) * | 2006-06-09 | 2009-02-20 | 위구-디바이스 아이엔씨. | 무한 보정 현미경의 자동 포커싱을 위한 방법 및 장치 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05288981A (ja) * | 1992-04-14 | 1993-11-05 | Sony Corp | オートフォーカス装置 |
| JPH07153719A (ja) * | 1993-11-26 | 1995-06-16 | Seiko Seiki Co Ltd | ダイシング装置 |
| US5741171A (en) * | 1996-08-19 | 1998-04-21 | Sagitta Engineering Solutions, Ltd. | Precision polishing system |
| KR100314748B1 (ko) * | 1999-05-03 | 2001-11-23 | 양재신 | 실시간 3차원 그래픽 표시기능을 갖는 수치제어시스템 및 방법 |
| JP4069545B2 (ja) * | 1999-05-19 | 2008-04-02 | 株式会社日立製作所 | 電子顕微方法及びそれを用いた電子顕微鏡並び生体試料検査方法及び生体検査装置 |
| US6533641B1 (en) * | 2000-09-21 | 2003-03-18 | Advanced Micro Devices, Inc. | Grinding arrangement and method for real-time viewing of samples during cross-sectioning |
| JP3668777B2 (ja) * | 2002-07-09 | 2005-07-06 | 独立行政法人国立高等専門学校機構 | 研削工具の砥粒突出量測定装置及び測定方法 |
| JP4216565B2 (ja) * | 2002-10-28 | 2009-01-28 | 株式会社ディスコ | 切削装置 |
| US20090212213A1 (en) * | 2005-03-03 | 2009-08-27 | Ebara Corporation | Projection electron beam apparatus and defect inspection system using the apparatus |
| JP5162163B2 (ja) * | 2007-06-27 | 2013-03-13 | 株式会社ディスコ | ウェーハのレーザ加工方法 |
| JP5269502B2 (ja) * | 2008-07-10 | 2013-08-21 | 株式会社ニコンインステック | 画像処理方法および顕微鏡装置 |
| JP5276488B2 (ja) * | 2009-03-20 | 2013-08-28 | 株式会社森精機製作所 | 工作機械における工作物測定装置およびその方法 |
| JP5507294B2 (ja) * | 2010-03-05 | 2014-05-28 | 東芝機械株式会社 | 距離測定機能付きの研削盤 |
-
2010
- 2010-03-05 JP JP2010049407A patent/JP5507294B2/ja active Active
-
2011
- 2011-02-21 TW TW100105640A patent/TWI438060B/zh active
- 2011-02-25 US US13/035,220 patent/US8494671B2/en active Active
- 2011-03-04 KR KR1020110019240A patent/KR101399669B1/ko active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05269659A (ja) * | 1991-09-20 | 1993-10-19 | Essilor Internatl (Cie Gen Opt) | 表面を機械加工するための多軸数値制御機械および方法 |
| JPH0752037A (ja) * | 1993-08-17 | 1995-02-28 | San Biruto:Kk | 自動厚さ制御石材研磨装置 |
| JPH07147004A (ja) * | 1993-11-24 | 1995-06-06 | Daido Steel Co Ltd | 基準マークに対する研削端面位置測定方法 |
| KR20090018711A (ko) * | 2006-06-09 | 2009-02-20 | 위구-디바이스 아이엔씨. | 무한 보정 현미경의 자동 포커싱을 위한 방법 및 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI438060B (zh) | 2014-05-21 |
| US20110217905A1 (en) | 2011-09-08 |
| JP2011183483A (ja) | 2011-09-22 |
| US8494671B2 (en) | 2013-07-23 |
| JP5507294B2 (ja) | 2014-05-28 |
| KR20110101075A (ko) | 2011-09-15 |
| TW201200295A (en) | 2012-01-01 |
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