KR101399669B1 - 거리 측정 기능을 갖는 연마기 - Google Patents

거리 측정 기능을 갖는 연마기 Download PDF

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KR101399669B1
KR101399669B1 KR1020110019240A KR20110019240A KR101399669B1 KR 101399669 B1 KR101399669 B1 KR 101399669B1 KR 1020110019240 A KR1020110019240 A KR 1020110019240A KR 20110019240 A KR20110019240 A KR 20110019240A KR 101399669 B1 KR101399669 B1 KR 101399669B1
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microscope
image
sharpness
vertical distance
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KR20110101075A (ko
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다까노부 아끼야마
히로유끼 가끼시마
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도시바 기카이 가부시키가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR1020110019240A 2010-03-05 2011-03-04 거리 측정 기능을 갖는 연마기 Active KR101399669B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2010049407A JP5507294B2 (ja) 2010-03-05 2010-03-05 距離測定機能付きの研削盤
JPJP-P-2010-049407 2010-03-05

Publications (2)

Publication Number Publication Date
KR20110101075A KR20110101075A (ko) 2011-09-15
KR101399669B1 true KR101399669B1 (ko) 2014-05-27

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ID=44531742

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KR1020110019240A Active KR101399669B1 (ko) 2010-03-05 2011-03-04 거리 측정 기능을 갖는 연마기

Country Status (4)

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US (1) US8494671B2 (enExample)
JP (1) JP5507294B2 (enExample)
KR (1) KR101399669B1 (enExample)
TW (1) TWI438060B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5507294B2 (ja) * 2010-03-05 2014-05-28 東芝機械株式会社 距離測定機能付きの研削盤
CN102371519B (zh) * 2011-09-19 2014-06-04 重庆师范大学 微型非球面元件研磨或抛光跟踪加工方法
JP5908327B2 (ja) * 2011-11-01 2016-04-26 東芝機械株式会社 ワークの溝加工方法
CN104470681B (zh) * 2012-06-21 2017-11-21 国立大学法人鹿儿岛大学 观察拍摄装置
CN104191332B (zh) * 2014-08-25 2016-05-11 上海交通大学 大型球面磨削球度误差自动补偿装置及方法
CN104175222B (zh) * 2014-08-25 2016-06-29 上海交通大学 大型球面磨削迹线形貌图像采集装置及球度判别方法
CN105196180A (zh) * 2015-08-24 2015-12-30 哈尔滨工业大学 一种使用小尺寸工具头超精密研抛用的ccd对刀装置
CN107234490A (zh) * 2016-03-28 2017-10-10 沈阳海默数控机床有限公司 一种磨削方法及槽磨的控制装置
JP6912284B2 (ja) * 2017-06-23 2021-08-04 株式会社ディスコ 研削装置
EP3441773B1 (en) * 2017-08-11 2022-11-23 Anton Paar GmbH Characterizing a height profile of a sample by side view imaging
JP7584813B2 (ja) * 2020-12-04 2024-11-18 株式会社メトロール 自動研削システム
AT526928B1 (de) * 2023-05-08 2024-09-15 Univ Linz Vorrichtung zum Bearbeiten einer Probe für eine Untersuchung mithilfe einer Transmissionselektronenmikroskopie

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05269659A (ja) * 1991-09-20 1993-10-19 Essilor Internatl (Cie Gen Opt) 表面を機械加工するための多軸数値制御機械および方法
JPH0752037A (ja) * 1993-08-17 1995-02-28 San Biruto:Kk 自動厚さ制御石材研磨装置
JPH07147004A (ja) * 1993-11-24 1995-06-06 Daido Steel Co Ltd 基準マークに対する研削端面位置測定方法
KR20090018711A (ko) * 2006-06-09 2009-02-20 위구-디바이스 아이엔씨. 무한 보정 현미경의 자동 포커싱을 위한 방법 및 장치

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05288981A (ja) * 1992-04-14 1993-11-05 Sony Corp オートフォーカス装置
JPH07153719A (ja) * 1993-11-26 1995-06-16 Seiko Seiki Co Ltd ダイシング装置
US5741171A (en) * 1996-08-19 1998-04-21 Sagitta Engineering Solutions, Ltd. Precision polishing system
KR100314748B1 (ko) * 1999-05-03 2001-11-23 양재신 실시간 3차원 그래픽 표시기능을 갖는 수치제어시스템 및 방법
JP4069545B2 (ja) * 1999-05-19 2008-04-02 株式会社日立製作所 電子顕微方法及びそれを用いた電子顕微鏡並び生体試料検査方法及び生体検査装置
US6533641B1 (en) * 2000-09-21 2003-03-18 Advanced Micro Devices, Inc. Grinding arrangement and method for real-time viewing of samples during cross-sectioning
JP3668777B2 (ja) * 2002-07-09 2005-07-06 独立行政法人国立高等専門学校機構 研削工具の砥粒突出量測定装置及び測定方法
JP4216565B2 (ja) * 2002-10-28 2009-01-28 株式会社ディスコ 切削装置
TW200703409A (en) * 2005-03-03 2007-01-16 Ebara Corp Mapping projection type electron beam apparatus and defects inspection system using such apparatus
JP5162163B2 (ja) * 2007-06-27 2013-03-13 株式会社ディスコ ウェーハのレーザ加工方法
JP5269502B2 (ja) * 2008-07-10 2013-08-21 株式会社ニコンインステック 画像処理方法および顕微鏡装置
JP5276488B2 (ja) * 2009-03-20 2013-08-28 株式会社森精機製作所 工作機械における工作物測定装置およびその方法
JP5507294B2 (ja) * 2010-03-05 2014-05-28 東芝機械株式会社 距離測定機能付きの研削盤

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05269659A (ja) * 1991-09-20 1993-10-19 Essilor Internatl (Cie Gen Opt) 表面を機械加工するための多軸数値制御機械および方法
JPH0752037A (ja) * 1993-08-17 1995-02-28 San Biruto:Kk 自動厚さ制御石材研磨装置
JPH07147004A (ja) * 1993-11-24 1995-06-06 Daido Steel Co Ltd 基準マークに対する研削端面位置測定方法
KR20090018711A (ko) * 2006-06-09 2009-02-20 위구-디바이스 아이엔씨. 무한 보정 현미경의 자동 포커싱을 위한 방법 및 장치

Also Published As

Publication number Publication date
JP2011183483A (ja) 2011-09-22
US8494671B2 (en) 2013-07-23
JP5507294B2 (ja) 2014-05-28
TW201200295A (en) 2012-01-01
KR20110101075A (ko) 2011-09-15
US20110217905A1 (en) 2011-09-08
TWI438060B (zh) 2014-05-21

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