JP5507294B2 - 距離測定機能付きの研削盤 - Google Patents

距離測定機能付きの研削盤 Download PDF

Info

Publication number
JP5507294B2
JP5507294B2 JP2010049407A JP2010049407A JP5507294B2 JP 5507294 B2 JP5507294 B2 JP 5507294B2 JP 2010049407 A JP2010049407 A JP 2010049407A JP 2010049407 A JP2010049407 A JP 2010049407A JP 5507294 B2 JP5507294 B2 JP 5507294B2
Authority
JP
Japan
Prior art keywords
microscope
image
sharpness
workpiece
distance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2010049407A
Other languages
English (en)
Japanese (ja)
Other versions
JP2011183483A5 (enExample
JP2011183483A (ja
Inventor
山 貴 信 秋
島 浩 之 柿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Machine Co Ltd
Original Assignee
Toshiba Machine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Machine Co Ltd filed Critical Toshiba Machine Co Ltd
Priority to JP2010049407A priority Critical patent/JP5507294B2/ja
Priority to TW100105640A priority patent/TWI438060B/zh
Priority to US13/035,220 priority patent/US8494671B2/en
Priority to KR1020110019240A priority patent/KR101399669B1/ko
Publication of JP2011183483A publication Critical patent/JP2011183483A/ja
Publication of JP2011183483A5 publication Critical patent/JP2011183483A5/ja
Application granted granted Critical
Publication of JP5507294B2 publication Critical patent/JP5507294B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)
JP2010049407A 2010-03-05 2010-03-05 距離測定機能付きの研削盤 Active JP5507294B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2010049407A JP5507294B2 (ja) 2010-03-05 2010-03-05 距離測定機能付きの研削盤
TW100105640A TWI438060B (zh) 2010-03-05 2011-02-21 具有測量距離的功能之研磨機
US13/035,220 US8494671B2 (en) 2010-03-05 2011-02-25 Grinding machine having the function of measuring distance
KR1020110019240A KR101399669B1 (ko) 2010-03-05 2011-03-04 거리 측정 기능을 갖는 연마기

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010049407A JP5507294B2 (ja) 2010-03-05 2010-03-05 距離測定機能付きの研削盤

Publications (3)

Publication Number Publication Date
JP2011183483A JP2011183483A (ja) 2011-09-22
JP2011183483A5 JP2011183483A5 (enExample) 2013-02-14
JP5507294B2 true JP5507294B2 (ja) 2014-05-28

Family

ID=44531742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010049407A Active JP5507294B2 (ja) 2010-03-05 2010-03-05 距離測定機能付きの研削盤

Country Status (4)

Country Link
US (1) US8494671B2 (enExample)
JP (1) JP5507294B2 (enExample)
KR (1) KR101399669B1 (enExample)
TW (1) TWI438060B (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5507294B2 (ja) * 2010-03-05 2014-05-28 東芝機械株式会社 距離測定機能付きの研削盤
CN102371519B (zh) * 2011-09-19 2014-06-04 重庆师范大学 微型非球面元件研磨或抛光跟踪加工方法
JP5908327B2 (ja) * 2011-11-01 2016-04-26 東芝機械株式会社 ワークの溝加工方法
CN104470681B (zh) * 2012-06-21 2017-11-21 国立大学法人鹿儿岛大学 观察拍摄装置
CN104191332B (zh) * 2014-08-25 2016-05-11 上海交通大学 大型球面磨削球度误差自动补偿装置及方法
CN104175222B (zh) * 2014-08-25 2016-06-29 上海交通大学 大型球面磨削迹线形貌图像采集装置及球度判别方法
CN105196180A (zh) * 2015-08-24 2015-12-30 哈尔滨工业大学 一种使用小尺寸工具头超精密研抛用的ccd对刀装置
CN107234490A (zh) * 2016-03-28 2017-10-10 沈阳海默数控机床有限公司 一种磨削方法及槽磨的控制装置
JP6912284B2 (ja) * 2017-06-23 2021-08-04 株式会社ディスコ 研削装置
EP3441773B1 (en) * 2017-08-11 2022-11-23 Anton Paar GmbH Characterizing a height profile of a sample by side view imaging
JP7584813B2 (ja) * 2020-12-04 2024-11-18 株式会社メトロール 自動研削システム
AT526928B1 (de) * 2023-05-08 2024-09-15 Univ Linz Vorrichtung zum Bearbeiten einer Probe für eine Untersuchung mithilfe einer Transmissionselektronenmikroskopie

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2681546B1 (fr) * 1991-09-20 1995-12-08 Essilor Int Procede et machine d'usinage a commande numerique multi-axe.
JPH05288981A (ja) * 1992-04-14 1993-11-05 Sony Corp オートフォーカス装置
JPH0752037A (ja) * 1993-08-17 1995-02-28 San Biruto:Kk 自動厚さ制御石材研磨装置
JPH07147004A (ja) * 1993-11-24 1995-06-06 Daido Steel Co Ltd 基準マークに対する研削端面位置測定方法
JPH07153719A (ja) * 1993-11-26 1995-06-16 Seiko Seiki Co Ltd ダイシング装置
US5741171A (en) * 1996-08-19 1998-04-21 Sagitta Engineering Solutions, Ltd. Precision polishing system
KR100314748B1 (ko) * 1999-05-03 2001-11-23 양재신 실시간 3차원 그래픽 표시기능을 갖는 수치제어시스템 및 방법
JP4069545B2 (ja) * 1999-05-19 2008-04-02 株式会社日立製作所 電子顕微方法及びそれを用いた電子顕微鏡並び生体試料検査方法及び生体検査装置
US6533641B1 (en) * 2000-09-21 2003-03-18 Advanced Micro Devices, Inc. Grinding arrangement and method for real-time viewing of samples during cross-sectioning
JP3668777B2 (ja) * 2002-07-09 2005-07-06 独立行政法人国立高等専門学校機構 研削工具の砥粒突出量測定装置及び測定方法
JP4216565B2 (ja) * 2002-10-28 2009-01-28 株式会社ディスコ 切削装置
TW200703409A (en) * 2005-03-03 2007-01-16 Ebara Corp Mapping projection type electron beam apparatus and defects inspection system using such apparatus
JP2009540343A (ja) * 2006-06-09 2009-11-19 ダブリューディーアイ ワイズ デヴァイス インコーポレイテッド 無限遠補正顕微鏡をオートフォーカスするための方法および装置
JP5162163B2 (ja) * 2007-06-27 2013-03-13 株式会社ディスコ ウェーハのレーザ加工方法
JP5269502B2 (ja) * 2008-07-10 2013-08-21 株式会社ニコンインステック 画像処理方法および顕微鏡装置
JP5276488B2 (ja) * 2009-03-20 2013-08-28 株式会社森精機製作所 工作機械における工作物測定装置およびその方法
JP5507294B2 (ja) * 2010-03-05 2014-05-28 東芝機械株式会社 距離測定機能付きの研削盤

Also Published As

Publication number Publication date
JP2011183483A (ja) 2011-09-22
KR101399669B1 (ko) 2014-05-27
US8494671B2 (en) 2013-07-23
TW201200295A (en) 2012-01-01
KR20110101075A (ko) 2011-09-15
US20110217905A1 (en) 2011-09-08
TWI438060B (zh) 2014-05-21

Similar Documents

Publication Publication Date Title
JP5507294B2 (ja) 距離測定機能付きの研削盤
US20210291404A1 (en) Edge alignment method
CN110640303B (zh) 高精度视觉定位系统及其定位校准方法
JP6289980B2 (ja) 加工方法
JP2012032224A (ja) 寸法測定装置、寸法測定方法及び寸法測定装置用のプログラム
JP5467962B2 (ja) 測定設定データ作成装置、測定設定データ作成方法、測定設定データ作成装置用のプログラム及び寸法測定装置
JP5546938B2 (ja) 観察点特定機能付きの工作機械
US10535157B2 (en) Positioning and measuring system based on image scale
US11232551B2 (en) Wafer inspecting apparatus
JP6095486B2 (ja) 画像測定装置
JP6844985B2 (ja) 目立てボードの使用方法
JP6302658B2 (ja) 加工方法
JP4485771B2 (ja) 切削装置におけるチャックテーブルの回転軸と顕微鏡の中心との位置合わせ方法
JP6979885B2 (ja) ３ｄ形状のオートトレース方法及び測定機
JP2013063490A (ja) 切削装置および切削方法
JP5908327B2 (ja) ワークの溝加工方法
JPH112510A (ja) 切削溝深さの検出方法
JP5615660B2 (ja) 観察点焦点合わせ支援機能付きの工作機械
TWI699756B (zh) 基於彈性特徵影像尺的定位量測系統
JP2018072267A (ja) 画像測定装置
JP2020071703A (ja) 加工装置及び加工方法
JP2024104094A (ja) ダイシング装置及びダイシング装置の制御方法
JP2004160585A (ja) 研削盤およびツルーイング位置算出方法並びにツルーイング方法
JP2021000700A (ja) 加工装置及び加工方法
JPH10258372A (ja) レーザ加工機における製品検査方法および加工プログラム修正方法並びにレーザ加工機

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121218

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20121218

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20131129

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131203

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20140203

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140221

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140319

R150 Certificate of patent or registration of utility model

Ref document number: 5507294

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350