KR101391082B1 - 구속된 층의 제조 공정 및 이에 의해 제조된 소자 - Google Patents

구속된 층의 제조 공정 및 이에 의해 제조된 소자 Download PDF

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Publication number
KR101391082B1
KR101391082B1 KR1020087027338A KR20087027338A KR101391082B1 KR 101391082 B1 KR101391082 B1 KR 101391082B1 KR 1020087027338 A KR1020087027338 A KR 1020087027338A KR 20087027338 A KR20087027338 A KR 20087027338A KR 101391082 B1 KR101391082 B1 KR 101391082B1
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layer
rsa
radiation
organic
exposed
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English (en)
Korean (ko)
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KR20090034804A (ko
Inventor
다니엘 디. 레클룩스
에릭 엠. 스미쓰
게리 에이. 조한슨
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이 아이 듀폰 디 네모아 앤드 캄파니
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Thin Film Transistor (AREA)
  • Laminated Bodies (AREA)
KR1020087027338A 2006-04-10 2007-04-10 구속된 층의 제조 공정 및 이에 의해 제조된 소자 Expired - Fee Related KR101391082B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/401,151 2006-04-10
US11/401,151 US8124172B2 (en) 2006-03-02 2006-04-10 Process for making contained layers and devices made with same
PCT/US2007/008830 WO2007120654A2 (en) 2006-04-10 2007-04-10 Process for making contained layers and devices made with same

Publications (2)

Publication Number Publication Date
KR20090034804A KR20090034804A (ko) 2009-04-08
KR101391082B1 true KR101391082B1 (ko) 2014-04-30

Family

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KR1020087027338A Expired - Fee Related KR101391082B1 (ko) 2006-04-10 2007-04-10 구속된 층의 제조 공정 및 이에 의해 제조된 소자

Country Status (6)

Country Link
US (3) US8124172B2 (enExample)
EP (1) EP2005498A4 (enExample)
JP (1) JP2009533251A (enExample)
KR (1) KR101391082B1 (enExample)
CN (1) CN101416327B (enExample)
WO (1) WO2007120654A2 (enExample)

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US20080286487A1 (en) * 2007-05-18 2008-11-20 Lang Charles D Process for making contained layers
JP2011501360A (ja) * 2007-10-15 2011-01-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 溶液処理された電子デバイス
JP2011501472A (ja) * 2007-10-23 2011-01-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 発光用途の３成分発光層
KR20100094475A (ko) * 2007-10-26 2010-08-26 이 아이 듀폰 디 네모아 앤드 캄파니 격납된 층을 제조하기 위한 방법 및 재료, 및 이를 사용하여 제조된 소자
US20090142556A1 (en) * 2007-11-29 2009-06-04 E. I. Du Pont De Nemours And Company Process for forming an organic electronic device including an organic device layer
US8040048B2 (en) * 2007-12-12 2011-10-18 Lang Charles D Process for forming an organic electronic device including an organic device layer
JP2011509498A (ja) 2007-12-14 2011-03-24 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 電子デバイス用のバックプレーン構造体
KR20100111315A (ko) * 2008-02-01 2010-10-14 이 아이 듀폰 디 네모아 앤드 캄파니 용액 처리된 전자 소자를 제조하기 위한 구조물
TW201005813A (en) * 2008-05-15 2010-02-01 Du Pont Process for forming an electroactive layer
KR20110014653A (ko) * 2008-05-19 2011-02-11 이 아이 듀폰 디 네모아 앤드 캄파니 전자 소자에서 증기 코팅 장치 및 방법
US8759818B2 (en) 2009-02-27 2014-06-24 E I Du Pont De Nemours And Company Deuterated compounds for electronic applications
WO2010102272A2 (en) 2009-03-06 2010-09-10 E. I. Du Pont De Nemours And Company Process for forming an electroactive layer
WO2010104857A2 (en) 2009-03-09 2010-09-16 E. I. Du Pont De Nemours And Company Process for forming an electroactive layer
EP2406813A4 (en) 2009-03-09 2012-07-25 Du Pont METHOD FOR FORMING AN ELECTROACTIVE LAYER
US8497495B2 (en) * 2009-04-03 2013-07-30 E I Du Pont De Nemours And Company Electroactive materials
GB0912034D0 (en) * 2009-07-10 2009-08-19 Cambridge Entpr Ltd Patterning
TW201104357A (en) * 2009-07-27 2011-02-01 Du Pont Process and materials for making contained layers and devices made with same
TWI385185B (zh) * 2009-07-29 2013-02-11 Ind Tech Res Inst 聚合物及包含其之光學元件及光電裝置
GB0913456D0 (en) 2009-08-03 2009-09-16 Cambridge Entpr Ltd Printed electronic device
TW201111326A (en) 2009-09-29 2011-04-01 Du Pont Deuterated compounds for luminescent applications
WO2011059463A1 (en) 2009-10-29 2011-05-19 E. I. Du Pont De Nemours And Company Deuterated compounds for electronic applications
KR101547410B1 (ko) 2010-12-20 2015-08-25 이 아이 듀폰 디 네모아 앤드 캄파니 전자적 응용을 위한 조성물
US9444050B2 (en) 2013-01-17 2016-09-13 Kateeva, Inc. High resolution organic light-emitting diode devices, displays, and related method
US9614191B2 (en) 2013-01-17 2017-04-04 Kateeva, Inc. High resolution organic light-emitting diode devices, displays, and related methods
KR102472642B1 (ko) 2015-06-16 2022-11-30 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
KR102431626B1 (ko) 2015-10-06 2022-08-11 삼성디스플레이 주식회사 발광 표시 장치 및 그 제조 방법
CN111081901A (zh) * 2018-11-26 2020-04-28 中国科学院苏州纳米技术与纳米仿生研究所 印刷电子器件的制备方法
EP4166580A4 (en) * 2020-06-10 2024-06-12 Daikin Industries, Ltd. FLUORINE-CONTAINING COMPOUND

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Also Published As

Publication number Publication date
JP2009533251A (ja) 2009-09-17
EP2005498A4 (en) 2012-04-18
CN101416327B (zh) 2011-01-19
WO2007120654A3 (en) 2008-08-28
EP2005498A2 (en) 2008-12-24
CN101416327A (zh) 2009-04-22
US8383192B2 (en) 2013-02-26
US20110183268A1 (en) 2011-07-28
WO2007120654A2 (en) 2007-10-25
US20070218582A1 (en) 2007-09-20
US20070205409A1 (en) 2007-09-06
KR20090034804A (ko) 2009-04-08
US8124172B2 (en) 2012-02-28

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