JP2009533251A - 閉じ込められた層の製造方法、およびそれを使用して製造されたデバイス - Google Patents

閉じ込められた層の製造方法、およびそれを使用して製造されたデバイス Download PDF

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Publication number
JP2009533251A
JP2009533251A JP2009505432A JP2009505432A JP2009533251A JP 2009533251 A JP2009533251 A JP 2009533251A JP 2009505432 A JP2009505432 A JP 2009505432A JP 2009505432 A JP2009505432 A JP 2009505432A JP 2009533251 A JP2009533251 A JP 2009533251A
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Japan
Prior art keywords
layer
rsa
radiation
organic active
active layer
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JP2009505432A
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English (en)
Japanese (ja)
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JP2009533251A5 (enExample
Inventor
ディー．ルクルークス ダニエル
エム．スミス エリック
エー．ヨハンセン ゲーリー
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EIDP Inc
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EI Du Pont de Nemours and Co
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Application filed by EI Du Pont de Nemours and Co filed Critical EI Du Pont de Nemours and Co
Publication of JP2009533251A publication Critical patent/JP2009533251A/ja
Publication of JP2009533251A5 publication Critical patent/JP2009533251A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
    • H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
    • H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
    • H10K50/11—OLEDs or polymer light-emitting diodes [PLED] characterised by the electroluminescent [EL] layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Thin Film Transistor (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Laminated Bodies (AREA)
JP2009505432A 2006-04-10 2007-04-10 閉じ込められた層の製造方法、およびそれを使用して製造されたデバイス Pending JP2009533251A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/401,151 US8124172B2 (en) 2006-03-02 2006-04-10 Process for making contained layers and devices made with same
PCT/US2007/008830 WO2007120654A2 (en) 2006-04-10 2007-04-10 Process for making contained layers and devices made with same

Publications (2)

Publication Number Publication Date
JP2009533251A true JP2009533251A (ja) 2009-09-17
JP2009533251A5 JP2009533251A5 (enExample) 2015-03-12

Family

ID=38610130

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009505432A Pending JP2009533251A (ja) 2006-04-10 2007-04-10 閉じ込められた層の製造方法、およびそれを使用して製造されたデバイス

Country Status (6)

Country Link
US (3) US8124172B2 (enExample)
EP (1) EP2005498A4 (enExample)
JP (1) JP2009533251A (enExample)
KR (1) KR101391082B1 (enExample)
CN (1) CN101416327B (enExample)
WO (1) WO2007120654A2 (enExample)

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US20080286487A1 (en) * 2007-05-18 2008-11-20 Lang Charles D Process for making contained layers
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US20100224866A1 (en) * 2007-10-23 2010-09-09 E.I.Du Pont De Nemours And Company Ternary emissive layers for luminescent applications
KR20100094475A (ko) * 2007-10-26 2010-08-26 이 아이 듀폰 디 네모아 앤드 캄파니 격납된 층을 제조하기 위한 방법 및 재료, 및 이를 사용하여 제조된 소자
US20090142556A1 (en) * 2007-11-29 2009-06-04 E. I. Du Pont De Nemours And Company Process for forming an organic electronic device including an organic device layer
US8040048B2 (en) * 2007-12-12 2011-10-18 Lang Charles D Process for forming an organic electronic device including an organic device layer
WO2009079327A1 (en) 2007-12-14 2009-06-25 E. I. Du Pont De Nemours And Company Backplane structures for electronic devices
US20100295036A1 (en) * 2008-02-01 2010-11-25 E.I. Du Pont De Nemours And Company Structure for making solution processed electronic devices
TW201005813A (en) * 2008-05-15 2010-02-01 Du Pont Process for forming an electroactive layer
US20110092076A1 (en) * 2008-05-19 2011-04-21 E.I. Du Pont De Nemours And Company Apparatus and method of vapor coating in an electronic device
US8759818B2 (en) 2009-02-27 2014-06-24 E I Du Pont De Nemours And Company Deuterated compounds for electronic applications
EP2404315A4 (en) 2009-03-06 2012-08-08 Du Pont METHOD FOR FORMING AN ELECTROACTIVE LAYER
WO2010104857A2 (en) 2009-03-09 2010-09-16 E. I. Du Pont De Nemours And Company Process for forming an electroactive layer
TW201114082A (en) 2009-03-09 2011-04-16 Du Pont Process for forming an electroactive layer
US8497495B2 (en) * 2009-04-03 2013-07-30 E I Du Pont De Nemours And Company Electroactive materials
GB0912034D0 (en) * 2009-07-10 2009-08-19 Cambridge Entpr Ltd Patterning
EP2459379A4 (en) * 2009-07-27 2015-05-06 Du Pont METHOD AND MATERIALS FOR PRODUCING RESTRICTED LAYERS AND DEVICES MADE THEREFOR
TWI385185B (zh) * 2009-07-29 2013-02-11 Ind Tech Res Inst 聚合物及包含其之光學元件及光電裝置
GB0913456D0 (en) 2009-08-03 2009-09-16 Cambridge Entpr Ltd Printed electronic device
KR20120091144A (ko) 2009-09-29 2012-08-17 이 아이 듀폰 디 네모아 앤드 캄파니 발광 응용을 위한 중수소화된 화합물
JP5784621B2 (ja) 2009-10-29 2015-09-24 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニーＥ．Ｉ．Ｄｕ Ｐｏｎｔ Ｄｅ Ｎｅｍｏｕｒｓ Ａｎｄ Ｃｏｍｐａｎｙ 電子用途用の重水素化合物
WO2012087955A1 (en) 2010-12-20 2012-06-28 E. I. Du Pont De Nemours And Company Compositions for electronic applications
US9444050B2 (en) 2013-01-17 2016-09-13 Kateeva, Inc. High resolution organic light-emitting diode devices, displays, and related method
US9614191B2 (en) 2013-01-17 2017-04-04 Kateeva, Inc. High resolution organic light-emitting diode devices, displays, and related methods
KR102472642B1 (ko) 2015-06-16 2022-11-30 삼성디스플레이 주식회사 유기 발광 표시 장치 및 이의 제조 방법
KR102431626B1 (ko) 2015-10-06 2022-08-11 삼성디스플레이 주식회사 발광 표시 장치 및 그 제조 방법
CN111081901A (zh) * 2018-11-26 2020-04-28 中国科学院苏州纳米技术与纳米仿生研究所 印刷电子器件的制备方法
WO2021251302A1 (ja) * 2020-06-10 2021-12-16 ダイキン工業株式会社 含フッ素化合物

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JPS5416203A (en) * 1977-07-07 1979-02-06 Nippon Paint Co Ltd Dry making method of photosensitive resin plate
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Publication number Priority date Publication date Assignee Title
JPS5416203A (en) * 1977-07-07 1979-02-06 Nippon Paint Co Ltd Dry making method of photosensitive resin plate
JPH09203803A (ja) * 1996-01-25 1997-08-05 Asahi Glass Co Ltd カラーフィルタの製造方法及びそれを用いた液晶表示素子
JP2004199086A (ja) * 1997-08-08 2004-07-15 Dainippon Printing Co Ltd パターン形成体およびパターン形成方法
JP2001237069A (ja) * 2000-02-23 2001-08-31 Dainippon Printing Co Ltd Ｅｌ素子およびその製造方法
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Also Published As

Publication number Publication date
WO2007120654A2 (en) 2007-10-25
CN101416327B (zh) 2011-01-19
KR101391082B1 (ko) 2014-04-30
KR20090034804A (ko) 2009-04-08
US20070218582A1 (en) 2007-09-20
US8124172B2 (en) 2012-02-28
EP2005498A4 (en) 2012-04-18
US20070205409A1 (en) 2007-09-06
EP2005498A2 (en) 2008-12-24
CN101416327A (zh) 2009-04-22
US8383192B2 (en) 2013-02-26
WO2007120654A3 (en) 2008-08-28
US20110183268A1 (en) 2011-07-28

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