KR101390624B1 - 위치 검출 장치, 임프린트 장치 및 위치 검출 방법 - Google Patents
위치 검출 장치, 임프린트 장치 및 위치 검출 방법 Download PDFInfo
- Publication number
- KR101390624B1 KR101390624B1 KR1020120066081A KR20120066081A KR101390624B1 KR 101390624 B1 KR101390624 B1 KR 101390624B1 KR 1020120066081 A KR1020120066081 A KR 1020120066081A KR 20120066081 A KR20120066081 A KR 20120066081A KR 101390624 B1 KR101390624 B1 KR 101390624B1
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- South Korea
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- diffraction grating
- optical system
- period
- light
- mold
- Prior art date
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
- B29D11/00—Producing optical elements, e.g. lenses or prisms
- B29D11/0074—Production of other optical elements not provided for in B29D11/00009- B29D11/0073
- B29D11/00769—Producing diffraction gratings
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7038—Alignment for proximity or contact printer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
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- G—PHYSICS
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- G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
- G01D5/347—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells using displacement encoding scales
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- G01D5/00—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable
- G01D5/26—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light
- G01D5/32—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light
- G01D5/34—Mechanical means for transferring the output of a sensing member; Means for converting the output of a sensing member to another variable where the form or nature of the sensing member does not constrain the means for converting; Transducers not specially adapted for a specific variable characterised by optical transfer means, i.e. using infrared, visible, or ultraviolet light with attenuation or whole or partial obturation of beams of light the beams of light being detected by photocells
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- G01D5/38—Forming the light into pulses by diffraction gratings
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
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- G—PHYSICS
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- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7069—Alignment mark illumination, e.g. darkfield, dual focus
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- G—PHYSICS
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49764—Method of mechanical manufacture with testing or indicating
- Y10T29/49769—Using optical instrument [excludes mere human eyeballing]
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Crystallography & Structural Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Mechanical Engineering (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Ophthalmology & Optometry (AREA)
- Health & Medical Sciences (AREA)
- Optics & Photonics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Optical Transform (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2011-137820 | 2011-06-21 | ||
| JP2011137820 | 2011-06-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120140622A KR20120140622A (ko) | 2012-12-31 |
| KR101390624B1 true KR101390624B1 (ko) | 2014-04-29 |
Family
ID=47362070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020120066081A Active KR101390624B1 (ko) | 2011-06-21 | 2012-06-20 | 위치 검출 장치, 임프린트 장치 및 위치 검출 방법 |
Country Status (3)
| Country | Link |
|---|---|
| US (2) | US8842294B2 (enExample) |
| JP (1) | JP5713961B2 (enExample) |
| KR (1) | KR101390624B1 (enExample) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2469339B1 (en) * | 2010-12-21 | 2017-08-30 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
| JP5706861B2 (ja) * | 2011-10-21 | 2015-04-22 | キヤノン株式会社 | 検出器、検出方法、インプリント装置及び物品製造方法 |
| DE102012221566A1 (de) * | 2012-11-26 | 2014-05-28 | Dr. Johannes Heidenhain Gmbh | Optische Positionsmesseinrichtung |
| JP6285666B2 (ja) * | 2013-09-03 | 2018-02-28 | キヤノン株式会社 | 検出装置、リソグラフィ装置、物品の製造方法及び検出方法 |
| JP6228420B2 (ja) * | 2013-10-08 | 2017-11-08 | キヤノン株式会社 | 検出装置、リソグラフィ装置、および物品の製造方法 |
| JP6097704B2 (ja) | 2014-01-06 | 2017-03-15 | キヤノン株式会社 | インプリント装置、インプリント方法及び物品の製造方法 |
| JP6701263B2 (ja) * | 2014-06-27 | 2020-05-27 | キヤノン株式会社 | 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法 |
| JP6341883B2 (ja) * | 2014-06-27 | 2018-06-13 | キヤノン株式会社 | 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法 |
| WO2016092697A1 (ja) * | 2014-12-12 | 2016-06-16 | キヤノン株式会社 | インプリント装置、インプリント方法及び物品の製造方法 |
| CN105807573B (zh) * | 2014-12-31 | 2017-12-29 | 上海微电子装备(集团)股份有限公司 | 用于套刻误差检测的装置和方法 |
| WO2016125790A1 (ja) * | 2015-02-05 | 2016-08-11 | 株式会社ニコン | 計測装置及び計測方法、露光装置及び露光方法、並びにデバイス製造方法 |
| JP6525628B2 (ja) * | 2015-02-13 | 2019-06-05 | キヤノン株式会社 | インプリント装置及び物品の製造方法 |
| CN104748686B (zh) * | 2015-04-21 | 2017-07-11 | 中国科学院光电技术研究所 | 一种利用小孔衍射波进行待测件定位的装置及方法 |
| JP2018517933A (ja) | 2015-06-05 | 2018-07-05 | エーエスエムエル ネザーランズ ビー.ブイ. | アライメントシステム |
| US10386737B2 (en) * | 2015-06-10 | 2019-08-20 | Canon Kabushiki Kaisha | Imprint apparatus and method for producing article |
| JP2018526812A (ja) * | 2015-06-15 | 2018-09-13 | ザイゴ コーポレーションZygo Corporation | 変形体の変位測定 |
| JP6570914B2 (ja) * | 2015-08-03 | 2019-09-04 | 東芝メモリ株式会社 | インプリント方法 |
| JP6632252B2 (ja) * | 2015-08-21 | 2020-01-22 | キヤノン株式会社 | 検出装置、インプリント装置、物品の製造方法及び照明光学系 |
| JP6685821B2 (ja) | 2016-04-25 | 2020-04-22 | キヤノン株式会社 | 計測装置、インプリント装置、物品の製造方法、光量決定方法、及び、光量調整方法 |
| JP6884515B2 (ja) * | 2016-05-10 | 2021-06-09 | キヤノン株式会社 | 位置検出方法、インプリント装置及び物品の製造方法 |
| JP6207671B1 (ja) * | 2016-06-01 | 2017-10-04 | キヤノン株式会社 | パターン形成装置、基板配置方法及び物品の製造方法 |
| JP2018005067A (ja) * | 2016-07-06 | 2018-01-11 | 日本電気株式会社 | アライメント用光学測定素子及び該光学測定素子を用いた光プローブのアライメント方法 |
| US9653404B1 (en) * | 2016-08-23 | 2017-05-16 | United Microelectronics Corp. | Overlay target for optically measuring overlay alignment of layers formed on semiconductor wafer |
| JP2018041774A (ja) * | 2016-09-05 | 2018-03-15 | キヤノン株式会社 | インプリント装置および物品製造方法 |
| JP6307730B1 (ja) * | 2016-09-29 | 2018-04-11 | 株式会社新川 | 半導体装置の製造方法、及び実装装置 |
| CA3044241A1 (en) | 2016-11-18 | 2018-05-24 | Magic Leap, Inc. | Waveguide light multiplexer using crossed gratings |
| JP6827785B2 (ja) * | 2016-11-30 | 2021-02-10 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品の製造方法 |
| CA3051239C (en) | 2017-01-23 | 2023-12-19 | Magic Leap, Inc. | Eyepiece for virtual, augmented, or mixed reality systems |
| JP6993782B2 (ja) * | 2017-03-09 | 2022-01-14 | キヤノン株式会社 | インプリント装置および物品製造方法 |
| JP7152877B2 (ja) * | 2017-06-15 | 2022-10-13 | キヤノン株式会社 | 検出装置、リソグラフィー装置および物品製造方法 |
| JP6937203B2 (ja) | 2017-09-14 | 2021-09-22 | キオクシア株式会社 | インプリント装置、インプリント方法および半導体装置の製造方法 |
| JP7057094B2 (ja) * | 2017-10-13 | 2022-04-19 | キヤノン株式会社 | 位置検出装置、インプリント装置および、物品製造方法 |
| AU2018386296B2 (en) | 2017-12-15 | 2023-11-23 | Magic Leap, Inc. | Eyepieces for augmented reality display system |
| JP7038562B2 (ja) | 2018-02-13 | 2022-03-18 | キヤノン株式会社 | 検出装置、リソグラフィ装置、および物品の製造方法 |
| JP7030569B2 (ja) * | 2018-03-12 | 2022-03-07 | キヤノン株式会社 | 位置検出装置、位置検出方法、インプリント装置及び物品の製造方法 |
| JP7182904B2 (ja) * | 2018-05-31 | 2022-12-05 | キヤノン株式会社 | 検出装置、インプリント装置、平坦化装置、検出方法及び物品製造方法 |
| US11237393B2 (en) | 2018-11-20 | 2022-02-01 | Magic Leap, Inc. | Eyepieces for augmented reality display system |
| JP7278828B2 (ja) * | 2019-03-26 | 2023-05-22 | キヤノン株式会社 | 成形方法、成形装置、インプリント方法、および物品の製造方法 |
| EP3987343A4 (en) | 2019-06-20 | 2023-07-19 | Magic Leap, Inc. | EYEWEARS FOR AUGMENTED REALITY DISPLAY SYSTEM |
| CN111336940B (zh) * | 2020-04-22 | 2020-09-29 | 福清市鸿远科技有限公司 | 一种火花塞用电极间隙测量调节装置 |
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| JP5713961B2 (ja) | 2015-05-07 |
| US20120328725A1 (en) | 2012-12-27 |
| US9283720B2 (en) | 2016-03-15 |
| US8842294B2 (en) | 2014-09-23 |
| JP2013030757A (ja) | 2013-02-07 |
| US20140346694A1 (en) | 2014-11-27 |
| KR20120140622A (ko) | 2012-12-31 |
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