KR101385167B1 - 프린트 회로판 - Google Patents

프린트 회로판 Download PDF

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Publication number
KR101385167B1
KR101385167B1 KR1020110135164A KR20110135164A KR101385167B1 KR 101385167 B1 KR101385167 B1 KR 101385167B1 KR 1020110135164 A KR1020110135164 A KR 1020110135164A KR 20110135164 A KR20110135164 A KR 20110135164A KR 101385167 B1 KR101385167 B1 KR 101385167B1
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KR
South Korea
Prior art keywords
layer
signal
capacitor
hole
power supply
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KR1020110135164A
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English (en)
Korean (ko)
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KR20120068716A (ko
Inventor
진 미야사카
Original Assignee
캐논 가부시끼가이샤
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Publication of KR20120068716A publication Critical patent/KR20120068716A/ko
Application granted granted Critical
Publication of KR101385167B1 publication Critical patent/KR101385167B1/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/0929—Conductive planes
    • H05K2201/09309—Core having two or more power planes; Capacitive laminate of two power planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10015—Non-printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10545—Related components mounted on both sides of the PCB

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Structure Of Printed Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
KR1020110135164A 2010-12-17 2011-12-15 프린트 회로판 Active KR101385167B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2010-281484 2010-12-17
JP2010281484A JP2012129443A (ja) 2010-12-17 2010-12-17 プリント回路板

Publications (2)

Publication Number Publication Date
KR20120068716A KR20120068716A (ko) 2012-06-27
KR101385167B1 true KR101385167B1 (ko) 2014-04-14

Family

ID=45093625

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110135164A Active KR101385167B1 (ko) 2010-12-17 2011-12-15 프린트 회로판

Country Status (5)

Country Link
US (1) US20120155043A1 (enExample)
EP (1) EP2466999A1 (enExample)
JP (1) JP2012129443A (enExample)
KR (1) KR101385167B1 (enExample)
CN (1) CN102548185B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20121847A1 (it) * 2012-10-30 2014-05-01 Freescale Semiconductor Inc Piastra a circuito stampato con ridotta emissione di radiazione elettro-magnetica
US9226386B2 (en) 2012-07-13 2015-12-29 Stmicroelectronics S.R.L. Printed circuit board with reduced emission of electro-magnetic radiation
JP6274880B2 (ja) * 2014-01-24 2018-02-07 オリンパス株式会社 固体撮像装置および撮像装置
JP6421467B2 (ja) * 2014-06-11 2018-11-14 株式会社リコー Ｅｍｉ対策用コンデンサの実装方法
JP6614903B2 (ja) 2014-11-04 2019-12-04 キヤノン株式会社 プリント回路板及びプリント配線板
JP6406423B2 (ja) * 2015-02-23 2018-10-17 株式会社村田製作所 電子部品
CN105975417A (zh) * 2016-05-05 2016-09-28 浪潮电子信息产业股份有限公司 一种信号复用的结构体、板卡及信号复用方法
US10477686B2 (en) 2017-07-26 2019-11-12 Canon Kabushiki Kaisha Printed circuit board
KR20190027141A (ko) * 2017-09-06 2019-03-14 삼성전자주식회사 인쇄 회로 기판 어셈블리
CN111123065B (zh) * 2018-10-30 2022-05-10 浙江宇视科技有限公司 印刷电路板布线检视方法及装置
WO2020170340A1 (ja) * 2019-02-19 2020-08-27 オリンパス株式会社 内視鏡先端構造、および内視鏡
US10707600B1 (en) * 2019-06-28 2020-07-07 Arista Networks, Inc. Systems with electrical isolation between signal and power domains
DE102020104571A1 (de) * 2020-02-21 2021-08-26 Schaeffler Technologies AG & Co. KG Leistungsumrichtersystem
JP2023045290A (ja) * 2021-09-21 2023-04-03 キオクシア株式会社 記憶装置
CN114269064B (zh) * 2021-12-03 2025-03-18 上海宏英智能科技股份有限公司 电源控制模块及电源控制模块的制备方法
CN114189980B (zh) * 2021-12-15 2024-06-11 摩尔线程智能科技(北京)有限责任公司 电路板组件
WO2024022449A1 (zh) * 2022-07-27 2024-02-01 摩尔线程智能科技(北京)有限责任公司 印刷电路板和包括印刷电路板的电子设备
CN115460761A (zh) * 2022-09-20 2022-12-09 四川九洲电器集团有限责任公司 一种电源低阻抗电路板及电源系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251805A (ja) * 2007-03-30 2008-10-16 Nec Corp 配線基板および半導体装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03109377U (enExample) * 1990-02-22 1991-11-11
JPH07235775A (ja) * 1994-02-21 1995-09-05 Mitsubishi Electric Corp 多層プリント配線基板
US6084779A (en) * 1998-10-02 2000-07-04 Sigrity, Inc. Ground and power patches on printed circuit board signal planes in the areas of integrated circuit chips
US6400576B1 (en) * 1999-04-05 2002-06-04 Sun Microsystems, Inc. Sub-package bypass capacitor mounting for an array packaged integrated circuit
US20030224546A1 (en) * 2002-05-30 2003-12-04 Chen Wenjun W. Method and apparatus for reducing noise in electrical power supplied to a semiconductor
WO2004111890A1 (ja) 2003-06-16 2004-12-23 Nec Corporation プリント回路配線基板設計支援装置及びプリント回路基板設計方法並びにそのプログラム
JP4273098B2 (ja) * 2004-09-07 2009-06-03 キヤノン株式会社 多層プリント回路板
JP2007250928A (ja) * 2006-03-17 2007-09-27 Mitsubishi Electric Corp 多層プリント配線板
US8059423B2 (en) * 2007-02-06 2011-11-15 Sanmina-Sci Corporation Enhanced localized distributive capacitance for circuit boards
US7957150B2 (en) * 2008-02-21 2011-06-07 Hitachi, Ltd. Support method and apparatus for printed circuit board

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008251805A (ja) * 2007-03-30 2008-10-16 Nec Corp 配線基板および半導体装置

Also Published As

Publication number Publication date
JP2012129443A (ja) 2012-07-05
EP2466999A1 (en) 2012-06-20
CN102548185A (zh) 2012-07-04
KR20120068716A (ko) 2012-06-27
CN102548185B (zh) 2015-01-07
US20120155043A1 (en) 2012-06-21

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