KR101368139B1 - 마이크로 전기 기계 시스템을 수리하기 위한 장치 및 방법 - Google Patents

마이크로 전기 기계 시스템을 수리하기 위한 장치 및 방법 Download PDF

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Publication number
KR101368139B1
KR101368139B1 KR1020107003286A KR20107003286A KR101368139B1 KR 101368139 B1 KR101368139 B1 KR 101368139B1 KR 1020107003286 A KR1020107003286 A KR 1020107003286A KR 20107003286 A KR20107003286 A KR 20107003286A KR 101368139 B1 KR101368139 B1 KR 101368139B1
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KR
South Korea
Prior art keywords
probe
probes
damaged
replacement
substrate
Prior art date
Application number
KR1020107003286A
Other languages
English (en)
Korean (ko)
Other versions
KR20100046011A (ko
Inventor
라크쉬미칸스 남부리
라피 가라베디안
Original Assignee
어드밴티스트 아메리카, 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어드밴티스트 아메리카, 인크. filed Critical 어드밴티스트 아메리카, 인크.
Publication of KR20100046011A publication Critical patent/KR20100046011A/ko
Application granted granted Critical
Publication of KR101368139B1 publication Critical patent/KR101368139B1/ko

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020107003286A 2007-07-16 2007-07-16 마이크로 전기 기계 시스템을 수리하기 위한 장치 및 방법 KR101368139B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2007/073579 WO2009011696A1 (en) 2007-07-16 2007-07-16 A device and method for reparing a microelectromechanical system

Publications (2)

Publication Number Publication Date
KR20100046011A KR20100046011A (ko) 2010-05-04
KR101368139B1 true KR101368139B1 (ko) 2014-03-12

Family

ID=40259889

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020107003286A KR101368139B1 (ko) 2007-07-16 2007-07-16 마이크로 전기 기계 시스템을 수리하기 위한 장치 및 방법

Country Status (3)

Country Link
JP (1) JP2010533861A (ja)
KR (1) KR101368139B1 (ja)
WO (1) WO2009011696A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9606142B2 (en) 2014-09-24 2017-03-28 International Business Machines Corporation Test probe substrate

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030113990A1 (en) 2001-12-19 2003-06-19 Formfactor, Inc. Microelectronic spring contact repair
KR20060131238A (ko) * 2005-06-15 2006-12-20 삼성전자주식회사 반도체 웨이퍼 검사용 프로브 카드

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07245330A (ja) * 1994-03-02 1995-09-19 Nippon Steel Corp 集積回路評価装置
US6121058A (en) * 1998-01-02 2000-09-19 Intel Corporation Method for removing accumulated solder from probe card probing features
JP2002031652A (ja) * 2000-07-17 2002-01-31 Ando Electric Co Ltd プローブカード、その修復方法及びその製造方法
US6523255B2 (en) * 2001-06-21 2003-02-25 International Business Machines Corporation Process and structure to repair damaged probes mounted on a space transformer
DE10297653T5 (de) * 2002-02-05 2005-04-14 Phicom Corp. Verfahren zum Herstellen eines elektrischen Kontaktbauteils zur Prüfung einer elektrischen Vorrichtung und ein elektrisches Kontaktbauteil
US20040189333A1 (en) * 2003-01-10 2004-09-30 Stephan Dobritz Carrier for receiving and electrically contacting individually separated dies
JP4849861B2 (ja) * 2005-10-11 2012-01-11 日本電子材料株式会社 プローブカード

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030113990A1 (en) 2001-12-19 2003-06-19 Formfactor, Inc. Microelectronic spring contact repair
US6777319B2 (en) * 2001-12-19 2004-08-17 Formfactor, Inc. Microelectronic spring contact repair
KR20060131238A (ko) * 2005-06-15 2006-12-20 삼성전자주식회사 반도체 웨이퍼 검사용 프로브 카드

Also Published As

Publication number Publication date
KR20100046011A (ko) 2010-05-04
WO2009011696A8 (en) 2010-03-18
JP2010533861A (ja) 2010-10-28
WO2009011696A1 (en) 2009-01-22

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