WO2009011696A8 - A device and method for reparing a microelectromechanical system - Google Patents

A device and method for reparing a microelectromechanical system

Info

Publication number
WO2009011696A8
WO2009011696A8 PCT/US2007/073579 US2007073579W WO2009011696A8 WO 2009011696 A8 WO2009011696 A8 WO 2009011696A8 US 2007073579 W US2007073579 W US 2007073579W WO 2009011696 A8 WO2009011696 A8 WO 2009011696A8
Authority
WO
Grant status
Application
Patent type
Prior art keywords
plurality
probe
probes
substrate
damaged
Prior art date
Application number
PCT/US2007/073579
Other languages
French (fr)
Other versions
WO2009011696A1 (en )
Inventor
Lakshmikanth Namburi
Raffi Garabedian
Original Assignee
Touchdown Technologies, Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • G01R1/06727Cantilever beams
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card

Abstract

A novel device and method for repairing MEMS systems, including probe cards for use in semiconductor testing is disclosed. In one embodiment, a probe card for use with a diagnostic computer for testing semiconductor wafers comprises a substrate, a plurality of operational probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer and a plurality of replacement probes connected to the substrate, wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. Also disclosed is a novel probe card that can be repaired. Specifically, a probe card for use with a diagnostic computer for testing semiconductor wafers, the probe card comprises a substrate and a plurality operational of probes connected to the substrate, wherein the plurality of operational probes are adapted to make an electrical connection with the diagnostic computer, and wherein the plurality of operational probes include a sacrificial material that is activated by applying a voltage. A method for removing a damaged probe from a probe card is also disclosed. The method removes a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and the plurality of operational probes comprises a sacrificial material that is activated by applying a voltage. The method comprises identifying the damaged probe, applying the voltage to the damaged probe, exposing the damaged probe to an etching solution and removing the damaged probe from the probe card. A second method for repairing a damaged probe from a probe card is also disclosed. The method repairs a damaged probe from a probe card that includes a plurality of operational probes connected to a substrate and a plurality of replacement probes connected to the substrate and wherein the plurality of operational probes and the plurality of replacement probes are constructed in substantially the same manufacturing process. The method comprising the steps of identifying the damaged probe, removing the damaged probe from the probe card, separating one of the plurality of replacement probes from the substrate, and installing the one probe separated from the plurality of replacement probes where the damaged probe was removed. Several refinements to these devices and methods are disclosed.
PCT/US2007/073579 2007-07-16 2007-07-16 A device and method for reparing a microelectromechanical system WO2009011696A8 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/US2007/073579 WO2009011696A8 (en) 2007-07-16 2007-07-16 A device and method for reparing a microelectromechanical system

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010516962A JP2010533861A (en) 2007-07-16 2007-07-16 Apparatus and method for repairing a microelectromechanical systems
KR20107003286A KR101368139B1 (en) 2007-07-16 2007-07-16 A device and method for repairing a microelectromechanical system
PCT/US2007/073579 WO2009011696A8 (en) 2007-07-16 2007-07-16 A device and method for reparing a microelectromechanical system

Publications (2)

Publication Number Publication Date
WO2009011696A1 true WO2009011696A1 (en) 2009-01-22
WO2009011696A8 true true WO2009011696A8 (en) 2010-03-18

Family

ID=40259889

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/073579 WO2009011696A8 (en) 2007-07-16 2007-07-16 A device and method for reparing a microelectromechanical system

Country Status (3)

Country Link
JP (1) JP2010533861A (en)
KR (1) KR101368139B1 (en)
WO (1) WO2009011696A8 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9606142B2 (en) 2014-09-24 2017-03-28 International Business Machines Corporation Test probe substrate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07245330A (en) * 1994-03-02 1995-09-19 Nippon Steel Corp Integrated circuit evaluating device
US6121058A (en) * 1998-01-02 2000-09-19 Intel Corporation Method for removing accumulated solder from probe card probing features
JP2002031652A (en) * 2000-07-17 2002-01-31 Ando Electric Co Ltd Probe card, its restoration method and its manufacturing method
US6523255B2 (en) * 2001-06-21 2003-02-25 International Business Machines Corporation Process and structure to repair damaged probes mounted on a space transformer
US6777319B2 (en) 2001-12-19 2004-08-17 Formfactor, Inc. Microelectronic spring contact repair
DE10297653T5 (en) * 2002-02-05 2005-04-14 Oug-Ki Lee A method of manufacturing an electrical contact element for testing an electrical device and an electrical contact element
US20040189333A1 (en) * 2003-01-10 2004-09-30 Stephan Dobritz Carrier for receiving and electrically contacting individually separated dies
KR20060131238A (en) * 2005-06-15 2006-12-20 삼성전자주식회사 Probe card for testing semiconductor wafer
JP4849861B2 (en) * 2005-10-11 2012-01-11 日本電子材料株式会社 Probe card

Also Published As

Publication number Publication date Type
JP2010533861A (en) 2010-10-28 application
WO2009011696A1 (en) 2009-01-22 application
KR20100046011A (en) 2010-05-04 application
KR101368139B1 (en) 2014-03-12 grant

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