KR101366441B1 - 기판 트레이 및 상기 트레이를 이용한 기판 처리 장치 - Google Patents

기판 트레이 및 상기 트레이를 이용한 기판 처리 장치 Download PDF

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KR101366441B1
KR101366441B1 KR1020120041377A KR20120041377A KR101366441B1 KR 101366441 B1 KR101366441 B1 KR 101366441B1 KR 1020120041377 A KR1020120041377 A KR 1020120041377A KR 20120041377 A KR20120041377 A KR 20120041377A KR 101366441 B1 KR101366441 B1 KR 101366441B1
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South Korea
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substrate
tray
board
main body
holding
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KR20120122905A (ko
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데쯔로 도다
신지 다까기
도모꼬 오사까
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캐논 아네르바 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67356—Closed carriers specially adapted for containing chips, dies or ICs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
KR1020120041377A 2011-04-28 2012-04-20 기판 트레이 및 상기 트레이를 이용한 기판 처리 장치 Active KR101366441B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011101645A JP5873251B2 (ja) 2011-04-28 2011-04-28 基板トレイ及び該トレイを用いた基板処理装置
JPJP-P-2011-101645 2011-04-28

Publications (2)

Publication Number Publication Date
KR20120122905A KR20120122905A (ko) 2012-11-07
KR101366441B1 true KR101366441B1 (ko) 2014-02-21

Family

ID=47055081

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120041377A Active KR101366441B1 (ko) 2011-04-28 2012-04-20 기판 트레이 및 상기 트레이를 이용한 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP5873251B2 (enExample)
KR (1) KR101366441B1 (enExample)
CN (1) CN102760679B (enExample)
TW (1) TWI503921B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023158555A1 (en) * 2022-02-18 2023-08-24 Applied Materials, Inc. Substrate carrier to control temperature of substrate

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6268198B2 (ja) * 2013-03-15 2018-01-24 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 基板用キャリア
GB201402126D0 (en) * 2014-02-07 2014-03-26 Spts Technologies Ltd Method of processing a substrate
US11756816B2 (en) 2019-07-26 2023-09-12 Applied Materials, Inc. Carrier FOUP and a method of placing a carrier
US11196360B2 (en) 2019-07-26 2021-12-07 Applied Materials, Inc. System and method for electrostatically chucking a substrate to a carrier
US10916464B1 (en) 2019-07-26 2021-02-09 Applied Materials, Inc. Method of pre aligning carrier, wafer and carrier-wafer combination for throughput efficiency
KR102829388B1 (ko) * 2020-01-14 2025-07-03 한국알박(주) 트레이용 마그넷 클램프
CN114054419B (zh) * 2021-11-17 2023-04-11 新美光(苏州)半导体科技有限公司 硅电极的清洗装置、清洗方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004134755A (ja) * 2002-07-11 2004-04-30 Asml Netherlands Bv 基板ホルダおよびデバイス製造方法
JP2005120410A (ja) * 2003-10-15 2005-05-12 Renesas Technology Corp 半導体装置の製造方法
JP2008171996A (ja) * 2007-01-11 2008-07-24 Ulvac Japan Ltd 搬送トレー及びこの搬送トレーを用いた真空処理装置
JP4428799B2 (ja) * 2000-04-03 2010-03-10 キヤノン株式会社 磁気支持機構、位置決め装置および半導体デバイス製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02229421A (ja) * 1989-03-02 1990-09-12 Sumitomo Electric Ind Ltd 露光装置
JP4121763B2 (ja) * 2002-04-08 2008-07-23 Ｔｄｋ株式会社 薄膜形成装置に対する基板の交換ユニットおよび基板交換方法
JP4386753B2 (ja) * 2004-02-19 2009-12-16 キヤノンアネルバ株式会社 ウェハーステージ及びプラズマ処理装置
KR100582036B1 (ko) * 2004-04-12 2006-05-22 주식회사 테라세미콘 반도체 제조공법 및 반도체 제조장치의 기판홀더
JP4576200B2 (ja) * 2004-10-21 2010-11-04 キヤノンアネルバ株式会社 基板処理装置及び基板処理装置におけるアーキング発生監視方法
JP2007281050A (ja) * 2006-04-04 2007-10-25 Miraial Kk 半導体ウエハのウエハトレイ
JP4699272B2 (ja) * 2006-04-27 2011-06-08 株式会社フジクラ 基板ホルダー
JP4997141B2 (ja) * 2008-02-21 2012-08-08 株式会社アルバック 真空処理装置、基板の温度制御方法
US20100151680A1 (en) * 2008-12-17 2010-06-17 Optisolar Inc. Substrate carrier with enhanced temperature uniformity
JP2010177267A (ja) * 2009-01-27 2010-08-12 Ulvac Japan Ltd 搬送トレー及びこの搬送トレーを用いた真空処理装置
JP2011023425A (ja) * 2009-07-13 2011-02-03 Canon Inc ステージ装置、露光装置及びデバイス製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4428799B2 (ja) * 2000-04-03 2010-03-10 キヤノン株式会社 磁気支持機構、位置決め装置および半導体デバイス製造方法
JP2004134755A (ja) * 2002-07-11 2004-04-30 Asml Netherlands Bv 基板ホルダおよびデバイス製造方法
JP2005120410A (ja) * 2003-10-15 2005-05-12 Renesas Technology Corp 半導体装置の製造方法
JP2008171996A (ja) * 2007-01-11 2008-07-24 Ulvac Japan Ltd 搬送トレー及びこの搬送トレーを用いた真空処理装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023158555A1 (en) * 2022-02-18 2023-08-24 Applied Materials, Inc. Substrate carrier to control temperature of substrate

Also Published As

Publication number Publication date
TW201306164A (zh) 2013-02-01
TWI503921B (zh) 2015-10-11
JP2012234930A (ja) 2012-11-29
CN102760679A (zh) 2012-10-31
CN102760679B (zh) 2015-07-15
JP5873251B2 (ja) 2016-03-01
KR20120122905A (ko) 2012-11-07

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