KR101347767B1 - 탐침 시스템의 개선된 위치설정 방법 및 장치 - Google Patents

탐침 시스템의 개선된 위치설정 방법 및 장치 Download PDF

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Publication number
KR101347767B1
KR101347767B1 KR1020087015435A KR20087015435A KR101347767B1 KR 101347767 B1 KR101347767 B1 KR 101347767B1 KR 1020087015435 A KR1020087015435 A KR 1020087015435A KR 20087015435 A KR20087015435 A KR 20087015435A KR 101347767 B1 KR101347767 B1 KR 101347767B1
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South Korea
Prior art keywords
component
delete delete
sensor
electrical contacts
coupled
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Expired - Fee Related
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KR1020087015435A
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English (en)
Korean (ko)
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KR20080093408A (ko
Inventor
유데이 나약
지아오란 장
조지 아스메롬
맥스 제다
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일렉트로글라스, 인코포레이티드
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Publication of KR20080093408A publication Critical patent/KR20080093408A/ko
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Tests Of Electronic Circuits (AREA)
KR1020087015435A 2006-01-18 2006-10-30 탐침 시스템의 개선된 위치설정 방법 및 장치 Expired - Fee Related KR101347767B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/335,367 2006-01-18
US11/335,367 US7368929B2 (en) 2006-01-18 2006-01-18 Methods and apparatuses for improved positioning in a probing system
PCT/US2006/042478 WO2007084206A1 (en) 2006-01-18 2006-10-30 Methods and apparatuses for improved positioning in a probing system

Publications (2)

Publication Number Publication Date
KR20080093408A KR20080093408A (ko) 2008-10-21
KR101347767B1 true KR101347767B1 (ko) 2014-01-10

Family

ID=38016442

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087015435A Expired - Fee Related KR101347767B1 (ko) 2006-01-18 2006-10-30 탐침 시스템의 개선된 위치설정 방법 및 장치

Country Status (6)

Country Link
US (2) US7368929B2 (enExample)
JP (1) JP2009524238A (enExample)
KR (1) KR101347767B1 (enExample)
CN (1) CN101297206A (enExample)
TW (1) TWI418819B (enExample)
WO (1) WO2007084206A1 (enExample)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202008013982U1 (de) * 2008-10-20 2009-01-08 Rosenberger Hochfrequenztechnik Gmbh & Co. Kg Messsystem zum Bestimmen von Streuparametern
WO2010082094A2 (en) * 2009-01-17 2010-07-22 Doublecheck Semiconductors Pte. Ltd. Method and apparatus for testing a semiconductor wafer
JP4886800B2 (ja) * 2009-02-26 2012-02-29 インターナショナル・ビジネス・マシーンズ・コーポレーション プローブカード、プローブカードの製造方法、プローバ装置
US8269514B2 (en) * 2009-08-25 2012-09-18 Formfactor, Inc. Method and apparatus for multilayer support substrate
WO2011062312A1 (ko) * 2009-11-23 2011-05-26 주식회사 쎄믹스 터치패드를 이용한 웨이퍼 프로버
US8519729B2 (en) 2010-02-10 2013-08-27 Sunpower Corporation Chucks for supporting solar cell in hot spot testing
JP5529605B2 (ja) * 2010-03-26 2014-06-25 東京エレクトロン株式会社 ウエハチャックの傾き補正方法及びプローブ装置
DE102011102791A1 (de) * 2011-05-27 2012-11-29 Feinmetall Gmbh Federkontaktstiftanordnung
US8963567B2 (en) 2011-10-31 2015-02-24 International Business Machines Corporation Pressure sensing and control for semiconductor wafer probing
US8875979B2 (en) * 2012-05-04 2014-11-04 Asm Technology Singapore Pte. Ltd. Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck
JP2014109531A (ja) * 2012-12-04 2014-06-12 Toshiba Corp 半導体検査装置および半導体検査方法
KR101415984B1 (ko) * 2013-05-16 2014-07-09 (주)에이젯 반도체 소자 테스트용 핸들러장치의 디바이스 컨택 제어방법
JP6280459B2 (ja) * 2014-06-27 2018-02-14 株式会社ディスコ テープ拡張装置
WO2016014906A1 (en) * 2014-07-24 2016-01-28 Nucleus Scientific, Inc. A measurement instrument for testing charge storage devices
US10481177B2 (en) * 2014-11-26 2019-11-19 Tokyo Seimitsu Co. Ltd. Wafer inspection method
CN104391139A (zh) * 2014-12-08 2015-03-04 大族激光科技产业集团股份有限公司 一种测试探针压力监控的方法及装置
US10363646B2 (en) * 2016-05-05 2019-07-30 Caterpillar Inc. Manufacturing fixture system and associated process having a rest pad force sensor with closed loop feedback
TWI676031B (zh) * 2018-09-06 2019-11-01 致茂電子股份有限公司 滑移式電子元件測試裝置
CN120009582A (zh) * 2019-02-21 2025-05-16 维耶尔公司 用于微装置检验的探针结构
TWI777740B (zh) * 2021-08-23 2022-09-11 鴻勁精密股份有限公司 校正裝置、校正方法及其應用之作業機
CN118837711B (zh) * 2024-06-17 2025-06-27 赛诺威盛科技(北京)股份有限公司 一种用于ct探测器ad转换板的检测方法、装置及系统

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6111421A (en) * 1997-10-20 2000-08-29 Tokyo Electron Limited Probe method and apparatus for inspecting an object
JP2001228212A (ja) 2000-02-15 2001-08-24 Tokyo Electron Ltd 針荷重測定方法、針荷重設定方法及び検査装置
JP2002075827A (ja) 2000-08-29 2002-03-15 Nikon Corp Ｘ線投影露光装置およびｘ線投影露光方法および半導体デバイス
US6583614B2 (en) * 2000-06-15 2003-06-24 Tokyo Electron Limited Inspection stage and inspection apparatus having a plurality of Z axes

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5197076A (en) * 1991-11-15 1993-03-23 Davis James G Temperature stabilizable laser apparatus
US5517128A (en) * 1993-01-05 1996-05-14 Sentech Instruments Gmbh Method and arrangement for charge carrier profiling in semiconductor structure by means of AFM scanning
TW399279B (en) 1997-05-08 2000-07-21 Tokyo Electron Limtied Prober and probe method
US6690284B2 (en) 1998-12-31 2004-02-10 Daito Corporation Method of controlling IC handler and control system using the same
JP3407192B2 (ja) * 1998-12-31 2003-05-19 株式会社ダイトー テストハンドの制御方法及び計測制御システム
JP2000260852A (ja) * 1999-03-11 2000-09-22 Tokyo Electron Ltd 検査ステージ及び検査装置
JP2001110857A (ja) 1999-10-06 2001-04-20 Tokyo Electron Ltd プローブ方法及びプローブ装置
JP4803959B2 (ja) * 2002-03-22 2011-10-26 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 試験プローブ整列装置
US7049577B2 (en) 2002-09-30 2006-05-23 Teradyne, Inc. Semiconductor handler interface auto alignment
JP2004152916A (ja) 2002-10-29 2004-05-27 Nec Corp 半導体デバイス検査装置及び検査方法
CN1726630A (zh) * 2002-12-16 2006-01-25 皇家飞利浦电子股份有限公司 以高定位精确度加工一个物体的装置
JP2005072143A (ja) 2003-08-21 2005-03-17 Tokyo Seimitsu Co Ltd プローブ装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6111421A (en) * 1997-10-20 2000-08-29 Tokyo Electron Limited Probe method and apparatus for inspecting an object
JP2001228212A (ja) 2000-02-15 2001-08-24 Tokyo Electron Ltd 針荷重測定方法、針荷重設定方法及び検査装置
US6583614B2 (en) * 2000-06-15 2003-06-24 Tokyo Electron Limited Inspection stage and inspection apparatus having a plurality of Z axes
JP2002075827A (ja) 2000-08-29 2002-03-15 Nikon Corp Ｘ線投影露光装置およびｘ線投影露光方法および半導体デバイス

Also Published As

Publication number Publication date
CN101297206A (zh) 2008-10-29
WO2007084206A1 (en) 2007-07-26
US20080150565A1 (en) 2008-06-26
US7368929B2 (en) 2008-05-06
US7852097B2 (en) 2010-12-14
KR20080093408A (ko) 2008-10-21
TW200736633A (en) 2007-10-01
JP2009524238A (ja) 2009-06-25
US20070164762A1 (en) 2007-07-19
TWI418819B (zh) 2013-12-11

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