TWI418819B - 探測系統之改良式定位方法及設備 - Google Patents
探測系統之改良式定位方法及設備 Download PDFInfo
- Publication number
- TWI418819B TWI418819B TW095141943A TW95141943A TWI418819B TW I418819 B TWI418819 B TW I418819B TW 095141943 A TW095141943 A TW 095141943A TW 95141943 A TW95141943 A TW 95141943A TW I418819 B TWI418819 B TW I418819B
- Authority
- TW
- Taiwan
- Prior art keywords
- sensor
- component
- parameter
- electrical contacts
- contact
- Prior art date
Links
- 238000012360 testing method Methods 0.000 claims description 30
- 238000000034 method Methods 0.000 claims description 23
- 230000008859 change Effects 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 4
- 235000012431 wafers Nutrition 0.000 description 67
- 239000000523 sample Substances 0.000 description 39
- 238000010586 diagram Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 7
- 238000001514 detection method Methods 0.000 description 6
- 239000010410 layer Substances 0.000 description 6
- 229910001374 Invar Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 2
- 108010053481 Antifreeze Proteins Proteins 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000005549 size reduction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
- Tests Of Electronic Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/335,367 US7368929B2 (en) | 2006-01-18 | 2006-01-18 | Methods and apparatuses for improved positioning in a probing system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200736633A TW200736633A (en) | 2007-10-01 |
| TWI418819B true TWI418819B (zh) | 2013-12-11 |
Family
ID=38016442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW095141943A TWI418819B (zh) | 2006-01-18 | 2006-11-13 | 探測系統之改良式定位方法及設備 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US7368929B2 (enExample) |
| JP (1) | JP2009524238A (enExample) |
| KR (1) | KR101347767B1 (enExample) |
| CN (1) | CN101297206A (enExample) |
| TW (1) | TWI418819B (enExample) |
| WO (1) | WO2007084206A1 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202008013982U1 (de) * | 2008-10-20 | 2009-01-08 | Rosenberger Hochfrequenztechnik Gmbh & Co. Kg | Messsystem zum Bestimmen von Streuparametern |
| WO2010082094A2 (en) * | 2009-01-17 | 2010-07-22 | Doublecheck Semiconductors Pte. Ltd. | Method and apparatus for testing a semiconductor wafer |
| JP4886800B2 (ja) * | 2009-02-26 | 2012-02-29 | インターナショナル・ビジネス・マシーンズ・コーポレーション | プローブカード、プローブカードの製造方法、プローバ装置 |
| US8269514B2 (en) * | 2009-08-25 | 2012-09-18 | Formfactor, Inc. | Method and apparatus for multilayer support substrate |
| WO2011062312A1 (ko) * | 2009-11-23 | 2011-05-26 | 주식회사 쎄믹스 | 터치패드를 이용한 웨이퍼 프로버 |
| US8519729B2 (en) * | 2010-02-10 | 2013-08-27 | Sunpower Corporation | Chucks for supporting solar cell in hot spot testing |
| JP5529605B2 (ja) * | 2010-03-26 | 2014-06-25 | 東京エレクトロン株式会社 | ウエハチャックの傾き補正方法及びプローブ装置 |
| DE102011102791A1 (de) * | 2011-05-27 | 2012-11-29 | Feinmetall Gmbh | Federkontaktstiftanordnung |
| US8963567B2 (en) | 2011-10-31 | 2015-02-24 | International Business Machines Corporation | Pressure sensing and control for semiconductor wafer probing |
| US8875979B2 (en) * | 2012-05-04 | 2014-11-04 | Asm Technology Singapore Pte. Ltd. | Apparatus and method for determining an alignment of a bondhead of a die bonder relative to a workchuck |
| JP2014109531A (ja) * | 2012-12-04 | 2014-06-12 | Toshiba Corp | 半導体検査装置および半導体検査方法 |
| KR101415984B1 (ko) * | 2013-05-16 | 2014-07-09 | (주)에이젯 | 반도체 소자 테스트용 핸들러장치의 디바이스 컨택 제어방법 |
| JP6280459B2 (ja) * | 2014-06-27 | 2018-02-14 | 株式会社ディスコ | テープ拡張装置 |
| CA2956172A1 (en) * | 2014-07-24 | 2016-01-28 | Nucleus Scientific, Inc. | A measurement instrument for testing charge storage devices |
| WO2016084147A1 (ja) * | 2014-11-26 | 2016-06-02 | 株式会社東京精密 | ウェーハの検査方法 |
| CN104391139A (zh) * | 2014-12-08 | 2015-03-04 | 大族激光科技产业集团股份有限公司 | 一种测试探针压力监控的方法及装置 |
| US10363646B2 (en) * | 2016-05-05 | 2019-07-30 | Caterpillar Inc. | Manufacturing fixture system and associated process having a rest pad force sensor with closed loop feedback |
| TWI676031B (zh) * | 2018-09-06 | 2019-11-01 | 致茂電子股份有限公司 | 滑移式電子元件測試裝置 |
| CN120009582A (zh) * | 2019-02-21 | 2025-05-16 | 维耶尔公司 | 用于微装置检验的探针结构 |
| TWI777740B (zh) * | 2021-08-23 | 2022-09-11 | 鴻勁精密股份有限公司 | 校正裝置、校正方法及其應用之作業機 |
| CN118837711B (zh) * | 2024-06-17 | 2025-06-27 | 赛诺威盛科技(北京)股份有限公司 | 一种用于ct探测器ad转换板的检测方法、装置及系统 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5197076A (en) * | 1991-11-15 | 1993-03-23 | Davis James G | Temperature stabilizable laser apparatus |
| US20010054892A1 (en) * | 2000-06-15 | 2001-12-27 | Kiyoshi Takekoshi | Inspection stage |
| US20020080041A1 (en) * | 1998-12-31 | 2002-06-27 | Tomonori Ohno | Method of controlling IC handler and control system using the same |
| EP1258733A1 (en) * | 1997-05-08 | 2002-11-20 | Tokyo Electron Limited | Prober and probe method |
| US20030117160A1 (en) * | 2000-02-15 | 2003-06-26 | Tokyo Electron Limited | Needle load measuring method, needle load setting method and needle load detecting mechanism |
| TW200416753A (en) * | 2002-12-16 | 2004-09-01 | Koninkl Philips Electronics Nv | Apparatus for processing an object with high position accurancy |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5517128A (en) * | 1993-01-05 | 1996-05-14 | Sentech Instruments Gmbh | Method and arrangement for charge carrier profiling in semiconductor structure by means of AFM scanning |
| US6111421A (en) * | 1997-10-20 | 2000-08-29 | Tokyo Electron Limited | Probe method and apparatus for inspecting an object |
| JP3407192B2 (ja) * | 1998-12-31 | 2003-05-19 | 株式会社ダイトー | テストハンドの制御方法及び計測制御システム |
| JP2000260852A (ja) * | 1999-03-11 | 2000-09-22 | Tokyo Electron Ltd | 検査ステージ及び検査装置 |
| JP2001110857A (ja) | 1999-10-06 | 2001-04-20 | Tokyo Electron Ltd | プローブ方法及びプローブ装置 |
| JP2002075827A (ja) * | 2000-08-29 | 2002-03-15 | Nikon Corp | Ｘ線投影露光装置およびｘ線投影露光方法および半導体デバイス |
| US7119566B2 (en) * | 2002-03-22 | 2006-10-10 | Electro Scientific Industries, Inc. | Test probe alignment apparatus |
| US7049577B2 (en) | 2002-09-30 | 2006-05-23 | Teradyne, Inc. | Semiconductor handler interface auto alignment |
| JP2004152916A (ja) | 2002-10-29 | 2004-05-27 | Nec Corp | 半導体デバイス検査装置及び検査方法 |
| JP2005072143A (ja) | 2003-08-21 | 2005-03-17 | Tokyo Seimitsu Co Ltd | プローブ装置 |
-
2006
- 2006-01-18 US US11/335,367 patent/US7368929B2/en not_active Expired - Fee Related
- 2006-10-30 KR KR1020087015435A patent/KR101347767B1/ko not_active Expired - Fee Related
- 2006-10-30 CN CNA2006800400582A patent/CN101297206A/zh active Pending
- 2006-10-30 JP JP2008551252A patent/JP2009524238A/ja active Pending
- 2006-10-30 WO PCT/US2006/042478 patent/WO2007084206A1/en not_active Ceased
- 2006-11-13 TW TW095141943A patent/TWI418819B/zh not_active IP Right Cessation
-
2008
- 2008-03-04 US US12/042,294 patent/US7852097B2/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5197076A (en) * | 1991-11-15 | 1993-03-23 | Davis James G | Temperature stabilizable laser apparatus |
| EP1258733A1 (en) * | 1997-05-08 | 2002-11-20 | Tokyo Electron Limited | Prober and probe method |
| US20020080041A1 (en) * | 1998-12-31 | 2002-06-27 | Tomonori Ohno | Method of controlling IC handler and control system using the same |
| US20030117160A1 (en) * | 2000-02-15 | 2003-06-26 | Tokyo Electron Limited | Needle load measuring method, needle load setting method and needle load detecting mechanism |
| US20010054892A1 (en) * | 2000-06-15 | 2001-12-27 | Kiyoshi Takekoshi | Inspection stage |
| TW200416753A (en) * | 2002-12-16 | 2004-09-01 | Koninkl Philips Electronics Nv | Apparatus for processing an object with high position accurancy |
Also Published As
| Publication number | Publication date |
|---|---|
| US7368929B2 (en) | 2008-05-06 |
| US20070164762A1 (en) | 2007-07-19 |
| CN101297206A (zh) | 2008-10-29 |
| TW200736633A (en) | 2007-10-01 |
| KR101347767B1 (ko) | 2014-01-10 |
| JP2009524238A (ja) | 2009-06-25 |
| US20080150565A1 (en) | 2008-06-26 |
| US7852097B2 (en) | 2010-12-14 |
| WO2007084206A1 (en) | 2007-07-26 |
| KR20080093408A (ko) | 2008-10-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |