KR101333138B1 - 유기 발광 장치의 제조 방법, 무기막 전사용 기판 및 유기 발광 장치 - Google Patents

유기 발광 장치의 제조 방법, 무기막 전사용 기판 및 유기 발광 장치 Download PDF

Info

Publication number
KR101333138B1
KR101333138B1 KR1020120022519A KR20120022519A KR101333138B1 KR 101333138 B1 KR101333138 B1 KR 101333138B1 KR 1020120022519 A KR1020120022519 A KR 1020120022519A KR 20120022519 A KR20120022519 A KR 20120022519A KR 101333138 B1 KR101333138 B1 KR 101333138B1
Authority
KR
South Korea
Prior art keywords
substrate
film
inorganic
light emitting
organic light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020120022519A
Other languages
English (en)
Korean (ko)
Other versions
KR20130101397A (ko
Inventor
박진우
Original Assignee
삼성디스플레이 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성디스플레이 주식회사 filed Critical 삼성디스플레이 주식회사
Priority to KR1020120022519A priority Critical patent/KR101333138B1/ko
Priority to US13/607,638 priority patent/US8791452B2/en
Priority to TW101138986A priority patent/TW201338233A/zh
Priority to EP12192714.9A priority patent/EP2637230B1/en
Priority to EP20130187260 priority patent/EP2682998A1/en
Priority to CN2013200781651U priority patent/CN203312371U/zh
Priority to CN201310054330.4A priority patent/CN103311457B/zh
Priority to JP2013036371A priority patent/JP6080613B2/ja
Publication of KR20130101397A publication Critical patent/KR20130101397A/ko
Application granted granted Critical
Publication of KR101333138B1 publication Critical patent/KR101333138B1/ko
Priority to US14/341,663 priority patent/US9343703B2/en
Priority to JP2017005785A priority patent/JP6559166B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
    • C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
    • C03C17/42—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating of an organic material and at least one non-metal coating
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
    • C03C27/06—Joining glass to glass by processes other than fusing
    • C03C27/10—Joining glass to glass by processes other than fusing with the aid of adhesive specially adapted for that purpose
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/13—Semiconductor regions connected to electrodes carrying current to be rectified, amplified or switched, e.g. source or drain regions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C2218/00—Methods for coating glass
    • C03C2218/30—Aspects of methods for coating glass not covered above
    • C03C2218/34—Masking
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H10K50/81—Anodes
    • H10K50/816—Multilayers, e.g. transparent multilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Inorganic Chemistry (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020120022519A 2012-03-05 2012-03-05 유기 발광 장치의 제조 방법, 무기막 전사용 기판 및 유기 발광 장치 Active KR101333138B1 (ko)

Priority Applications (10)

Application Number Priority Date Filing Date Title
KR1020120022519A KR101333138B1 (ko) 2012-03-05 2012-03-05 유기 발광 장치의 제조 방법, 무기막 전사용 기판 및 유기 발광 장치
US13/607,638 US8791452B2 (en) 2012-03-05 2012-09-07 Method of preparing organic light-emitting device, substrate for transiting inorganic layer, and organic light-emitting device
TW101138986A TW201338233A (zh) 2012-03-05 2012-10-23 準備有機發光裝置之方法、用於無機層轉移之基板及有機發光裝置
EP20130187260 EP2682998A1 (en) 2012-03-05 2012-11-15 Method of preparing organic light-emitting device, substrate for transiting inorganic layer, and organic light-emitting device
EP12192714.9A EP2637230B1 (en) 2012-03-05 2012-11-15 Method of preparing organic light-emitting device
CN201310054330.4A CN103311457B (zh) 2012-03-05 2013-02-20 用于转变无机层的基板、有机发光装置及其制备方法
CN2013200781651U CN203312371U (zh) 2012-03-05 2013-02-20 用于转变无机层的基板及有机发光装置
JP2013036371A JP6080613B2 (ja) 2012-03-05 2013-02-26 有機発光装置の製造方法、無機膜転写用基板及び有機発光装置
US14/341,663 US9343703B2 (en) 2012-03-05 2014-07-25 Organic light-emitting device having low temperature viscosity transition (LVT) inorganic material
JP2017005785A JP6559166B2 (ja) 2012-03-05 2017-01-17 有機発光装置の製造方法、無機膜転写用基板及び有機発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120022519A KR101333138B1 (ko) 2012-03-05 2012-03-05 유기 발광 장치의 제조 방법, 무기막 전사용 기판 및 유기 발광 장치

Publications (2)

Publication Number Publication Date
KR20130101397A KR20130101397A (ko) 2013-09-13
KR101333138B1 true KR101333138B1 (ko) 2013-11-26

Family

ID=47191603

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120022519A Active KR101333138B1 (ko) 2012-03-05 2012-03-05 유기 발광 장치의 제조 방법, 무기막 전사용 기판 및 유기 발광 장치

Country Status (6)

Country Link
US (2) US8791452B2 (enExample)
EP (2) EP2682998A1 (enExample)
JP (2) JP6080613B2 (enExample)
KR (1) KR101333138B1 (enExample)
CN (2) CN103311457B (enExample)
TW (1) TW201338233A (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102051103B1 (ko) * 2012-11-07 2019-12-03 삼성디스플레이 주식회사 유기 발광 표시 장치
KR101971202B1 (ko) * 2012-11-22 2019-04-23 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
KR101473310B1 (ko) * 2012-12-06 2014-12-16 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조방법
KR102033612B1 (ko) * 2012-12-27 2019-10-17 엘지디스플레이 주식회사 유기전계발광표시장치 및 이의 제조방법
KR102103421B1 (ko) * 2013-02-07 2020-04-23 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR20140120541A (ko) * 2013-04-03 2014-10-14 삼성디스플레이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR102072805B1 (ko) * 2013-04-15 2020-02-04 삼성디스플레이 주식회사 유기발광표시장치 및 그의 제조방법
KR101784468B1 (ko) 2014-05-23 2017-10-12 삼성디스플레이 주식회사 유기 발광 디스플레이 장치 및 그 제조방법
KR102409748B1 (ko) 2015-07-28 2022-06-17 삼성전자주식회사 반도체 장치 및 그 제조 방법
CN105742327B (zh) * 2016-02-15 2018-12-07 京东方科技集团股份有限公司 一种oled显示装置及其制备方法
JPWO2018042960A1 (ja) * 2016-09-01 2019-03-22 双葉電子工業株式会社 有機ｅｌ表示装置
JP6405073B1 (ja) * 2017-10-26 2018-10-17 堺ディスプレイプロダクト株式会社 フレキシブルｏｌｅｄデバイスの製造方法および製造装置
WO2019082357A1 (ja) * 2017-10-26 2019-05-02 堺ディスプレイプロダクト株式会社 フレキシブルｏｌｅｄデバイスの製造方法および製造装置
JP6556417B1 (ja) * 2017-12-26 2019-08-07 堺ディスプレイプロダクト株式会社 有機ｅｌ表示装置およびその製造方法
CN108365117A (zh) * 2018-01-31 2018-08-03 昆山国显光电有限公司 封装结构与封装方法及封装结构制备装置
JP6556298B2 (ja) * 2018-06-15 2019-08-07 堺ディスプレイプロダクト株式会社 フレキシブルｏｌｅｄデバイスの製造方法および製造装置
JP7314658B2 (ja) * 2018-07-30 2023-07-26 三菱マテリアル株式会社 低α線放出量の酸化第一錫の製造方法
KR102775871B1 (ko) * 2019-12-04 2025-03-07 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
KR20240040311A (ko) * 2022-09-21 2024-03-28 엘지디스플레이 주식회사 전계 발광 표시 장치

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100064870A (ko) * 2008-12-05 2010-06-15 엘지디스플레이 주식회사 유기전계 발광 표시장치 및 그 제조방법
KR20100081773A (ko) * 2009-01-07 2010-07-15 삼성모바일디스플레이주식회사 유기 발광 표시 장치
KR20110067411A (ko) * 2009-12-14 2011-06-22 삼성모바일디스플레이주식회사 유기 발광 장치 및 이의 제조 방법
KR20110130928A (ko) * 2010-05-28 2011-12-06 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 이의 제조 방법

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6664137B2 (en) * 2001-03-29 2003-12-16 Universal Display Corporation Methods and structures for reducing lateral diffusion through cooperative barrier layers
US7268486B2 (en) 2002-04-15 2007-09-11 Schott Ag Hermetic encapsulation of organic, electro-optical elements
KR100942038B1 (ko) 2002-04-15 2010-02-11 쇼오트 아게 유기 광전 소자 및 유기 광전 소자 제조 방법
AU2003261188A1 (en) * 2002-07-24 2004-02-09 Adhesives Research, Inc. Transformable pressure sensitive adhesive tape and use thereof in display screens
US20040229051A1 (en) 2003-05-15 2004-11-18 General Electric Company Multilayer coating package on flexible substrates for electro-optical devices
US20040048033A1 (en) * 2002-09-11 2004-03-11 Osram Opto Semiconductors (Malaysia) Sdn. Bhd. Oled devices with improved encapsulation
US7018713B2 (en) * 2003-04-02 2006-03-28 3M Innovative Properties Company Flexible high-temperature ultrabarrier
JP2005011794A (ja) * 2003-05-22 2005-01-13 Tohoku Pioneer Corp 有機ｅｌパネル及びその製造方法
JP2005044613A (ja) * 2003-07-28 2005-02-17 Seiko Epson Corp 発光装置の製造方法および発光装置
KR100563057B1 (ko) 2003-11-14 2006-03-24 삼성에스디아이 주식회사 초박형 유기 전계 발광 표시장치 및 그 제조방법
KR100615228B1 (ko) * 2004-06-29 2006-08-25 삼성에스디아이 주식회사 흡습 능력이 개선된 유기 전계 발광 소자 및 그 제조방법
JP2006049308A (ja) * 2004-08-04 2006-02-16 Samsung Electronics Co Ltd 表示装置、その製造方法、及びその製造装置
JP2006253055A (ja) * 2005-03-14 2006-09-21 Toppan Printing Co Ltd 有機エレクトロルミネッセンス素子用フレキシブル基板及びそれを用いた有機エレクトロルミネッセンス素子
US7722929B2 (en) 2005-08-18 2010-05-25 Corning Incorporated Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device
US20080206589A1 (en) * 2007-02-28 2008-08-28 Bruce Gardiner Aitken Low tempertature sintering using Sn2+ containing inorganic materials to hermetically seal a device
US20070040501A1 (en) 2005-08-18 2007-02-22 Aitken Bruce G Method for inhibiting oxygen and moisture degradation of a device and the resulting device
KR101296415B1 (ko) * 2005-08-25 2013-08-13 아사히 가라스 가부시키가이샤 막 부착 기체 및 막 형성용 유리
JP2007113043A (ja) * 2005-10-19 2007-05-10 Konica Minolta Holdings Inc ガスバリア性薄膜積層体、ガスバリア性樹脂基材とそれを用いた有機エレクトロルミネッセンスデバイス
JP5178204B2 (ja) * 2005-12-06 2013-04-10 コーニング インコーポレイテッド フリットで密封されたガラスパッケージおよびその製造方法
JP4624309B2 (ja) * 2006-01-24 2011-02-02 三星モバイルディスプレイ株式會社 有機電界発光表示装置及びその製造方法
JP2007277631A (ja) * 2006-04-06 2007-10-25 Konica Minolta Holdings Inc ガスバリア性薄膜積層体の製造方法、ガスバリア性薄膜積層体、ガスバリア性樹脂基材及び有機エレクトロルミネッセンスデバイス
US20080048178A1 (en) 2006-08-24 2008-02-28 Bruce Gardiner Aitken Tin phosphate barrier film, method, and apparatus
US7615506B2 (en) 2006-10-06 2009-11-10 Corning Incorporated Durable tungsten-doped tin-fluorophosphate glasses
JP4809186B2 (ja) * 2006-10-26 2011-11-09 京セラ株式会社 有機ｅｌディスプレイおよびその製造方法
US8115326B2 (en) 2006-11-30 2012-02-14 Corning Incorporated Flexible substrates having a thin-film barrier
KR20080051756A (ko) * 2006-12-06 2008-06-11 삼성에스디아이 주식회사 유기 발광 표시 장치 및 그 제조 방법
KR20080055243A (ko) * 2006-12-15 2008-06-19 삼성전자주식회사 유기 발광 표시 장치 및 그 제조방법
US20080290798A1 (en) 2007-05-22 2008-11-27 Mark Alejandro Quesada LLT barrier layer for top emission display device, method and apparatus
JP2009047879A (ja) * 2007-08-20 2009-03-05 Seiko Epson Corp 有機エレクトロルミネッセンス装置及びその製造方法、電子機器
JP2009076232A (ja) * 2007-09-19 2009-04-09 Fujifilm Corp 環境感受性デバイス、環境感受性素子の封止方法
EP2309823A4 (en) * 2008-08-05 2012-08-08 Toray Industries METHOD OF MANUFACTURING THE DEVICE
JP2010121144A (ja) * 2008-11-17 2010-06-03 Seiko Epson Corp 成膜装置
US8084380B2 (en) 2009-02-27 2011-12-27 Corning Incorporated Transition metal doped Sn phosphate glass
JP2010244694A (ja) * 2009-04-01 2010-10-28 Seiko Epson Corp 有機ｅｌ装置、電子機器
US8440479B2 (en) * 2009-05-28 2013-05-14 Corning Incorporated Method for forming an organic light emitting diode device
JP2011018686A (ja) * 2009-07-07 2011-01-27 Hitachi Displays Ltd 有機ｅｌ表示装置
KR101074806B1 (ko) * 2009-12-10 2011-10-19 삼성모바일디스플레이주식회사 유기 발광 디스플레이 장치 및 그 제조 방법
KR101108161B1 (ko) * 2009-12-24 2012-01-31 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 그 제조방법
KR101084180B1 (ko) * 2009-12-28 2011-11-17 삼성모바일디스플레이주식회사 편광판 및 이를 구비한 유기 발광 디스플레이 장치
WO2011114335A1 (en) 2010-03-17 2011-09-22 Hanita Coatings R.C.A. Ltd Polymeric substrate with laminated glass layer
JP5988974B2 (ja) * 2010-08-07 2016-09-07 ティーピーケイ ホールディング カンパニー リミテッド 表面埋込添加物を有する素子構成要素および関連製造方法
EP2445029A1 (en) * 2010-10-25 2012-04-25 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Multilayered protective layer, organic opto-electric device and method of manufacturing the same
KR101521114B1 (ko) * 2010-12-03 2015-05-19 엘지디스플레이 주식회사 유기전계발광 표시장치 및 그 제조 방법
US20130330531A1 (en) * 2012-06-06 2013-12-12 Cheil Industries, Inc. Barrier stacks and methods of making the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100064870A (ko) * 2008-12-05 2010-06-15 엘지디스플레이 주식회사 유기전계 발광 표시장치 및 그 제조방법
KR20100081773A (ko) * 2009-01-07 2010-07-15 삼성모바일디스플레이주식회사 유기 발광 표시 장치
KR20110067411A (ko) * 2009-12-14 2011-06-22 삼성모바일디스플레이주식회사 유기 발광 장치 및 이의 제조 방법
KR20110130928A (ko) * 2010-05-28 2011-12-06 삼성모바일디스플레이주식회사 유기 발광 표시 장치 및 이의 제조 방법

Also Published As

Publication number Publication date
JP2017063064A (ja) 2017-03-30
JP2013187191A (ja) 2013-09-19
US9343703B2 (en) 2016-05-17
US20140332785A1 (en) 2014-11-13
CN203312371U (zh) 2013-11-27
US20130228754A1 (en) 2013-09-05
JP6559166B2 (ja) 2019-08-14
CN103311457A (zh) 2013-09-18
JP6080613B2 (ja) 2017-02-15
KR20130101397A (ko) 2013-09-13
CN103311457B (zh) 2017-09-12
US8791452B2 (en) 2014-07-29
EP2637230B1 (en) 2017-01-11
TW201338233A (zh) 2013-09-16
EP2637230A1 (en) 2013-09-11
EP2682998A1 (en) 2014-01-08

Similar Documents

Publication Publication Date Title
KR101333138B1 (ko) 유기 발광 장치의 제조 방법, 무기막 전사용 기판 및 유기 발광 장치
KR101503401B1 (ko) 유기 발광 장치의 제조 방법
KR101931177B1 (ko) 유기 발광 표시 장치
JP6343026B2 (ja) 封止用積層体、有機発光装置及びこれらの製造方法
KR101347541B1 (ko) 유기 발광 장치의 제조 방법
KR102036327B1 (ko) 유기발광장치 및 그 제조방법
KR102072805B1 (ko) 유기발광표시장치 및 그의 제조방법
KR20150016780A (ko) 유기 발광 표시 장치 및 그 제조 방법
CN104701347A (zh) 有机场致发光装置及其制造方法
KR20150043402A (ko) 광전자 컴포넌트를 생성하기 위한 방법 및 유기 광전자 컴포넌트를 패터닝하기 위한 방법
US9825246B2 (en) Process for producing an optoelectronic component and optoelectronic component
KR102048927B1 (ko) 유기 발광 표시 장치 및 그의 제조 방법
US10068958B2 (en) Organic light-emitting component and method for producing an organic light-emitting component
KR20170038003A (ko) 광전자 컴포넌트의 제조 방법
JP2013153073A (ja) 電子デバイス及び配線形成方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

N231 Notification of change of applicant
PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20171101

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

FPAY Annual fee payment

Payment date: 20191028

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13