KR101322198B1 - 박막형성방법 및 박막형성장치 - Google Patents

박막형성방법 및 박막형성장치 Download PDF

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Publication number
KR101322198B1
KR101322198B1 KR1020120071653A KR20120071653A KR101322198B1 KR 101322198 B1 KR101322198 B1 KR 101322198B1 KR 1020120071653 A KR1020120071653 A KR 1020120071653A KR 20120071653 A KR20120071653 A KR 20120071653A KR 101322198 B1 KR101322198 B1 KR 101322198B1
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KR
South Korea
Prior art keywords
thin film
substrate
film material
light source
nozzle
Prior art date
Application number
KR1020120071653A
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English (en)
Korean (ko)
Other versions
KR20130006316A (ko
Inventor
게이지 이소
Original Assignee
스미도모쥬기가이고교 가부시키가이샤
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Filing date
Publication date
Priority claimed from JP2012096653A external-priority patent/JP2013233472A/ja
Application filed by 스미도모쥬기가이고교 가부시키가이샤 filed Critical 스미도모쥬기가이고교 가부시키가이샤
Publication of KR20130006316A publication Critical patent/KR20130006316A/ko
Application granted granted Critical
Publication of KR101322198B1 publication Critical patent/KR101322198B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
    • B05C5/005—Curtain coaters
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
    • B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Power Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020120071653A 2011-07-08 2012-07-02 박막형성방법 및 박막형성장치 KR101322198B1 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2011152040 2011-07-08
JPJP-P-2011-152040 2011-07-08
JPJP-P-2011-164874 2011-07-27
JP2011164874 2011-07-27
JPJP-P-2012-090186 2012-04-11
JP2012090186 2012-04-11
JPJP-P-2012-096653 2012-04-20
JP2012096653A JP2013233472A (ja) 2011-07-27 2012-04-20 薄膜形成方法及び薄膜形成装置

Publications (2)

Publication Number Publication Date
KR20130006316A KR20130006316A (ko) 2013-01-16
KR101322198B1 true KR101322198B1 (ko) 2013-10-28

Family

ID=47440986

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020120071653A KR101322198B1 (ko) 2011-07-08 2012-07-02 박막형성방법 및 박막형성장치

Country Status (3)

Country Link
KR (1) KR101322198B1 (zh)
CN (1) CN102861706B (zh)
TW (1) TWI471908B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6156633B2 (ja) * 2013-06-28 2017-07-05 住友重機械工業株式会社 薄膜形成方法及び薄膜形成装置
JP6085578B2 (ja) * 2014-03-11 2017-02-22 住友重機械工業株式会社 膜形成方法及び膜形成装置
CN106914392A (zh) * 2017-05-09 2017-07-04 宁波视睿迪光电有限公司 一种uv固化机及3d显示器固化装置
CN109720104A (zh) * 2019-03-13 2019-05-07 苏州星烁纳米科技有限公司 用于制备量子点滤色器的喷墨打印设备
CN109720105A (zh) * 2019-03-13 2019-05-07 苏州星烁纳米科技有限公司 用于打印量子点胶液的喷头
CN117062324A (zh) * 2023-08-10 2023-11-14 淮安特创科技有限公司 一种自动调整蚀刻药水浓度和线速装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004170526A (ja) 2002-11-18 2004-06-17 Tokyo Electron Ltd 液晶表示素子の製造方法及び液晶表示素子の製造装置
JP2006289226A (ja) 2005-04-08 2006-10-26 Seiko Epson Corp 成膜方法および電気回路の製造方法、並びに液滴吐出装置
JP2008073647A (ja) * 2006-09-22 2008-04-03 Fujifilm Corp 液体吐出装置及びレジストパターン形成方法
JP2008203485A (ja) * 2007-02-20 2008-09-04 Epson Imaging Devices Corp 液晶装置の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030049377A1 (en) * 2001-09-11 2003-03-13 Chesnut W. Richard Machine and method for making a rotogravure printing medium
JP2005505441A (ja) * 2001-10-08 2005-02-24 カリフォルニア インスティテュート オブ テクノロジー 微小加工レンズ、その製造の方法および応用
US7510277B2 (en) * 2004-03-01 2009-03-31 Fujifilm Corporation Image forming apparatus and method
CN101626881B (zh) * 2007-01-17 2012-11-14 3D系统公司 用于固体成像的成像器组件与方法
CN101585233B (zh) * 2009-06-24 2011-06-22 唐少林 冰光固化快速成型装置及其使用方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004170526A (ja) 2002-11-18 2004-06-17 Tokyo Electron Ltd 液晶表示素子の製造方法及び液晶表示素子の製造装置
JP2006289226A (ja) 2005-04-08 2006-10-26 Seiko Epson Corp 成膜方法および電気回路の製造方法、並びに液滴吐出装置
JP2008073647A (ja) * 2006-09-22 2008-04-03 Fujifilm Corp 液体吐出装置及びレジストパターン形成方法
JP2008203485A (ja) * 2007-02-20 2008-09-04 Epson Imaging Devices Corp 液晶装置の製造方法

Also Published As

Publication number Publication date
CN102861706A (zh) 2013-01-09
KR20130006316A (ko) 2013-01-16
TW201314741A (zh) 2013-04-01
CN102861706B (zh) 2015-09-30
TWI471908B (zh) 2015-02-01

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