KR101306751B1 - 기판 지지용 홀더 및 이를 사용한 기판 처리 장치 - Google Patents

기판 지지용 홀더 및 이를 사용한 기판 처리 장치 Download PDF

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Publication number
KR101306751B1
KR101306751B1 KR1020110041160A KR20110041160A KR101306751B1 KR 101306751 B1 KR101306751 B1 KR 101306751B1 KR 1020110041160 A KR1020110041160 A KR 1020110041160A KR 20110041160 A KR20110041160 A KR 20110041160A KR 101306751 B1 KR101306751 B1 KR 101306751B1
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KR
South Korea
Prior art keywords
substrate
support
holder
support plate
processing apparatus
Prior art date
Application number
KR1020110041160A
Other languages
English (en)
Korean (ko)
Other versions
KR20120122795A (ko
Inventor
허관선
박주영
조병호
Original Assignee
주식회사 테라세미콘
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 테라세미콘 filed Critical 주식회사 테라세미콘
Priority to KR1020110041160A priority Critical patent/KR101306751B1/ko
Priority to CN201280020720.3A priority patent/CN103493195A/zh
Priority to JP2014508297A priority patent/JP2014512700A/ja
Priority to PCT/KR2012/003338 priority patent/WO2012148237A2/ko
Publication of KR20120122795A publication Critical patent/KR20120122795A/ko
Application granted granted Critical
Publication of KR101306751B1 publication Critical patent/KR101306751B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Nonlinear Science (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
KR1020110041160A 2011-04-29 2011-04-29 기판 지지용 홀더 및 이를 사용한 기판 처리 장치 KR101306751B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020110041160A KR101306751B1 (ko) 2011-04-29 2011-04-29 기판 지지용 홀더 및 이를 사용한 기판 처리 장치
CN201280020720.3A CN103493195A (zh) 2011-04-29 2012-04-30 基板支撑用的支撑板以及使用该支撑板的基板处理装置
JP2014508297A JP2014512700A (ja) 2011-04-29 2012-04-30 基板支持用ホルダ及び該ホルダを用いた基板処理装置
PCT/KR2012/003338 WO2012148237A2 (ko) 2011-04-29 2012-04-30 기판 지지용 홀더 및 이를 사용한 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110041160A KR101306751B1 (ko) 2011-04-29 2011-04-29 기판 지지용 홀더 및 이를 사용한 기판 처리 장치

Publications (2)

Publication Number Publication Date
KR20120122795A KR20120122795A (ko) 2012-11-07
KR101306751B1 true KR101306751B1 (ko) 2013-09-10

Family

ID=47072959

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110041160A KR101306751B1 (ko) 2011-04-29 2011-04-29 기판 지지용 홀더 및 이를 사용한 기판 처리 장치

Country Status (4)

Country Link
JP (1) JP2014512700A (zh)
KR (1) KR101306751B1 (zh)
CN (1) CN103493195A (zh)
WO (1) WO2012148237A2 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105068282A (zh) * 2015-08-25 2015-11-18 太仓金马金属构件有限公司 液晶面板生产支架
CN108034929A (zh) * 2017-12-27 2018-05-15 深圳市华星光电技术有限公司 一种应用于真空溅射设备的基板承载装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050094685A (ko) * 2004-03-24 2005-09-28 삼성전자주식회사 반도체 검사장치용 프로브 카드홀더
KR20060019777A (ko) * 2004-08-30 2006-03-06 삼성전자주식회사 기판 적재용 카세트
KR20100008722A (ko) * 2008-07-16 2010-01-26 주식회사 테라세미콘 배치식 열처리 장치
KR20110000253A (ko) * 2009-06-26 2011-01-03 주식회사 티지솔라 기판 홀더

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4280481B2 (ja) * 2002-10-17 2009-06-17 タツモ株式会社 基板支持装置
JP2006005177A (ja) * 2004-06-17 2006-01-05 Tokyo Electron Ltd 熱処理装置
KR100829923B1 (ko) * 2006-08-30 2008-05-16 세메스 주식회사 스핀헤드 및 이를 이용하는 기판처리방법
KR101411620B1 (ko) * 2007-02-16 2014-06-25 엘아이지에이디피 주식회사 평판표시소자 제조장치의 로드 락 챔버
JP4898627B2 (ja) * 2007-10-19 2012-03-21 富士機械製造株式会社 回路基板支持装置および回路基板支持ピン
TWI508178B (zh) * 2008-07-16 2015-11-11 Tera Semicon Corp 批量式熱處理裝置
JP5218039B2 (ja) * 2008-12-26 2013-06-26 株式会社Ｓｕｍｃｏ 気相成長装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050094685A (ko) * 2004-03-24 2005-09-28 삼성전자주식회사 반도체 검사장치용 프로브 카드홀더
KR20060019777A (ko) * 2004-08-30 2006-03-06 삼성전자주식회사 기판 적재용 카세트
KR20100008722A (ko) * 2008-07-16 2010-01-26 주식회사 테라세미콘 배치식 열처리 장치
KR20110000253A (ko) * 2009-06-26 2011-01-03 주식회사 티지솔라 기판 홀더

Also Published As

Publication number Publication date
KR20120122795A (ko) 2012-11-07
JP2014512700A (ja) 2014-05-22
WO2012148237A3 (ko) 2013-01-10
CN103493195A (zh) 2014-01-01
WO2012148237A2 (ko) 2012-11-01

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