JP6006734B2 - 基板支持用ボートおよびこれを用いた支持ユニット - Google Patents
基板支持用ボートおよびこれを用いた支持ユニット Download PDFInfo
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- JP6006734B2 JP6006734B2 JP2013551915A JP2013551915A JP6006734B2 JP 6006734 B2 JP6006734 B2 JP 6006734B2 JP 2013551915 A JP2013551915 A JP 2013551915A JP 2013551915 A JP2013551915 A JP 2013551915A JP 6006734 B2 JP6006734 B2 JP 6006734B2
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- Prior art keywords
- support
- bar
- substrate
- boat
- board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6734—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders specially adapted for supporting large square shaped substrates
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
Description
Claims (10)
- 基板処理装置のチャンバに挿入され処理される基板を支持するボートであって、
互いに対向する一対のメインバーと、
前記一対のメインバーを互いに連結する複数の連結バーと、
前記メインバーに設けられ、前記基板が搭載支持される複数の第1の支持ピンとを含み、
前記メインバーの一端部側には、半円形状に形成されて相対物に係合支持されるアーク状支持片が設けられ、
前記メインバーの他端部側に位置する前記連結バーには、相対物に搭載支持される直線状支持片が設けられていることを特徴とする基板支持用ボート。 - 前記連結バーには、前記基板を支持する複数の第2支持ピンが設けられていることを特徴とする請求項1に記載の基板支持用ボート。
- 前記第1支持ピンおよび前記第2支持ピンは、前記メインバーおよび前記連結バーにそれぞれ着脱可能に結合されていることを特徴とする請求項2に記載の基板支持用ボート。
- 前記第1支持ピンおよび前記第2支持ピンの一側部位は、断面形状が円形、楕円形または角形の中から選択されたいずれか1つの形状に形成され、
前記メインバーおよび前記連結バーには、前記第1支持ピンの一側部位および前記第2支持ピンの一側部位がそれぞれ挿脱される第1結合溝および第2結合溝が、前記第1支持ピンおよび前記第2支持ピンの形状にそれぞれ対応して形成されていることを特徴とする請求項3に記載の基板支持用ボート。 - 前記連結バーは、
前記第2支持ピンが設けられて一対の前記メインバーの間に位置する水平バーと、
前記水平バーの両端部でそれぞれベンディング形成され、一対の前記メインバーのいずれか1つの前記メインバーと他の1つの前記メインバーにそれぞれ結合される結合バーを有し、前記メインバーの下側に位置することを特徴とする請求項2に記載の基板支持用ボート。 - 前記結合バーは、前記水平バーから複数回ベンディング形成されていることを特徴とする請求項5に記載の基板支持用ボート。
- 前記連結バーのうち、一部は互いに異なる間隔を有し、
互いに異なる間隔を有する前記連結バーに設けられた前記第2支持ピンは、中間部位がベンディングされて前記連結バーに回転可能に設けられ、
前記連結バーに設けられた前記第2支持ピンの一側部位および前記基板が支持される前記第2支持ピンの他側部位の長さ方向の中心をそれぞれ通る仮想の直線は、互いに平行であることを特徴とする請求項2に記載の基板支持用ボート。 - 前記第2支持ピンの中間部位は、複数回ベンディングされていることを特徴とする請求項7に記載の基板支持用ボート。
- 一対の前記メインバーの一端部側および他端部側には、前記基板の角部側を支持する第3支持ピンが設けられていることを特徴とする請求項1に記載の基板支持用ボート。
- 前記メインバーの両端部側には、ロボットのアームが係合係止される係止フックがそれぞれ設けられていることを特徴とする請求項1に記載の基板支持用ボート。
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20110010132 | 2011-02-01 | ||
KR10-2011-0010132 | 2011-02-01 | ||
KR10-2011-0030216 | 2011-04-01 | ||
KR1020110030216A KR101284105B1 (ko) | 2011-04-01 | 2011-04-01 | 기판 지지용 보트 |
PCT/KR2012/000714 WO2012105785A2 (ko) | 2011-02-01 | 2012-01-31 | 기판 지지용 보트 및 이를 사용한 지지유닛 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014511558A JP2014511558A (ja) | 2014-05-15 |
JP6006734B2 true JP6006734B2 (ja) | 2016-10-12 |
Family
ID=46603197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2013551915A Active JP6006734B2 (ja) | 2011-02-01 | 2012-01-31 | 基板支持用ボートおよびこれを用いた支持ユニット |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6006734B2 (ja) |
CN (1) | CN103392228B (ja) |
TW (1) | TWI600105B (ja) |
WO (1) | WO2012105785A2 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6362278B2 (ja) * | 2014-06-30 | 2018-07-25 | ウォンイク テラセミコン カンパニー リミテッド | ボート |
CN205608389U (zh) * | 2016-05-11 | 2016-09-28 | 重庆京东方光电科技有限公司 | 一种缓存装置及设有该缓存装置的涂胶显影机 |
CN106216317A (zh) * | 2016-08-10 | 2016-12-14 | 宁夏高创特能源科技有限公司 | 一种平面靶材清洗防护用模块化组合插片花篮 |
CN108103481B (zh) * | 2018-01-25 | 2023-07-18 | 无锡盈芯半导体科技有限公司 | 衬底自动挟式石英舟 |
CN208157378U (zh) * | 2018-04-09 | 2018-11-27 | 深圳市捷佳伟创新能源装备股份有限公司 | 一种pevcd卧式石墨舟结构 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3977481B2 (ja) * | 1997-04-11 | 2007-09-19 | 淀川ヒューテック株式会社 | 基板用トレイカセット |
JP3977491B2 (ja) * | 1997-07-16 | 2007-09-19 | 淀川ヒューテック株式会社 | 基板用カセット |
JP2001127147A (ja) * | 1999-10-27 | 2001-05-11 | Kanegafuchi Chem Ind Co Ltd | 熱処理用キャリア |
JP2001223262A (ja) * | 2000-02-07 | 2001-08-17 | Kanegafuchi Chem Ind Co Ltd | 熱処理用キャリア |
TWI242830B (en) * | 2002-07-15 | 2005-11-01 | Sharp Kk | Cartridge for substrate |
KR100600515B1 (ko) * | 2005-01-20 | 2006-07-13 | (주)상아프론테크 | 크로스바 설치용 연결구가 구비된 기판 적재용 카세트 |
CN100344513C (zh) * | 2005-03-04 | 2007-10-24 | 友达光电股份有限公司 | 基板搬运架 |
US7822324B2 (en) * | 2006-08-14 | 2010-10-26 | Applied Materials, Inc. | Load lock chamber with heater in tube |
JP4317883B2 (ja) * | 2007-04-18 | 2009-08-19 | 国立大学法人東北大学 | 支持ピンの製造方法、支持ピン、熱処理装置および基板焼成炉 |
KR101058187B1 (ko) * | 2008-12-05 | 2011-08-22 | 주식회사 에스에프에이 | 기판 보관용 카세트 시스템 |
-
2012
- 2012-01-31 WO PCT/KR2012/000714 patent/WO2012105785A2/ko active Application Filing
- 2012-01-31 JP JP2013551915A patent/JP6006734B2/ja active Active
- 2012-01-31 TW TW101103044A patent/TWI600105B/zh active
- 2012-01-31 CN CN201280010669.8A patent/CN103392228B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
WO2012105785A3 (ko) | 2012-11-29 |
WO2012105785A2 (ko) | 2012-08-09 |
CN103392228A (zh) | 2013-11-13 |
TW201243984A (en) | 2012-11-01 |
TWI600105B (zh) | 2017-09-21 |
JP2014511558A (ja) | 2014-05-15 |
CN103392228B (zh) | 2016-09-21 |
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