KR101293024B1 - 평판패널 제조장치 - Google Patents

평판패널 제조장치 Download PDF

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Publication number
KR101293024B1
KR101293024B1 KR1020110117311A KR20110117311A KR101293024B1 KR 101293024 B1 KR101293024 B1 KR 101293024B1 KR 1020110117311 A KR1020110117311 A KR 1020110117311A KR 20110117311 A KR20110117311 A KR 20110117311A KR 101293024 B1 KR101293024 B1 KR 101293024B1
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KR
South Korea
Prior art keywords
substrate
region
chamber
transfer
processed
Prior art date
Application number
KR1020110117311A
Other languages
English (en)
Korean (ko)
Other versions
KR20130052084A (ko
Inventor
이형배
조황신
안우정
송기철
Original Assignee
에스엔유 프리시젼 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에스엔유 프리시젼 주식회사 filed Critical 에스엔유 프리시젼 주식회사
Priority to KR1020110117311A priority Critical patent/KR101293024B1/ko
Priority to JP2012237278A priority patent/JP2013104131A/ja
Priority to TW101141229A priority patent/TW201318942A/zh
Priority to CN2012104482447A priority patent/CN103107132A/zh
Publication of KR20130052084A publication Critical patent/KR20130052084A/ko
Application granted granted Critical
Publication of KR101293024B1 publication Critical patent/KR101293024B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
KR1020110117311A 2011-11-11 2011-11-11 평판패널 제조장치 KR101293024B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020110117311A KR101293024B1 (ko) 2011-11-11 2011-11-11 평판패널 제조장치
JP2012237278A JP2013104131A (ja) 2011-11-11 2012-10-26 平板パネル製造装置
TW101141229A TW201318942A (zh) 2011-11-11 2012-11-07 製造平面顯示器之裝置
CN2012104482447A CN103107132A (zh) 2011-11-11 2012-11-09 用于制造平板显示器的设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110117311A KR101293024B1 (ko) 2011-11-11 2011-11-11 평판패널 제조장치

Publications (2)

Publication Number Publication Date
KR20130052084A KR20130052084A (ko) 2013-05-22
KR101293024B1 true KR101293024B1 (ko) 2013-08-05

Family

ID=48314884

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110117311A KR101293024B1 (ko) 2011-11-11 2011-11-11 평판패널 제조장치

Country Status (4)

Country Link
JP (1) JP2013104131A (zh)
KR (1) KR101293024B1 (zh)
CN (1) CN103107132A (zh)
TW (1) TW201318942A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150113489A (ko) * 2014-03-31 2015-10-08 주식회사 선익시스템 클러스터형 증착장치

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103789732A (zh) * 2014-02-13 2014-05-14 上海和辉光电有限公司 蒸镀机以及蒸镀方法
JP2016117915A (ja) * 2014-12-18 2016-06-30 キヤノントッキ株式会社 蒸着装置並びに蒸着方法
TWI643799B (zh) * 2017-12-01 2018-12-11 瑩耀科技股份有限公司 半導體輸送系統
JP7188973B2 (ja) * 2018-10-15 2022-12-13 キヤノントッキ株式会社 成膜装置、製造システム、有機ｅｌパネルの製造システム、成膜方法、及び有機ｅｌ素子の製造方法
CN112623700A (zh) * 2020-12-04 2021-04-09 深圳市韩安特科技有限公司 显示屏维修设备
CN113493097B (zh) * 2021-08-06 2023-05-02 超捷半导体设备(深圳)有限公司 基材的上下料装置及上料方法、下料方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070120556A (ko) * 2005-06-10 2007-12-24 어플라이드 머티어리얼스, 인코포레이티드 선형 진공 증착 시스템
KR20100028479A (ko) * 2008-09-04 2010-03-12 가부시키가이샤 히다치 하이테크놀로지즈 유기 ｅｌ 디바이스 제조 장치 및 유기 ｅｌ 디바이스 제조 방법 및 성막 장치 및 성막 방법
JP2010080228A (ja) * 2008-09-25 2010-04-08 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置及び成膜装置並びにシャドウマスク交換装置及び同交換方法
KR20100132517A (ko) * 2008-03-05 2010-12-17 어플라이드 머티어리얼스, 인코포레이티드 회전 모듈을 갖는 코팅 장치

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW466622B (en) * 1996-09-11 2001-12-01 Hitachi Ltd Operating method of vacuum processing device and vacuum processing device
CN1163953C (zh) * 2000-12-11 2004-08-25 矽品精密工业股份有限公司 可防止溢胶的基板式半导体装置封装方法
JP4538650B2 (ja) * 2004-06-18 2010-09-08 京セラ株式会社 蒸着装置
CN101667630A (zh) * 2008-09-04 2010-03-10 株式会社日立高新技术 有机el设备制造装置和其制造方法以及成膜装置和成膜方法
KR100980706B1 (ko) * 2008-09-19 2010-09-08 세메스 주식회사 기판 이송 장치, 이를 갖는 기판 처리 장치 및 이의 기판 이송 방법
JP5694679B2 (ja) * 2009-05-04 2015-04-01 三星ディスプレイ株式會社Ｓａｍｓｕｎｇ Ｄｉｓｐｌａｙ Ｃｏ．，Ｌｔｄ． 有機物蒸着装置及び蒸着方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20070120556A (ko) * 2005-06-10 2007-12-24 어플라이드 머티어리얼스, 인코포레이티드 선형 진공 증착 시스템
KR20100132517A (ko) * 2008-03-05 2010-12-17 어플라이드 머티어리얼스, 인코포레이티드 회전 모듈을 갖는 코팅 장치
KR20100028479A (ko) * 2008-09-04 2010-03-12 가부시키가이샤 히다치 하이테크놀로지즈 유기 ｅｌ 디바이스 제조 장치 및 유기 ｅｌ 디바이스 제조 방법 및 성막 장치 및 성막 방법
JP2010080228A (ja) * 2008-09-25 2010-04-08 Hitachi High-Technologies Corp 有機ｅｌデバイス製造装置及び成膜装置並びにシャドウマスク交換装置及び同交換方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20150113489A (ko) * 2014-03-31 2015-10-08 주식회사 선익시스템 클러스터형 증착장치
KR102150452B1 (ko) 2014-03-31 2020-09-01 주식회사 선익시스템 클러스터형 증착장치

Also Published As

Publication number Publication date
CN103107132A (zh) 2013-05-15
JP2013104131A (ja) 2013-05-30
TW201318942A (zh) 2013-05-16
KR20130052084A (ko) 2013-05-22

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