KR101254042B1 - 기판 위에 배치된 고형화된 층으로부터 주형을 분리하는방법 - Google Patents

기판 위에 배치된 고형화된 층으로부터 주형을 분리하는방법 Download PDF

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KR101254042B1
KR101254042B1 KR1020077019969A KR20077019969A KR101254042B1 KR 101254042 B1 KR101254042 B1 KR 101254042B1 KR 1020077019969 A KR1020077019969 A KR 1020077019969A KR 20077019969 A KR20077019969 A KR 20077019969A KR 101254042 B1 KR101254042 B1 KR 101254042B1
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KR
South Korea
Prior art keywords
substrate
template
force
vacuum
applying
Prior art date
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KR1020077019969A
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English (en)
Korean (ko)
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KR20070102723A (ko
Inventor
병진 최
앤쉬맨 체라라
영준 최
마리오 제이. 메이슬
시들가타 브이. 스리니바산
노만 이. 슈마커
차오밍 루
이안 엠. 맥마킨
다니엘 에이. 밥스
Original Assignee
몰레큘러 임프린츠 인코퍼레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Priority claimed from US11/047,428 external-priority patent/US7798801B2/en
Priority claimed from US11/047,499 external-priority patent/US7636999B2/en
Application filed by 몰레큘러 임프린츠 인코퍼레이티드 filed Critical 몰레큘러 임프린츠 인코퍼레이티드
Publication of KR20070102723A publication Critical patent/KR20070102723A/ko
Application granted granted Critical
Publication of KR101254042B1 publication Critical patent/KR101254042B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020077019969A 2005-01-31 2006-01-12 기판 위에 배치된 고형화된 층으로부터 주형을 분리하는방법 KR101254042B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US11/047,428 2005-01-31
US11/047,428 US7798801B2 (en) 2005-01-31 2005-01-31 Chucking system for nano-manufacturing
US11/047,499 2005-01-31
US11/047,499 US7636999B2 (en) 2005-01-31 2005-01-31 Method of retaining a substrate to a wafer chuck
US11/108,208 2005-04-18
US11/108,208 US7635445B2 (en) 2005-01-31 2005-04-18 Method of separating a mold from a solidified layer disposed on a substrate
PCT/US2006/001160 WO2006083520A2 (fr) 2005-01-31 2006-01-12 Procede de separation de moule depuis une couche solidifiee etablie sur un substrat

Publications (2)

Publication Number Publication Date
KR20070102723A KR20070102723A (ko) 2007-10-19
KR101254042B1 true KR101254042B1 (ko) 2013-04-12

Family

ID=36777728

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077019969A KR101254042B1 (ko) 2005-01-31 2006-01-12 기판 위에 배치된 고형화된 층으로부터 주형을 분리하는방법

Country Status (4)

Country Link
EP (1) EP1843884A4 (fr)
KR (1) KR101254042B1 (fr)
TW (2) TWI277504B (fr)
WO (3) WO2006083520A2 (fr)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4773729B2 (ja) * 2005-02-28 2011-09-14 キヤノン株式会社 転写装置およびデバイス製造方法
JP5069979B2 (ja) * 2007-09-03 2012-11-07 東芝機械株式会社 離型装置、給排システムおよび離型方法
WO2010005032A1 (fr) * 2008-07-09 2010-01-14 東洋合成工業株式会社 Procédé de formation de motif
JP5438578B2 (ja) 2010-03-29 2014-03-12 富士フイルム株式会社 微細凹凸パターンの形成方法及び形成装置
JP4774125B2 (ja) * 2010-10-04 2011-09-14 キヤノン株式会社 転写装置、型、および、デバイス製造方法
JP6333031B2 (ja) * 2014-04-09 2018-05-30 キヤノン株式会社 インプリント装置および物品の製造方法
JP6659104B2 (ja) * 2014-11-11 2020-03-04 キヤノン株式会社 インプリント方法、インプリント装置、型、および物品の製造方法
US10620532B2 (en) * 2014-11-11 2020-04-14 Canon Kabushiki Kaisha Imprint method, imprint apparatus, mold, and article manufacturing method
JP7284639B2 (ja) 2019-06-07 2023-05-31 キヤノン株式会社 成形装置、および物品製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020036852A (ko) * 1999-09-10 2002-05-16 피터 엔. 데트킨 고전압 및 저전압 버스용 출력 버퍼

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DE3110341C2 (de) * 1980-03-19 1983-11-17 Hitachi, Ltd., Tokyo Verfahren und Vorrichtung zum Ausrichten eines dünnen Substrats in der Bildebene eines Kopiergerätes
US4506184A (en) * 1984-01-10 1985-03-19 Varian Associates, Inc. Deformable chuck driven by piezoelectric means
JPH06244269A (ja) * 1992-09-07 1994-09-02 Mitsubishi Electric Corp 半導体製造装置並びに半導体製造装置におけるウエハ真空チャック装置及びガスクリーニング方法及び窒化膜形成方法
US5900062A (en) * 1995-12-28 1999-05-04 Applied Materials, Inc. Lift pin for dechucking substrates
US6304424B1 (en) * 1998-04-03 2001-10-16 Applied Materials Inc. Method and apparatus for minimizing plasma destabilization within a semiconductor wafer processing system
US6965506B2 (en) * 1998-09-30 2005-11-15 Lam Research Corporation System and method for dechucking a workpiece from an electrostatic chuck
US6160430A (en) * 1999-03-22 2000-12-12 Ati International Srl Powerup sequence artificial voltage supply circuit
EP1077393A2 (fr) * 1999-08-19 2001-02-21 Canon Kabushiki Kaisha Système d'attraction et de maintien d'un substrat pour utiliser dans un appareil d'exposition
CA2393037C (fr) * 1999-12-01 2008-07-15 Nokia Corporation Fonction de portail de reseau pour reseau prive virtuel
EP2264522A3 (fr) * 2000-07-16 2011-12-14 The Board of Regents of The University of Texas System Procédé de formation d'un motif sur un substrat
US6898064B1 (en) * 2001-08-29 2005-05-24 Lsi Logic Corporation System and method for optimizing the electrostatic removal of a workpiece from a chuck
JP4639081B2 (ja) * 2002-05-27 2011-02-23 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ スタンプから基板にパターンを転写する方法及び装置
US6951173B1 (en) * 2003-05-14 2005-10-04 Molecular Imprints, Inc. Assembly and method for transferring imprint lithography templates
US6879191B2 (en) * 2003-08-26 2005-04-12 Intel Corporation Voltage mismatch tolerant input/output buffer
US7023238B1 (en) * 2004-01-07 2006-04-04 Altera Corporation Input buffer with selectable threshold and hysteresis option

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Publication number Priority date Publication date Assignee Title
KR20020036852A (ko) * 1999-09-10 2002-05-16 피터 엔. 데트킨 고전압 및 저전압 버스용 출력 버퍼

Also Published As

Publication number Publication date
WO2006083520A3 (fr) 2009-05-14
WO2006083519A2 (fr) 2006-08-10
KR20070102723A (ko) 2007-10-19
TWI277504B (en) 2007-04-01
EP1843884A4 (fr) 2008-12-17
TW200633846A (en) 2006-10-01
WO2006083518A3 (fr) 2007-03-29
WO2006083518A2 (fr) 2006-08-10
WO2006083520A2 (fr) 2006-08-10
TWI291212B (en) 2007-12-11
EP1843884A2 (fr) 2007-10-17
TW200633114A (en) 2006-09-16
WO2006083519A3 (fr) 2009-04-23

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