EP1843884A2 - Systeme de mandrin destine a la nano-fabrication - Google Patents

Systeme de mandrin destine a la nano-fabrication

Info

Publication number
EP1843884A2
EP1843884A2 EP06718240A EP06718240A EP1843884A2 EP 1843884 A2 EP1843884 A2 EP 1843884A2 EP 06718240 A EP06718240 A EP 06718240A EP 06718240 A EP06718240 A EP 06718240A EP 1843884 A2 EP1843884 A2 EP 1843884A2
Authority
EP
European Patent Office
Prior art keywords
pins
passageway
fluid
subset
throughway
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP06718240A
Other languages
German (de)
English (en)
Other versions
EP1843884A4 (fr
Inventor
Daniel A. Babbs
Byung-Jin Choi
Anshuman Cherala
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Nanotechnologies Inc
Original Assignee
Molecular Imprints Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US11/047,499 external-priority patent/US7636999B2/en
Priority claimed from US11/047,428 external-priority patent/US7798801B2/en
Application filed by Molecular Imprints Inc filed Critical Molecular Imprints Inc
Publication of EP1843884A2 publication Critical patent/EP1843884A2/fr
Publication of EP1843884A4 publication Critical patent/EP1843884A4/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
    • B25B11/00—Work holders not covered by any preceding group in the subclass, e.g. magnetic work holders, vacuum work holders
    • B25B11/005—Vacuum work holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Nanotechnology (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Mathematical Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)

Abstract

La présente invention concerne un système de mandrin qui comprend, entre autres, un corps présentant une surface depuis laquelle s'étend une broche comportant un passage défini dans cette dernière et une plage entourant les parties saillantes définissant un passage entre la broche et la plage. Dans une autre forme de réalisation, le corps comprend une pluralité de parties saillantes.
EP06718240A 2005-01-31 2006-01-12 Systeme de mandrin destine a la nano-fabrication Pending EP1843884A4 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US11/047,499 US7636999B2 (en) 2005-01-31 2005-01-31 Method of retaining a substrate to a wafer chuck
US11/047,428 US7798801B2 (en) 2005-01-31 2005-01-31 Chucking system for nano-manufacturing
US11/108,208 US7635445B2 (en) 2005-01-31 2005-04-18 Method of separating a mold from a solidified layer disposed on a substrate
PCT/US2006/001145 WO2006083518A2 (fr) 2005-01-31 2006-01-12 Systeme de mandrin destine a la nano-fabrication

Publications (2)

Publication Number Publication Date
EP1843884A2 true EP1843884A2 (fr) 2007-10-17
EP1843884A4 EP1843884A4 (fr) 2008-12-17

Family

ID=36777728

Family Applications (1)

Application Number Title Priority Date Filing Date
EP06718240A Pending EP1843884A4 (fr) 2005-01-31 2006-01-12 Systeme de mandrin destine a la nano-fabrication

Country Status (4)

Country Link
EP (1) EP1843884A4 (fr)
KR (1) KR101254042B1 (fr)
TW (2) TWI291212B (fr)
WO (3) WO2006083520A2 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9272462B2 (en) 2010-03-29 2016-03-01 Fujifilm Corporation Minute convexo-concave pattern forming method and forming device, and transfer substrate producing method and transfer substrate

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4773729B2 (ja) 2005-02-28 2011-09-14 キヤノン株式会社 転写装置およびデバイス製造方法
JP5069979B2 (ja) * 2007-09-03 2012-11-07 東芝機械株式会社 離型装置、給排システムおよび離型方法
WO2010005032A1 (fr) * 2008-07-09 2010-01-14 東洋合成工業株式会社 Procédé de formation de motif
JP4774125B2 (ja) * 2010-10-04 2011-09-14 キヤノン株式会社 転写装置、型、および、デバイス製造方法
JP6333031B2 (ja) 2014-04-09 2018-05-30 キヤノン株式会社 インプリント装置および物品の製造方法
JP6659104B2 (ja) * 2014-11-11 2020-03-04 キヤノン株式会社 インプリント方法、インプリント装置、型、および物品の製造方法
US10620532B2 (en) 2014-11-11 2020-04-14 Canon Kabushiki Kaisha Imprint method, imprint apparatus, mold, and article manufacturing method
JP7284639B2 (ja) 2019-06-07 2023-05-31 キヤノン株式会社 成形装置、および物品製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534073A (en) * 1992-09-07 1996-07-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor producing apparatus comprising wafer vacuum chucking device
WO2003099463A2 (fr) * 2002-05-27 2003-12-04 Koninklijke Philips Electronics N.V. Procede et systeme de transfert d'un motif d'une surface d'estampage vers un substrat
US20040036850A1 (en) * 1999-08-19 2004-02-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3110341C2 (de) * 1980-03-19 1983-11-17 Hitachi, Ltd., Tokyo Verfahren und Vorrichtung zum Ausrichten eines dünnen Substrats in der Bildebene eines Kopiergerätes
US4506184A (en) * 1984-01-10 1985-03-19 Varian Associates, Inc. Deformable chuck driven by piezoelectric means
US5900062A (en) * 1995-12-28 1999-05-04 Applied Materials, Inc. Lift pin for dechucking substrates
US6304424B1 (en) * 1998-04-03 2001-10-16 Applied Materials Inc. Method and apparatus for minimizing plasma destabilization within a semiconductor wafer processing system
US6965506B2 (en) * 1998-09-30 2005-11-15 Lam Research Corporation System and method for dechucking a workpiece from an electrostatic chuck
US6160430A (en) * 1999-03-22 2000-12-12 Ati International Srl Powerup sequence artificial voltage supply circuit
US6512401B2 (en) * 1999-09-10 2003-01-28 Intel Corporation Output buffer for high and low voltage bus
AU1507200A (en) * 1999-12-01 2001-06-12 Nokia Corporation Providing gateway functionality in a virtual private network
EP1303792B1 (fr) * 2000-07-16 2012-10-03 Board Of Regents, The University Of Texas System Procedes d'alignement de superpositions a haute resolution et systemes de lithographie de surimpression
US6898064B1 (en) * 2001-08-29 2005-05-24 Lsi Logic Corporation System and method for optimizing the electrostatic removal of a workpiece from a chuck
US6951173B1 (en) * 2003-05-14 2005-10-04 Molecular Imprints, Inc. Assembly and method for transferring imprint lithography templates
US6879191B2 (en) * 2003-08-26 2005-04-12 Intel Corporation Voltage mismatch tolerant input/output buffer
US7023238B1 (en) * 2004-01-07 2006-04-04 Altera Corporation Input buffer with selectable threshold and hysteresis option

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5534073A (en) * 1992-09-07 1996-07-09 Mitsubishi Denki Kabushiki Kaisha Semiconductor producing apparatus comprising wafer vacuum chucking device
US20040036850A1 (en) * 1999-08-19 2004-02-26 Canon Kabushiki Kaisha Substrate attracting and holding system for use in exposure apparatus
WO2003099463A2 (fr) * 2002-05-27 2003-12-04 Koninklijke Philips Electronics N.V. Procede et systeme de transfert d'un motif d'une surface d'estampage vers un substrat

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2006083518A2 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9272462B2 (en) 2010-03-29 2016-03-01 Fujifilm Corporation Minute convexo-concave pattern forming method and forming device, and transfer substrate producing method and transfer substrate

Also Published As

Publication number Publication date
TW200633846A (en) 2006-10-01
WO2006083518A3 (fr) 2007-03-29
WO2006083519A3 (fr) 2009-04-23
KR20070102723A (ko) 2007-10-19
TWI277504B (en) 2007-04-01
WO2006083519A2 (fr) 2006-08-10
EP1843884A4 (fr) 2008-12-17
WO2006083520A3 (fr) 2009-05-14
WO2006083518A2 (fr) 2006-08-10
TWI291212B (en) 2007-12-11
WO2006083520A2 (fr) 2006-08-10
TW200633114A (en) 2006-09-16
KR101254042B1 (ko) 2013-04-12

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Legal Events

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PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

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Effective date: 20070827

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Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LI LT LU LV MC NL PL PT RO SE SI SK TR

AX Request for extension of the european patent

Extension state: AL BA HR MK YU

RIN1 Information on inventor provided before grant (corrected)

Inventor name: CHERALA, ANSHUMAN

Inventor name: CHOI, BYUNG-JIN

Inventor name: BABBS, DANIEL, A.

DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20081119

RIC1 Information provided on ipc code assigned before grant

Ipc: B28B 11/08 20060101ALI20081113BHEP

Ipc: G03F 7/00 20060101AFI20081113BHEP

STAA Information on the status of an ep patent application or granted ep patent

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